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STV3300CFN

STMicroelectronics

STV3300CFN by STMicroelectronics

STV3300CFN by STMicroelectronics is a Color Signal Decoder IC with 52 terminals, operating at 0-70 °C. It requires 5V power supply and has a max current of 100mA. Ideal for color signal conversion in commercial-grade applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,327 parts In-Stock

1+ parts

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4,327

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Vyrian

USA . 3,390 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,390

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Anansix

USA . 1,849 parts In-Stock

1+ parts

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100+ parts

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1,849

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,625 parts In-Stock

1+ parts

$2.501

100+ parts

-

1k+ parts

$2.251

10k+ parts

-

1,625

$2.501

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$2.251

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MKK Technologies

India . 1,087 parts In-Stock

1+ parts

$4.704

100+ parts

-

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10k+ parts

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1,087

$4.704

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DigiPath Technology Company

USA . 1,087 parts In-Stock

1+ parts

$4.704

100+ parts

-

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10k+ parts

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1,087

$4.704

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Corphita

USA . 3,913 parts In-Stock

1+ parts

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3,913

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Parana Technologies

USA . 725 parts In-Stock

1+ parts

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100+ parts

$2.991

1k+ parts

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725

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$2.991

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Overview

Elevate your viewing experience with the STV3300CFN from STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-notch quality and innovation in color signal converters. The STV3300CFN offers unparalleled value with its advanced features and versatile applications. Whether you're looking to enhance your home entertainment system or improve video processing in industrial settings, this color signal decoder is the ideal solution. Trust STMicroelectronics for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the color signal converter.

Surface Mount: YES

Being surface mountable makes it easier to integrate this color signal converter into various electronic circuits and devices.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a circuit board, making it easy to design and layout.

General IC Type: COLOR SIGNAL DECODER

Designed specifically for decoding color signals, this converter is optimized for accurate and reliable color signal processing.

Power Supplies (V): 5

Operating at 5 volts makes this color signal converter compatible with standard power sources, making it easy to integrate into existing systems.

No. of Terminals: 52

Having 52 terminals allows for multiple connection points, enabling versatile connectivity options for various input and output devices.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers a compact and secure housing for the color signal converter, ensuring reliable performance and easy handling.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this color signal converter can withstand high temperatures without compromising its functionality.

Minimum Operating Temperature: 0 °C

Capable of operating at temperatures as low as 0 °C, this converter is suitable for use in a wide range of environmental conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides reliable electrical connections and prevents oxidation, ensuring long-term performance and durability.

Terminal Position: QUAD

The quad terminal position offers easy access to all terminals, simplifying installation and maintenance procedures for the color signal converter.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades means this color signal converter is suitable for standard commercial applications with consistent performance.

Technology: CMOS

Utilizing CMOS technology ensures energy efficiency and low power consumption, making this converter ideal for portable and battery-powered devices.

Terminal Form: J BEND

The J bend terminal form provides mechanical stability and ease of soldering, ensuring secure connections and reliable operation of the color signal converter.

Maximum Supply Current: 100 mA

With a maximum supply current of 100 mA, this color signal converter is suitable for low-power applications without compromising performance.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for precise and compact terminal placement, enabling efficient connectivity and space-saving design.

Technical Specifications

Color Signal Converters STV3300CFN attributes and parameters. Explore more Color Signal Converters devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PQCC-J52

JESD-609 Code:

e0

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC52,.8SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Color Signal Converters

Maximum Supply Current:

100 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

STV3300CFN General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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