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TUSB3200ACPAHG4

Texas Instruments

TUSB3200ACPAHG4 by Texas Instruments

TUSB3200ACPAHG4 by Texas Instruments is a BUS CONTROLLER IC with 52 terminals, operating at 3.3V, suitable for UNIVERSAL SERIAL BUS applications. It has a temperature range of 0-70°C and peak reflow temp of 260°C, making it ideal for commercial use in various electronic devices. The package style is FLATPACK with GULL WING terminals, ensuring reliable performance in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,440 parts In-Stock

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Digiode

USA . 1,922 parts In-Stock

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1,922

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Distributors (Availability)

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AZTECH Wire

Italy . 577 parts In-Stock

1+ parts

$13.881

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577

$13.881

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One Stop Electronics

USA . 1,550 parts In-Stock

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$18.000

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$18.000

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Parana Technologies

USA . 1,696 parts In-Stock

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$36.268

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$36.268

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DigiPath Technology Company

USA . 1,933 parts In-Stock

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$39.935

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$36.740

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1,933

$39.935

$36.740

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IDEA Electronic Components Group

UK . 2,334 parts In-Stock

1+ parts

$40.750

100+ parts

$38.712

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$36.675

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2,334

$40.750

$38.712

$36.675

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ChromeModa Solutions

Germany . 639 parts In-Stock

1+ parts

$40.750

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$33.415

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639

$40.750

$33.415

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Corohmni

South Africa . 54 parts In-Stock

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$84.364

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54

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Component Stockers USA

USA . 697 parts In-Stock

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$99.990

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$99.990

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Corphita

USA . 888 parts In-Stock

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Microchip USA

USA . 286 parts In-Stock

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Overview

Unlock seamless connectivity with the TUSB3200ACPAHG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unparalleled quality and reliability in bus controllers. Ideal for a wide range of applications, this product offers customers value and benefits like never before. Experience the advantage of easy integration, high performance, and enhanced functionality with the TUSB3200ACPAHG4. Elevate your projects to the next level with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, which is ideal for portable devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing production costs.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, increasing flexibility in application.

Package Shape: SQUARE

The square package shape helps in optimizing space on the PCB, making it suitable for compact designs.

No. of Terminals: 52

Having a high number of terminals allows for multiple connections and functionalities, enhancing the versatility of the product.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures efficient power consumption and operation in low-power applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for usage in cold environments without compromising functionality.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish ensures good conductivity and corrosion resistance, increasing the product's longevity.

Terminal Position: QUAD

The quad terminal position provides stable and secure connections, reducing the risk of signal loss or interference.

Maximum Seated Height: 1.2 mm

The low maximum seated height helps in maintaining a slim profile for the product, ideal for space-constrained applications.

Width: 10 mm

The compact width dimension allows for easy integration into tight spaces, making it suitable for small form factor devices.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature helps in preventing overheating during soldering, ensuring product reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance indicates the product's resilience to thermal stress, improving overall durability.

Length: 10 mm

The compact length dimension contributes to the product's overall small footprint, suitable for space-constrained applications.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature range ensures the product's compatibility with standard operating conditions, making it widely applicable.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

The universal serial bus controller type enables seamless communication between different devices, enhancing connectivity options.

Technology: CMOS

CMOS technology offers low power consumption and high performance, making the product energy-efficient and reliable.

Terminal Form: GULL WING

The gull-wing terminal form provides mechanical strength and easy soldering, ensuring stable connections for optimal performance.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage specification indicates the standard operating voltage, ensuring compatibility with common power sources.

Terminal Pitch: 0.65 mm

The fine terminal pitch allows for high-density mounting, maximizing PCB space utilization and functionality.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level 3 indicates the product's resistance to moisture-induced damage, ensuring reliable operation in varying humidity levels.

Technical Specifications

Bus Controllers TUSB3200ACPAHG4 attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO HAVING SECONDARY DIGITAL SUPPLY 5V(TYP).

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TUSB3200ACPAHG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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