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TVP5031CPFP

Texas Instruments

TVP5031CPFP by Texas Instruments

TVP5031CPFP by Texas Instruments is a color signal decoder IC with 80 terminals, operating at 0-70°C. It has a power supply of 3.3V and consumes up to 160mA current. Ideal for applications requiring CMOS technology in commercial temperature grades.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,433 parts In-Stock

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4,433

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Vyrian

USA . 2,594 parts In-Stock

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2,594

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,158 parts In-Stock

1+ parts

$2.431

100+ parts

-

1k+ parts

$2.928

10k+ parts

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2,158

$2.431

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$2.928

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DigiPath Technology Company

USA . 560 parts In-Stock

1+ parts

$2.677

100+ parts

$2.463

1k+ parts

-

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560

$2.677

$2.463

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ChromeModa Solutions

Germany . 6,624 parts In-Stock

1+ parts

$2.732

100+ parts

$2.240

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6,624

$2.732

$2.240

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IDEA Electronic Components Group

UK . 1,239 parts In-Stock

1+ parts

$2.732

100+ parts

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$2.459

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1,239

$2.732

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$2.459

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AZTECH Wire

Italy . 282 parts In-Stock

1+ parts

$7.379

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282

$7.379

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One Stop Electronics

USA . 731 parts In-Stock

1+ parts

$9.800

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731

$9.800

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Corphita

USA . 1,541 parts In-Stock

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1,541

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Overview

Experience vibrant and high-quality color signal conversion with the TVP5031CPFP by Texas Instruments. Known for their exceptional manufacturing standards, Texas Instruments delivers innovative solutions for a wide range of applications. Whether you're in need of superior image processing for security cameras, video conferencing systems, or medical imaging devices, this color signal decoder is sure to exceed your expectations. With a focus on value and reliability, Texas Instruments ensures that every customer reaps the benefits of cutting-edge technology. Elevate your visual experience today with the TVP5031CPFP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy and convenient mounting on circuit boards, saving space and simplifying assembly.

General IC Type: COLOR SIGNAL DECODER

The color signal decoder IC type ensures accurate decoding of color signals, making it ideal for video processing applications.

Power Supplies (V): 3.3

The 3.3V power supply ensures compatibility with a wide range of systems and devices, providing reliable performance.

No. of Terminals: 80

With a high number of terminals, the product offers versatile connectivity options for integrating with other components in a system.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows for reliable operation in various environments without overheating issues.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption and high-speed performance, making it energy-efficient and efficient.

Maximum Supply Current: 160 mA

The maximum supply current of 160mA ensures stable and consistent power supply to the product, promoting reliable operation.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for compact design and efficient use of space on circuit boards, enhancing overall system performance.

Technical Specifications

Color Signal Converters TVP5031CPFP attributes and parameters. Explore more Color Signal Converters devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G80

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Color Signal Converters

Maximum Supply Current:

160 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TVP5031CPFP General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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