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LV766106F

Onsemi

LV766106F by Onsemi

LV766106F by Onsemi is a color signal converter with 64 terminals, operating at temperatures from -10 to 65 °C. It requires a 5V power supply and has a max supply current of 35mA. This IC is commonly used in applications requiring color signal conversion.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 967 parts In-Stock

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Digiode

USA . 478 parts In-Stock

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TANS Electronics

Latvia . 3,706 parts In-Stock

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SupplyDigital Components

Austria . 3,245 parts In-Stock

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Problanco Electronics

Mexico . 1,713 parts In-Stock

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Kulean Microsystems

USA . 677 parts In-Stock

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Corphita

USA . 354 parts In-Stock

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Corohmni

South Africa . 140 parts In-Stock

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UHIMA Technologies

Türkiye . 57 parts In-Stock

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Overview

Enhance the color and clarity of your electronic displays with the LV766106F by Onsemi. Crafted with precision and innovation, this color signal converter offers unparalleled quality and reliability. Ideal for a wide range of applications, this product delivers superior performance and efficiency. Elevate your visuals and bring your projects to life with the LV766106F. Unlock endless possibilities and experience the ultimate in display technology with Onsemi's cutting-edge solutions. Choose excellence, choose Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body material makes the product lightweight and durable for easy handling and long-term use.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and integration into various systems or setups.

General IC Type: COLOR SIGNAL CONVERTER

The specific IC type ensures efficient conversion of color signals for high-quality output.

Power Supplies (V): 5

The 5V power supply requirement allows for compatibility with standard power sources, making it easy to power up the device.

No. of Terminals: 64

The high number of terminals offers a wide range of connectivity options, allowing for versatile applications and setups.

Maximum Operating Temperature: 65 °C

With a maximum operating temperature of 65 °C, the product can withstand normal operating conditions without overheating.

Minimum Operating Temperature: -10 °C

The minimum operating temperature of -10 °C ensures the product can also function in colder environments without issues.

Terminal Position: DUAL

The dual terminal position provides redundancy and flexibility in connection options, ensuring reliable performance.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that the product is suitable for standard commercial applications, offering consistent performance.

Terminal Form: THROUGH-HOLE

The through-hole terminal form makes it easy to solder and secure connections, ensuring stable electrical contact.

Maximum Supply Current: 35 mA

The maximum supply current of 35 mA indicates low power consumption, making the product energy-efficient and cost-effective.

Terminal Pitch: 1.78 mm

The small terminal pitch of 1.78 mm allows for compact design and efficient use of board space in the system.

Technical Specifications

Color Signal Converters LV766106F attributes and parameters. Explore more Color Signal Converters devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T64

No. of Terminals:

64

Maximum Operating Temperature:

65 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP64,.6

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

35 mA

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.78 mm

Terminal Position:

DUAL

Trade Compliance

LV766106F General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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