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TUSB2140N

Texas Instruments

TUSB2140N by Texas Instruments

TUSB2140N by Texas Instruments is a BUS CONTROLLER with 40 terminals, operating at 3-5V. It has a max clock frequency of 48 MHz and supports I2C bus compatibility. This CMOS technology device is ideal for industrial applications requiring USB peripheral control in a compact IN-LINE package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,553 parts In-Stock

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Digiode

USA . 742 parts In-Stock

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742

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Distributors (Availability)

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AZTECH Wire

Italy . 5,553 parts In-Stock

1+ parts

$4.390

100+ parts

$4.220

1k+ parts

$4.130

10k+ parts

$4.050

5,553

$4.390

$4.220

$4.130

$4.050

One Stop Electronics

USA . 349 parts In-Stock

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$34.000

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349

$34.000

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Parana Technologies

USA . 1,282 parts In-Stock

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$36.384

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$36.384

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DigiPath Technology Company

USA . 171 parts In-Stock

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$40.063

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171

$40.063

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ChromeModa Solutions

Germany . 1,337 parts In-Stock

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$40.881

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$33.522

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1,337

$40.881

$33.522

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IDEA Electronic Components Group

UK . 703 parts In-Stock

1+ parts

$40.881

100+ parts

$38.837

1k+ parts

$36.793

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703

$40.881

$38.837

$36.793

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Corohmni

South Africa . 865 parts In-Stock

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$80.114

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865

$80.114

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Component Stockers USA

USA . 543 parts In-Stock

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$99.990

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$99.990

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Microchip USA

USA . 2,002 parts In-Stock

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Corphita

USA . 535 parts In-Stock

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Overview

Enhance your electronic designs with the TUSB2140N by Texas Instruments, a high-quality bus controller that offers unparalleled performance and reliability. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and cutting-edge technology in all their products. The TUSB2140N is versatile and can be used in various applications, providing seamless integration and efficient operation. Experience the value and benefits of this product firsthand, as it enhances functionality and streamlines processes for your projects. Trust Texas Instruments to deliver exceptional solutions for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various applications.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, the product can handle a range of power inputs efficiently.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration and fitting into different electronic setups.

No. of Terminals: 40

Having 40 terminals provides versatility in connecting to various components and peripherals.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures that the product can perform reliably even in demanding environments.

Maximum Clock Frequency: 48 MHz

The high maximum clock frequency of 48 MHz enables fast data processing and communication.

Bus Compatibility: I2C

Compatibility with I2C bus allows for easy integration with other devices and systems following the same communication protocol.

Technical Specifications

Bus Controllers TUSB2140N attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 5V SUPPLY

Bus Compatibility:

I2C

Maximum Clock Frequency:

48 MHz

JESD-30 Code:

R-PDIP-T40

Length:

52.455 mm

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Bus Controllers

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15.24 mm

Trade Compliance

TUSB2140N Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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