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TUSB1106RTZR

Texas Instruments

TUSB1106RTZR by Texas Instruments

TUSB1106RTZR by Texas Instruments is a 16-terminal chip carrier with 18ns propagation delay at 5V. It operates in industrial temperatures, supports up to 600pF load capacitance, and has a max I (ol) of 2A. Ideal for bus driver applications requiring true output polarity and low enable control.

Median Price

$1.378

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,682 parts In-Stock

1+ parts

$0.505

100+ parts

$0.482

1k+ parts

$0.458

10k+ parts

-

2,682

$0.505

$0.482

$0.458

-

Chip1Stop

Japan . 2,983 parts In-Stock

1+ parts

$1.380

100+ parts

$0.906

1k+ parts

$0.875

10k+ parts

-

2,983

$1.380

$0.906

$0.875

-

Texas Instruments

USA . 83,119 parts In-Stock

1+ parts

$1.516

100+ parts

$1.252

1k+ parts

$0.677

10k+ parts

-

83,119

$1.516

$1.252

$0.677

-

Rochester

USA . 53,190 parts In-Stock

1+ parts

-

100+ parts

$1.320

1k+ parts

$1.100

10k+ parts

$0.977

53,190

-

$1.320

$1.100

$0.977

DigiKey

USA . 53,190 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.650

10k+ parts

-

53,190

-

-

$1.650

-

Verical

USA . 42,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.375

10k+ parts

$1.221

42,000

-

-

$1.375

$1.221

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,551 parts In-Stock

1+ parts

$0.893

100+ parts

-

1k+ parts

-

10k+ parts

-

1,551

$0.893

-

-

-

Vyrian

USA . 4,423 parts In-Stock

1+ parts

$0.940

100+ parts

-

1k+ parts

-

10k+ parts

-

4,423

$0.940

-

-

-

DigiKey Marketplace

USA . 53,190 parts In-Stock

1+ parts

-

100+ parts

$0.980

1k+ parts

-

10k+ parts

-

53,190

-

$0.980

-

-

Classic Components Corporation

USA . 543 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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543

-

-

-

-

Sea View Technologies

USA . 435 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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435

-

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-

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Bristol Electronics

USA . 435 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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435

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 39,299 parts In-Stock

1+ parts

$0.800

100+ parts

-

1k+ parts

-

10k+ parts

-

39,299

$0.800

-

-

-

Corphita

USA . 2,948 parts In-Stock

1+ parts

$0.846

100+ parts

-

1k+ parts

-

10k+ parts

-

2,948

$0.846

-

-

-

Parana Technologies

USA . 1,429 parts In-Stock

1+ parts

$8.984

100+ parts

-

1k+ parts

$9.653

10k+ parts

-

1,429

$8.984

-

$9.653

-

DigiPath Technology Company

USA . 1,923 parts In-Stock

1+ parts

$9.892

100+ parts

$9.101

1k+ parts

-

10k+ parts

-

1,923

$9.892

$9.101

-

-

ChromeModa Solutions

Germany . 2,809 parts In-Stock

1+ parts

$10.094

100+ parts

$8.277

1k+ parts

-

10k+ parts

-

2,809

$10.094

$8.277

-

-

IDEA Electronic Components Group

UK . 561 parts In-Stock

1+ parts

$10.094

100+ parts

$9.589

1k+ parts

$9.085

10k+ parts

-

561

$10.094

$9.589

$9.085

-

Kepictronics

USA . 26,607 parts In-Stock

1+ parts

-

100+ parts

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26,607

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Perfect Parts

USA . 7,755 parts In-Stock

1+ parts

-

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7,755

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-

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A-Z Elektronik GmbH

Germany . 6,665 parts In-Stock

1+ parts

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100+ parts

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6,665

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-

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Lixinc

USA . 1,570 parts In-Stock

1+ parts

-

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1,570

-

-

-

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Authorized Procurement Solutions

USA . 300 parts In-Stock

1+ parts

-

100+ parts

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300

-

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Overview

Discover the unmatched reliability and performance of the TUSB1106RTZR from Texas Instruments, a leading manufacturer in the industry. This Bus Driver & Transceiver offers seamless connectivity and high-speed data transmission for various applications. With a wide operating temperature range and low power consumption, this product delivers exceptional value and efficiency to customers. Upgrade your systems with the TUSB1106RTZR and experience superior quality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in electronic devices that may experience vibrations or movement.

Propagation Delay At Nominal Supply: 18 ns

The low propagation delay ensures fast signal transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

The surface mount capability makes the product easy to install on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage is a commonly used standard in many electronic systems, ensuring compatibility with a wide range of devices.

Load Capacitance (CL): 600 pF

The high load capacitance allows the product to drive capacitive loads efficiently, making it suitable for driving long transmission lines.

No. of Terminals: 16

With 16 terminals, this product offers versatile connectivity options for integrating into various circuit designs.

Maximum I (ol): 2 Amp

The high maximum output current of 2A enables the product to drive high current loads without overheating or performance issues.

Output Characteristics: 3-STATE

The 3-state output allows the product to drive multiple bus lines, providing flexibility in controlling bus access and sharing in a multi-master system.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it energy-efficient and reliable in noisy environments.

Technical Specifications

Bus Driver & Transceivers TUSB1106RTZR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

IT REQUIRES 3.3V SUPPLY

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

USB

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

3 mm

Load Capacitance (CL):

600 pF

Logic IC Type:

Maximum I (ol):

2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

8 mA

Propagation Delay At Nominal Supply:

18 ns

Propagation Delay (tpd):

18 ns

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

3 mm

Trade Compliance

TUSB1106RTZR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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