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TUSB1106RGTRG4

Texas Instruments

TUSB1106RGTRG4 by Texas Instruments

TUSB1106RGTRG4 by Texas Instruments is a 16-terminal bus driver with 18ns propagation delay, operating b/w -40 to 85°C. It features CMOS technology, TRUE output polarity, and supports a supply voltage range of 4-5.5V. Ideal for industrial applications requiring fast signal transmission in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,621 parts In-Stock

1+ parts

-

100+ parts

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6,621

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Digiode

USA . 145 parts In-Stock

1+ parts

-

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-

1k+ parts

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145

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,996 parts In-Stock

1+ parts

$11.250

100+ parts

-

1k+ parts

$10.800

10k+ parts

$10.800

3,996

$11.250

-

$10.800

$10.800

AZTECH Wire

Italy . 868 parts In-Stock

1+ parts

$12.806

100+ parts

-

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868

$12.806

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One Stop Electronics

USA . 397 parts In-Stock

1+ parts

$14.000

100+ parts

-

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397

$14.000

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Parana Technologies

USA . 205 parts In-Stock

1+ parts

$28.070

100+ parts

-

1k+ parts

$43.386

10k+ parts

-

205

$28.070

-

$43.386

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DigiPath Technology Company

USA . 2,345 parts In-Stock

1+ parts

$30.908

100+ parts

$28.436

1k+ parts

-

10k+ parts

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2,345

$30.908

$28.436

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ChromeModa Solutions

Germany . 2,628 parts In-Stock

1+ parts

$31.539

100+ parts

$25.862

1k+ parts

-

10k+ parts

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2,628

$31.539

$25.862

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IDEA Electronic Components Group

UK . 257 parts In-Stock

1+ parts

$31.539

100+ parts

$29.962

1k+ parts

$28.385

10k+ parts

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257

$31.539

$29.962

$28.385

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Corphita

USA . 2,228 parts In-Stock

1+ parts

-

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2,228

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Overview

Experience seamless connectivity and reliable performance with the TUSB1106RGTRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and innovation in their products. The TUSB1106RGTRG4 is a versatile Bus Driver & Transceiver, perfect for a wide range of applications. With its advanced technology and industrial-grade design, this product offers exceptional value and benefits to customers. Trust Texas Instruments for superior solutions that deliver unmatched efficiency and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus driver & transceiver.

Surface Mount: YES

Ensures easy and convenient installation on circuit boards.

Nominal Supply Voltage / Vsup (V): 5

Allows for a stable and consistent power supply to the device.

Propagation Delay (tpd): 18 ns

Offers fast signal processing and transmission speeds.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial environments.

Output Characteristics: 3-STATE

Provides flexibility in controlling the output signal.

Terminal Finish: NICKEL PALLADIUM GOLD

Ensures good connectivity and corrosion resistance for the terminals.

Technology: CMOS

Utilizes low power consumption and high noise immunity for efficient operation.

Technical Specifications

Bus Driver & Transceivers TUSB1106RGTRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

IT REQUIRES 3.3V SUPPLY

Family:

USB

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

18 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

TUSB1106RGTRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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