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TVP5151IPBSQ1

Texas Instruments

TVP5151IPBSQ1 by Texas Instruments

TVP5151IPBSQ1 by Texas Instruments is a color signal decoder with 32 terminals in a square flatpack package. It is AEC-Q100 compliant and suitable for automotive applications. The device features gull wing terminals, plastic/epoxy body material, and supports surface mount technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,489 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,489

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-

-

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Digiode

USA . 730 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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730

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,091 parts In-Stock

1+ parts

$3.483

100+ parts

-

1k+ parts

$4.007

10k+ parts

-

2,091

$3.483

-

$4.007

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DigiPath Technology Company

USA . 1,781 parts In-Stock

1+ parts

$3.835

100+ parts

-

1k+ parts

-

10k+ parts

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1,781

$3.835

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ChromeModa Solutions

Germany . 4,635 parts In-Stock

1+ parts

$3.913

100+ parts

$3.209

1k+ parts

-

10k+ parts

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4,635

$3.913

$3.209

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IDEA Electronic Components Group

UK . 900 parts In-Stock

1+ parts

$3.913

100+ parts

-

1k+ parts

$3.522

10k+ parts

-

900

$3.913

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$3.522

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AZTECH Wire

Italy . 594 parts In-Stock

1+ parts

$6.159

100+ parts

-

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10k+ parts

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594

$6.159

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One Stop Electronics

USA . 517 parts In-Stock

1+ parts

$19.800

100+ parts

-

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517

$19.800

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Corphita

USA . 4,354 parts In-Stock

1+ parts

-

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4,354

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Overview

Experience the superior quality and reliability of Texas Instruments with the TVP5151IPBSQ1 Color Signal Decoder. This innovative solution offers unmatched performance and versatility for a wide range of applications, making it the ideal choice for demanding projects. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this product will deliver exceptional results every time. Upgrade your system today and discover the value and benefits that the TVP5151IPBSQ1 has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and resistance to bending or breaking, ensuring the product's reliability in various environmental conditions.

Surface Mount: YES

Surface mount technology allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures that the product meets automotive industry standards for quality, reliability, and performance, making it suitable for automotive applications.

Package Shape: SQUARE

The square package shape facilitates efficient placement and alignment on the circuit board, contributing to a neat and organized PCB layout.

General IC Type: COLOR SIGNAL DECODER

Being a color signal decoder, this product is designed to accurately decode and process color signals, making it ideal for applications where color accuracy is critical, such as image and video processing.

No. of Terminals: 32

The 32 terminals provide ample connectivity options, allowing for versatile integration with other components and systems.

Package Style (Meter): FLATPACK

The flatpack package style offers a low-profile design, making it suitable for compact devices and applications where space is a constraint.

Terminal Position: QUAD

The quad terminal position ensures stable and secure connections, reducing the risk of signal loss or interference in operation.

Terminal Form: GULL WING

The gull wing terminal form provides ease of soldering and robust mechanical strength, enhancing the overall reliability and performance of the product.

Technical Specifications

Color Signal Converters TVP5151IPBSQ1 attributes and parameters. Explore more Color Signal Converters devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G32

No. of Terminals:

32

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Surface Mount:

YES

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

TVP5151IPBSQ1 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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