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TVP5022

Texas Instruments

TVP5022 by Texas Instruments

TVP5022 by Texas Instruments is a color signal decoder with 80 terminals in a square package. It operates b/w 0-70°C, requires 4.75-5.25V supply voltage, and draws a max of 405mA current. Ideal for applications requiring precise color signal conversion in commercial temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,784 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,784

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Vyrian

USA . 950 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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950

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 888 parts In-Stock

1+ parts

$0.524

100+ parts

-

1k+ parts

$1.637

10k+ parts

-

888

$0.524

-

$1.637

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ChromeModa Solutions

Germany . 4,663 parts In-Stock

1+ parts

$0.589

100+ parts

$0.483

1k+ parts

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10k+ parts

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4,663

$0.589

$0.483

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IDEA Electronic Components Group

UK . 1,517 parts In-Stock

1+ parts

$0.589

100+ parts

-

1k+ parts

$0.530

10k+ parts

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1,517

$0.589

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$0.530

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One Stop Electronics

USA . 891 parts In-Stock

1+ parts

$7.800

100+ parts

-

1k+ parts

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10k+ parts

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891

$7.800

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AZTECH Wire

Italy . 449 parts In-Stock

1+ parts

$19.057

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449

$19.057

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Corphita

USA . 4,442 parts In-Stock

1+ parts

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4,442

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DigiPath Technology Company

USA . 1,007 parts In-Stock

1+ parts

-

100+ parts

$0.531

1k+ parts

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1,007

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$0.531

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Overview

Unlock a world of vibrant colors and crystal-clear images with the TVP5022 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments has crafted this color signal converter to deliver unparalleled quality and performance. Ideal for a wide range of applications, this versatile decoder offers customers unmatched value, benefits, and advantages. Experience the difference with the TVP5022 and elevate your viewing experience to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or stationary applications.

Surface Mount: YES

The surface mount design allows for easy installation on circuit boards, saving space and simplifying assembly.

Package Shape: SQUARE

The square package shape provides a compact footprint, making it suitable for applications where space is limited.

General IC Type: COLOR SIGNAL DECODER

As a color signal decoder, this product is designed to accurately decode and process color signals, ensuring high-quality image output.

No. of Terminals: 80

With 80 terminals, this product offers ample connectivity options for various input and output signals.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The flatpack, thin profile, and fine pitch design contribute to a low profile and efficient layout, allowing for space-saving in electronic devices.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in environments with elevated temperatures.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows the product to function effectively in a wide range of temperature conditions.

Terminal Position: QUAD

The quad terminal position enables secure and stable connections, preventing signal interruptions.

Maximum Seated Height: 1.2 mm

The low maximum seated height contributes to a slim profile, making it suitable for applications requiring a compact design.

Width: 12 mm

The 12mm width offers a balance between compactness and ease of installation in various electronic devices.

Minimum Supply Voltage (Vsup): 4.75 V

The low minimum supply voltage allows the product to operate efficiently with minimal power consumption.

Length: 12 mm

The 12mm length complements the width, providing a square form factor ideal for space-constrained applications.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures compatibility with standard operating temperature ranges in commercial applications.

Terminal Form: GULL WING

The gull wing terminal form offers secure soldering connections and ease of installation on circuit boards.

Maximum Supply Current: 405 mA

The high maximum supply current capability supports stable operation with various input signals.

Terminal Pitch: 0.5 mm

The fine 0.5mm terminal pitch allows for dense packing of terminals, maximizing connectivity in a compact form factor.

Maximum Supply Voltage (Vsup): 5.25 V

The high maximum supply voltage ensures compatibility with various power sources, offering flexibility in installation.

Technical Specifications

Color Signal Converters TVP5022 attributes and parameters. Explore more Color Signal Converters devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 3V TO 3.6V DIGITAL SUPPLY

General IC Type:

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

405 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Trade Compliance

TVP5022 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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