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TUSB8040A1RKMR

Texas Instruments

TUSB8040A1RKMR by Texas Instruments

TUSB8040A1RKMR by Texas Instruments is a BUS CONTROLLER IC with 100 terminals, operating at 24 MHz clock frequency. It supports I2C and SMBUS bus compatibility, with supply voltages of 1.1V and 3.3V. Ideal for applications requiring USB connectivity in commercial-grade temperature environments.

Median Price

$10.310

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 450 parts In-Stock

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$10.310

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Vyrian

USA . 5,516 parts In-Stock

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Chip Stock

USA . 5,460 parts In-Stock

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Digiode

USA . 2,816 parts In-Stock

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Rotakorn

Sweden . 12 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 208 parts In-Stock

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$9.267

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One Stop Electronics

USA . 1,564 parts In-Stock

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$10.000

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Netroflash

USA . 1,000 parts In-Stock

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$10.310

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Corohmni

South Africa . 3,129 parts In-Stock

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$10.610

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Ampacity Inc.

Singapore . 1,041 parts In-Stock

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$12.000

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Microchip USA

USA . 4,507 parts In-Stock

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$15.762

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Parana Technologies

USA . 1,667 parts In-Stock

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$20.882

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$21.070

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DigiPath Technology Company

USA . 1,483 parts In-Stock

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$22.994

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$21.154

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ChromeModa Solutions

Germany . 5,153 parts In-Stock

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$23.463

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$19.240

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$23.463

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IDEA Electronic Components Group

UK . 1,051 parts In-Stock

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$23.463

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$22.290

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$21.117

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1,051

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A-Z Elektronik GmbH

Germany . 6,711 parts In-Stock

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Kepictronics

USA . 6,000 parts In-Stock

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Perfect Parts

USA . 5,545 parts In-Stock

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Lixinc

USA . 3,892 parts In-Stock

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Corphita

USA . 1,634 parts In-Stock

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Futuretech Components

Singapore . 400 parts In-Stock

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Overview

Experience seamless connectivity like never before with the TUSB8040A1RKMR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. The TUSB8040A1RKMR falls under the category of Bus Controllers, offering a wide range of applications for various devices. With its high performance and versatility, this product provides exceptional value to customers seeking efficient and dependable solutions. Elevate your connectivity experience with the TUSB8040A1RKMR today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability, making it suitable for various environments and applications.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving design, making it convenient for integration onto circuit boards.

Maximum Supply Voltage: 1.26 V

With a maximum supply voltage of 1.26V, the bus controller operates efficiently and safely within specified limits.

Package Shape: SQUARE

The square package shape provides uniformity and ease of handling during assembly and installation.

Power Supplies (V): 1.1, 3.3

Support for multiple power supply options (1.1V and 3.3V) gives flexibility and compatibility with various system configurations.

No. of Terminals: 100

Having 100 terminals allows for ample connectivity options and versatility in connecting to other components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The variety of package styles (chip carrier, heat sink/slug, very thin profile) offers adaptability to different board layouts and thermal management needs.

Minimum Supply Voltage: 0.99 V

The low minimum supply voltage requirement of 0.99V ensures compatibility with a wide range of power sources and energy-efficient operation.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the bus controller can withstand and operate in various temperature environments reliably.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0°C allows for usage in cold environments without impacting performance.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish ensures excellent conductivity, corrosion resistance, and longevity of the connections.

Terminal Position: QUAD

Quad terminal position provides a stable and secure connection point, reducing the risk of signal loss or disconnection.

Maximum Seated Height: 0.8 mm

The low maximum seated height of 0.8mm allows for compact and space-efficient board designs.

Width: 9 mm

The 9mm width provides a balance between size and functionality, making it suitable for various applications and integration scenarios.

Maximum Clock Frequency: 24 MHz

Support for a maximum clock frequency of 24MHz ensures efficient data processing and communication speed for connected devices.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the device can undergo solder reflow processes effectively without compromising functionality.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper solder melting and device assembly during manufacturing processes.

Length: 9 mm

At 9mm length, the bus controller offers a compact form factor for easy integration into various electronic systems and devices.

Temperature Grade: COMMERCIAL

Designed for commercial use, the bus controller meets industry standards for reliability and performance in typical operating conditions.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

As a bus controller for Universal Serial Bus (USB), the device facilitates data communication and control for USB-connected peripherals efficiently.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption, high speed, and compatibility with a wide range of systems and devices.

Terminal Form: NO LEAD

The no-lead terminal form simplifies assembly processes and reduces the risk of solder joint failures or defects.

Nominal Supply Voltage: 1.1 V

The nominal supply voltage of 1.1V provides stable and optimal operating conditions for the bus controller, ensuring consistent performance.

Bus Compatibility: I2C; SMBUS

Compatibility with I2C and SMBus protocols enables seamless integration with a variety of bus systems and devices, enhancing connectivity options.

Terminal Pitch: 0.6 mm

With a terminal pitch of 0.6mm, the bus controller allows for fine-pitch connections, compact board layouts, and efficient signal routing.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the device is suitable for standard manufacturing and storage conditions, minimizing the risk of moisture-related damage.

Technical Specifications

Bus Controllers TUSB8040A1RKMR attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Additional Features:

1.05-V SUPPLY MAY BE USED AS LONG AS MINIMUM SUPPLY CONDITIONS ARE MET

Bus Compatibility:

I2C; SMBUS

Maximum Clock Frequency:

24 MHz

JESD-30 Code:

S-PQCC-N100

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SLGA100,15X15,24

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

.99 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.6 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

TUSB8040A1RKMR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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