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SAA7121HB

NXP Semiconductors

SAA7121HB by NXP Semiconductors

NXP Semiconductors' SAA7121HB is a color signal encoder IC with 44 terminals, operating at 3.3V. It supports PAL and NTSC video standards, ideal for applications requiring color signal conversion in commercial-grade environments. The IC features a peak reflow temperature of 260°C and GULL WING terminal form for easy surface mounting.

Median Price

$10.380

Lifecycle Status

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In-Stock Inventory

1k+

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Component Electronics Inc.

Canada . 20 parts In-Stock

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$7.790

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Digiode

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Nova Conductors

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Connector Distribution Corp

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Right Parts Inc.

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PC Components Company LLC

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R&J Components

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Quantum Digital Technology

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Legend Electronics Inc.

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AZTECH Wire

Italy . 377 parts In-Stock

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$5.077

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Ampacity Inc.

Singapore . 714 parts In-Stock

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$10.800

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One Stop Electronics

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Overview

Unlock the full potential of your video applications with the SAA7121HB by NXP Semiconductors. This color signal converter boasts superior quality and reliability, thanks to the renowned manufacturer behind it. Ideal for a wide range of video devices, this versatile component ensures crisp, vibrant images with seamless color encoding. Experience the value of enhanced performance and efficiency with the SAA7121HB, setting your products apart from the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the color signal converter.

Surface Mount: YES

Being surface mountable allows for easy installation on PCBs, saving time and effort during assembly.

General IC Type: COLOR SIGNAL ENCODER

The color signal encoder ensures accurate encoding of color signals for high-quality video output.

Power Supplies (V): 3.3

The 3.3V power supply ensures compatibility with standard power sources for reliable performance.

Video Standard: PAL; NTSC

Support for both PAL and NTSC video standards ensures compatibility with different display devices and systems.

Technology: CMOS

The CMOS technology used in the color signal converter provides low power consumption and efficient operation.

Technical Specifications

Color Signal Converters SAA7121HB attributes and parameters. Explore more Color Signal Converters devices from NXP Semiconductors

Specs

General IC Type:

Input Type:

R-Y; B-Y; Y

JESD-30 Code:

S-PQFP-G44

Length:

10 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP44,.5SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.1 mm

Sub-Category:

Color Signal Converters

Maximum Supply Current:

62 mA

Maximum Supply Voltage (Vsup):

3.5 V

Minimum Supply Voltage (Vsup):

3.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Video Standard:

PAL; NTSC

Width:

10 mm

Trade Compliance

SAA7121HB General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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