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TVP5150AM1IPBSRQ

Texas Instruments

TVP5150AM1IPBSRQ by Texas Instruments

TVP5150AM1IPBSRQ by Texas Instruments is a color signal decoder with 32 terminals, operating voltage of 1.8-3.3V, and temperature range of -40 to 85°C. It is used in industrial applications requiring color signal conversion in a compact square package with gull wing terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,102 parts In-Stock

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5,102

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Digiode

USA . 1,712 parts In-Stock

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1,712

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 46 parts In-Stock

1+ parts

$2.453

100+ parts

-

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46

$2.453

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Parana Technologies

USA . 1,439 parts In-Stock

1+ parts

$3.074

100+ parts

-

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$3.589

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1,439

$3.074

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$3.589

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DigiPath Technology Company

USA . 1,322 parts In-Stock

1+ parts

$3.385

100+ parts

$3.114

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1,322

$3.385

$3.114

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ChromeModa Solutions

Germany . 1,376 parts In-Stock

1+ parts

$3.454

100+ parts

$2.832

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1,376

$3.454

$2.832

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IDEA Electronic Components Group

UK . 193 parts In-Stock

1+ parts

$3.454

100+ parts

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$3.109

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193

$3.454

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$3.109

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One Stop Electronics

USA . 1,035 parts In-Stock

1+ parts

$3.800

100+ parts

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1,035

$3.800

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AZTECH Wire

Italy . 750 parts In-Stock

1+ parts

$13.779

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750

$13.779

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Ampacity Inc.

Singapore . 1,050 parts In-Stock

1+ parts

$13.800

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1,050

$13.800

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Semicontronic

India . 1,176 parts In-Stock

1+ parts

$18.800

100+ parts

$18.330

1k+ parts

$18.236

10k+ parts

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1,176

$18.800

$18.330

$18.236

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Continental Prestige Electronics

USA . 5,008 parts In-Stock

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5,008

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Corphita

USA . 2,610 parts In-Stock

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2,610

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Argo Parts USA

USA . 1,557 parts In-Stock

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1,557

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Microchip USA

USA . 101 parts In-Stock

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101

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Experience vibrant and true-to-life colors with the TVP5150AM1IPBSRQ color signal converter by Texas Instruments. Known for their high-quality products, Texas Instruments delivers a cutting-edge solution that is perfect for a wide range of applications. This innovative device offers customers unparalleled value, benefits, and advantages, making it an essential component for any project requiring exceptional color decoding capabilities. Elevate your visuals with the TVP5150AM1IPBSRQ and see the difference it can make in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the internal components of the converter.

Surface Mount: YES

Surface mount capability allows for easy mounting on circuit boards, saving space and simplifying assembly.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards for automotive applications.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the circuit board.

General IC Type: COLOR SIGNAL DECODER

Color signal decoder functionality enables accurate conversion and processing of color signals.

Power Supplies (V): 1.8,3.3

Support for multiple power supply options provides flexibility in different application scenarios.

No. of Terminals: 32

High number of terminals allow for connectivity with various other components in the system.

Package Style: FLATPACK, THIN PROFILE, FINE PITCH

Multiple package style options enable compatibility with different board layouts and design requirements.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliable performance in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures functionality even in extreme cold conditions.

Terminal Position: QUAD

Quad terminal position allows for efficient soldering and connection stability.

Maximum Seated Height: 1.2 mm

Low maximum seated height enables a compact design and facilitates installation in tight spaces.

Width: 5 mm

Compact width dimension saves space on the board and supports overall system miniaturization.

Minimum Supply Voltage (Vsup): 1.65 V

Low minimum supply voltage requirement ensures compatibility with a wide range of power sources.

Length: 5 mm

Short length dimension contributes to a space-efficient design and easy integration into the overall system.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in demanding industrial environments.

Terminal Form: GULL WING

Gull wing terminal form enables secure soldering and connection with the circuit board.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and precise connection with other components.

Maximum Supply Voltage (Vsup): 1.95 V

Moderate maximum supply voltage tolerance ensures safe operation and protection against overvoltage situations.

Technical Specifications

Color Signal Converters TVP5150AM1IPBSRQ attributes and parameters. Explore more Color Signal Converters devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G32

Length:

5 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP32,.28SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Sub-Category:

Color Signal Converters

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.65 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

TVP5150AM1IPBSRQ General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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