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SAA7121H/V2,557

NXP Semiconductors

SAA7121H/V2,557 by NXP Semiconductors

NXP SAA7121H/V2,557 is a color signal encoder IC with 44 terminals in a square flatpack package. It supports PAL and NTSC video standards, operates b/w 0-70°C, and requires 3.1-3.5V supply voltage. Ideal for encoding R-Y, B-Y, Y signals in commercial-grade applications.

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Digiode

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One Stop Electronics

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AZTECH Wire

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Overview

Enhance the color quality of your video signals with the NXP Semiconductors SAA7121H/V2,557 Color Signal Converter. Designed with precision and reliability in mind, this product offers a seamless integration into various applications where color accuracy is crucial. With its advanced technology and high-quality manufacturing by NXP Semiconductors, this color signal encoder ensures superior performance and exceptional value for customers looking to elevate their visual experience. Upgrade your video processing capabilities today with the SAA7121H/V2,557 and enjoy vibrant, true-to-life colors like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for portable or long-term use.

Surface Mount: YES

Surface mount capability makes installation and integration of the converter easier and more efficient.

General IC Type: COLOR SIGNAL ENCODER

Having a color signal encoder ensures accurate and high-quality color encoding, providing clear and vibrant images.

Temperature Grade: COMMERCIAL

Designed for commercial use, this converter is suitable for a wide range of applications and environments.

Technology: CMOS

The CMOS technology used in this converter ensures low power consumption and high-speed operation, making it efficient and reliable.

Technical Specifications

Color Signal Converters SAA7121H/V2,557 attributes and parameters. Explore more Color Signal Converters devices from NXP Semiconductors

Specs

General IC Type:

Input Type:

R-Y; B-Y; Y

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

2.1 mm

Maximum Supply Current:

62 mA

Maximum Supply Voltage (Vsup):

3.5 V

Minimum Supply Voltage (Vsup):

3.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Video Standard:

PAL; NTSC

Width:

10 mm

Trade Compliance

SAA7121H/V2,557 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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