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TUSB1106RGTR

Texas Instruments

TUSB1106RGTR by Texas Instruments

TUSB1106RGTR by Texas Instruments is a 16-terminal bus driver with 18ns propagation delay at 5V. It has a load capacitance of 600pF and supports up to 2A output current. Ideal for industrial applications requiring true output polarity, such as data communication systems.

Median Price

$1.446

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 81,806 parts In-Stock

1+ parts

$1.516

100+ parts

$1.252

1k+ parts

$0.677

10k+ parts

-

81,806

$1.516

$1.252

$0.677

-

Rochester

USA . 20,580 parts In-Stock

1+ parts

-

100+ parts

$1.320

1k+ parts

$1.100

10k+ parts

$0.977

20,580

-

$1.320

$1.100

$0.977

DigiKey

USA . 20,580 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.650

10k+ parts

-

20,580

-

-

$1.650

-

Verical

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.375

10k+ parts

$1.221

15,000

-

-

$1.375

$1.221

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,420 parts In-Stock

1+ parts

$0.893

100+ parts

-

1k+ parts

-

10k+ parts

-

4,420

$0.893

-

-

-

Vyrian

USA . 4,273 parts In-Stock

1+ parts

$0.940

100+ parts

-

1k+ parts

-

10k+ parts

-

4,273

$0.940

-

-

-

DigiKey Marketplace

USA . 20,580 parts In-Stock

1+ parts

-

100+ parts

$0.980

1k+ parts

-

10k+ parts

-

20,580

-

$0.980

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,075 parts In-Stock

1+ parts

$0.846

100+ parts

-

1k+ parts

-

10k+ parts

-

3,075

$0.846

-

-

-

Andel Nordic

Denmark . 1,339 parts In-Stock

1+ parts

$2.231

100+ parts

-

1k+ parts

$2.142

10k+ parts

$2.142

1,339

$2.231

-

$2.142

$2.142

Advanced Electronics

New Zealand . 57 parts In-Stock

1+ parts

$16.853

100+ parts

$15.336

1k+ parts

$13.819

10k+ parts

-

57

$16.853

$15.336

$13.819

-

Parana Technologies

USA . 637 parts In-Stock

1+ parts

$20.937

100+ parts

-

1k+ parts

$21.142

10k+ parts

-

637

$20.937

-

$21.142

-

DigiPath Technology Company

USA . 889 parts In-Stock

1+ parts

$23.054

100+ parts

$21.210

1k+ parts

-

10k+ parts

-

889

$23.054

$21.210

-

-

ChromeModa Solutions

Germany . 894 parts In-Stock

1+ parts

$23.525

100+ parts

$19.290

1k+ parts

-

10k+ parts

-

894

$23.525

$19.290

-

-

IDEA Electronic Components Group

UK . 177 parts In-Stock

1+ parts

$23.525

100+ parts

$22.349

1k+ parts

$21.172

10k+ parts

-

177

$23.525

$22.349

$21.172

-

A-Z Elektronik GmbH

Germany . 7,139 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,139

-

-

-

-

Kepictronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,000

-

-

-

-

ChipstoGo Electronic ltd

UK . 2,980 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,980

-

-

-

-

Authorized Procurement Solutions

USA . 2,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,800

-

-

-

-

Futuretech Components

Singapore . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Overview

Unlock seamless communication and reliable data transfer with the TUSB1106RGTR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and performance. Ideal for Bus Driver & Transceivers applications, this product offers a fast propagation delay, low power consumption, and a wide operating temperature range. With its compact design and versatile features, the TUSB1106RGTR provides exceptional value and benefits to customers looking for efficient and dependable solutions in their electronic projects. Experience superior connectivity like never before with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, making it easy to handle and transport.

Propagation Delay At Nominal Supply: 18 ns

The low propagation delay ensures fast and efficient signal transmission, making this product suitable for high-speed applications.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage is a common standard in many electronic systems, ensuring compatibility and ease of integration with existing designs.

Load Capacitance (CL): 600 pF

The high load capacitance capacity allows the product to drive heavy loads without performance degradation, making it reliable for demanding applications.

No. of Terminals: 16

The 16 terminals provide ample connectivity options, enabling versatile and flexible usage in various circuit designs.

Maximum I (ol): 2 Amp

The high output current capability of 2A ensures that the product can drive power-hungry components without overheating or malfunctioning.

Output Characteristics: 3-STATE

The 3-state output allows the product to have three output states (high, low, and high impedance), providing flexibility in controlling connected devices.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making this product energy-efficient and reliable for use in various applications.

Technical Specifications

Bus Driver & Transceivers TUSB1106RGTR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

IT REQUIRES 3.3V SUPPLY

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

USB

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

3 mm

Load Capacitance (CL):

600 pF

Logic IC Type:

Maximum I (ol):

2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

8 mA

Propagation Delay At Nominal Supply:

18 ns

Propagation Delay (tpd):

18 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Bus Driver/Transceiver

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

3 mm

Trade Compliance

TUSB1106RGTR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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