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TVP5020CPFP

Texas Instruments

TVP5020CPFP by Texas Instruments

TVP5020CPFP by Texas Instruments is a color signal decoder with 80 terminals in a square package. It operates b/w 0-70°C, requires 4.75-5.25V supply voltage, and draws up to 405mA current. Ideal for applications requiring precise color signal conversion in compact setups.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Q Components

USA . 14,633 parts In-Stock

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Vyrian

USA . 4,952 parts In-Stock

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Digiode

USA . 937 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 364 parts In-Stock

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Bristol Electronics

USA . 364 parts In-Stock

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Dan-Mar Components

USA . 364 parts In-Stock

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Parana Technologies

USA . 1,107 parts In-Stock

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$3.497

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$324.732

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$3.147

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DigiPath Technology Company

USA . 1,867 parts In-Stock

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$3.850

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ChromeModa Solutions

Germany . 5,003 parts In-Stock

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$3.929

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$3.222

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IDEA Electronic Components Group

UK . 1,792 parts In-Stock

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$3.929

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$3.536

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One Stop Electronics

USA . 932 parts In-Stock

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$11.800

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AZTECH Wire

Italy . 233 parts In-Stock

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$14.176

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Kepictronics

USA . 13,986 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,089 parts In-Stock

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Corphita

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Overview

Elevate your viewing experience with the TVP5020CPFP by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability in their products. The TVP5020CPFP falls under the category of Color Signal Converters, offering a wide range of applications for video processing and signal decoding. With its advanced technology and superior performance, this product guarantees seamless integration and exceptional results. Choose the TVP5020CPFP for unmatched value, benefits, and advantages that will elevate your visual experience to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this product durable and lightweight, allowing for easy handling and transportation.

Surface Mount: YES

Being surface mountable, this product can be easily integrated into various electronic devices and circuit boards, saving space and simplifying the manufacturing process.

Package Shape: SQUARE

The square package shape of this product ensures easy and secure mounting, making it suitable for compact designs and improving overall stability.

General IC Type: COLOR SIGNAL DECODER

The color signal decoder type of IC ensures accurate and reliable conversion of color signals, making this product ideal for applications that require precise color processing.

No. of Terminals: 80

With 80 terminals, this product offers a high level of connectivity and compatibility with various systems, allowing for versatile integration and functionality.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The combination of flatpack, heat sink/slug, thin profile, and fine pitch package styles enhances the thermal performance, space efficiency, and overall design flexibility of this product.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliable performance in a wide range of environmental conditions, making this product suitable for various industries and applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures that this product can function effectively even in cold environments, enhancing its versatility and reliability.

Terminal Position: QUAD

The quad terminal position of this product facilitates easy and secure connections, improving overall installation efficiency and ensuring stable performance.

Maximum Seated Height: 1.2 mm

With a maximum seated height of 1.2mm, this product can be easily accommodated in compact spaces, making it suitable for designs with limited vertical clearance.

Width: 12 mm

The 12mm width of this product allows for space-efficient placement and integration, enabling easy incorporation into various electronic systems and devices.

Minimum Supply Voltage (Vsup): 4.75 V

The low minimum supply voltage requirement of 4.75V ensures efficient power consumption and compatibility with a wide range of power sources, making this product energy-efficient.

Length: 12 mm

The 12mm length of this product contributes to its compact form factor, enabling easy installation and integration into space-constrained applications.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures that this product meets industry standards for temperature tolerance and performance, making it suitable for commercial applications.

Terminal Form: GULL WING

The gull wing terminal form of this product enhances solder joint strength and overall reliability, ensuring secure electrical connections and long-term performance.

Maximum Supply Current: 405 mA

With a maximum supply current of 405mA, this product can support high-power consumption devices and circuits, making it suitable for demanding applications.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch of this product allows for fine-pitch connections, enabling high-density mounting and space-saving designs in electronic systems.

Maximum Supply Voltage (Vsup): 5.25 V

The maximum supply voltage of 5.25V provides flexibility in power input options and ensures compatibility with a wide range of voltage sources, enhancing the versatility of this product.

Technical Specifications

Color Signal Converters TVP5020CPFP attributes and parameters. Explore more Color Signal Converters devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 3.3V DIGITAL SUPPLY

General IC Type:

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

405 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Trade Compliance

TVP5020CPFP General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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