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TVP5146PFPRG4

Texas Instruments

TVP5146PFPRG4 by Texas Instruments

TVP5146PFPRG4 by Texas Instruments is a color signal decoder with 80 terminals, operating voltage of 1.8-3.3V, and temperature range of 0-70°C. It is used in applications requiring color signal conversion in compact spaces due to its thin profile and small package size.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,794 parts In-Stock

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Digiode

USA . 3,721 parts In-Stock

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3,721

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Distributors (Availability)

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Parana Technologies

USA . 236 parts In-Stock

1+ parts

$1.063

100+ parts

-

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$1.918

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236

$1.063

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$1.918

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DigiPath Technology Company

USA . 1,832 parts In-Stock

1+ parts

$1.170

100+ parts

$1.077

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1,832

$1.170

$1.077

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ChromeModa Solutions

Germany . 1,004 parts In-Stock

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$1.194

100+ parts

$0.979

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1,004

$1.194

$0.979

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IDEA Electronic Components Group

UK . 269 parts In-Stock

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$1.194

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$1.075

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269

$1.194

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$1.075

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One Stop Electronics

USA . 558 parts In-Stock

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$9.800

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558

$9.800

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AZTECH Wire

Italy . 756 parts In-Stock

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$9.918

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756

$9.918

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A-Z Elektronik GmbH

Germany . 5,424 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Corphita

USA . 1,073 parts In-Stock

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1,073

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Overview

Unlock the power of vibrant colors with the TVP5146PFPRG4 by Texas Instruments. This high-quality color signal converter offers unparalleled performance and reliability, backed by the trusted name of Texas Instruments. Ideal for a range of applications, this product brings value and benefits to customers looking for superior color decoding capabilities. Say goodbye to dull visuals and hello to crisp, vivid images with the TVP5146PFPRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface mount technology allows for easy installation and replacement of the product on circuit boards.

Package Shape: SQUARE

Square package shape ensures efficient use of space on the circuit board, making the product compact and easy to integrate.

General IC Type: COLOR SIGNAL DECODER

Being a color signal decoder, this product is designed specifically for decoding color signals accurately, ensuring high-quality video output.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages allows flexibility in different circuit designs and compatibility with a variety of systems.

No. of Terminals: 80

Having 80 terminals enables connectivity with multiple components and peripherals, expanding the product's functionality.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The various package styles offer versatility in mounting options and heat dissipation, catering to different design requirements.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliability and stability of the product even under demanding conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows the product to function effectively in various environmental conditions, from cold to hot.

Terminal Position: QUAD

Quad terminal position facilitates easy connection and disconnection of the product, simplifying installation and maintenance.

Maximum Seated Height: 1.2 mm

Low maximum seated height helps in space-saving and ensures compatibility with compact electronic devices.

Width: 12 mm

Compact width size makes the product suitable for applications where space is limited, without compromising on performance.

Minimum Supply Voltage (Vsup): 1.65 V

Low minimum supply voltage requirement ensures energy efficiency and extends the product's battery life in portable devices.

Length: 12 mm

Short length size contributes to the overall compactness of the product, making it ideal for space-constrained applications.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grade means the product meets industry standards for reliability and performance in typical operating environments.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable connections, ensuring stable operation and ease of soldering during assembly.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density packaging and precise connections, essential for complex circuitry and miniaturized designs.

Maximum Supply Voltage (Vsup): 1.95 V

Having a maximum supply voltage of 1.95V ensures protection against overvoltage situations, safeguarding the product and connected components.

Technical Specifications

Color Signal Converters TVP5146PFPRG4 attributes and parameters. Explore more Color Signal Converters devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 3V TO 3.6V SUPPLY

General IC Type:

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Color Signal Converters

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.65 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Trade Compliance

TVP5146PFPRG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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