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TUSB1106RSVR

Texas Instruments

TUSB1106RSVR by Texas Instruments

TUSB1106RSVR by Texas Instruments is a 16-terminal bus driver with 18ns propagation delay at 5V. It has a load capacitance of 600pF and can handle up to 2A output current. Ideal for industrial applications requiring true output polarity, such as in control systems or data communication devices.

Median Price

$1.516

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 28,772 parts In-Stock

1+ parts

$1.516

100+ parts

$1.252

1k+ parts

$0.677

10k+ parts

-

28,772

$1.516

$1.252

$0.677

-

Mouser Electronics

USA . 2,967 parts In-Stock

1+ parts

$3.270

100+ parts

$1.680

1k+ parts

$1.160

10k+ parts

$1.050

2,967

$3.270

$1.680

$1.160

$1.050

Rochester

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

$1.320

1k+ parts

$1.100

10k+ parts

$0.977

9,000

-

$1.320

$1.100

$0.977

DigiKey

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.650

10k+ parts

-

9,000

-

-

$1.650

-

Verical

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.375

10k+ parts

$1.221

9,000

-

-

$1.375

$1.221

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,884 parts In-Stock

1+ parts

$0.854

100+ parts

-

1k+ parts

-

10k+ parts

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4,884

$0.854

-

-

-

Digiode

USA . 3,497 parts In-Stock

1+ parts

$0.893

100+ parts

-

1k+ parts

-

10k+ parts

-

3,497

$0.893

-

-

-

Chip Stock

USA . 67,600 parts In-Stock

1+ parts

-

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67,600

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-

-

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Cyclops Electronics Ltd

UK . 5,980 parts In-Stock

1+ parts

-

100+ parts

-

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5,980

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,571 parts In-Stock

1+ parts

$0.846

100+ parts

-

1k+ parts

-

10k+ parts

-

1,571

$0.846

-

-

-

Component Stockers USA

USA . 11,244 parts In-Stock

1+ parts

$0.970

100+ parts

$0.910

1k+ parts

$0.820

10k+ parts

-

11,244

$0.970

$0.910

$0.820

-

Parana Technologies

USA . 343 parts In-Stock

1+ parts

$8.862

100+ parts

-

1k+ parts

$9.545

10k+ parts

-

343

$8.862

-

$9.545

-

DigiPath Technology Company

USA . 1,507 parts In-Stock

1+ parts

$9.758

100+ parts

-

1k+ parts

-

10k+ parts

-

1,507

$9.758

-

-

-

ChromeModa Solutions

Germany . 1,665 parts In-Stock

1+ parts

$9.957

100+ parts

$8.165

1k+ parts

-

10k+ parts

-

1,665

$9.957

$8.165

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-

IDEA Electronic Components Group

UK . 550 parts In-Stock

1+ parts

$9.957

100+ parts

$9.459

1k+ parts

$8.961

10k+ parts

-

550

$9.957

$9.459

$8.961

-

Kepictronics

USA . 39,000 parts In-Stock

1+ parts

-

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39,000

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-

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Futuretech Components

Singapore . 24,000 parts In-Stock

1+ parts

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24,000

-

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QUARKTWIN TECHNOLOGY LTD

USA . 22,268 parts In-Stock

1+ parts

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22,268

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-

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Metaverse IC Inc.

Canada . 16,000 parts In-Stock

1+ parts

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16,000

-

-

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A-Z Elektronik GmbH

Germany . 11,700 parts In-Stock

1+ parts

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11,700

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-

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Perfect Parts

USA . 10,270 parts In-Stock

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10,270

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Authorized Procurement Solutions

USA . 400 parts In-Stock

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400

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Overview

Unlock seamless data transmission with the TUSB1106RSVR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unparalleled quality and reliability in the Bus Driver & Transceivers category. Ideal for a wide range of applications, this chip carrier offers a fast propagation delay of 18 ns and a nominal supply voltage of 5V, providing customers with efficient performance and enhanced connectivity. Experience the value and benefits of Texas Instruments technology with the TUSB1106RSVR, where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight, durable, and cost-effective.

Propagation Delay At Nominal Supply: 18 ns

The low propagation delay ensures fast signal transmission, which is crucial for efficient bus driver and transceiver operation.

Surface Mount: YES

Being surface mountable makes it easy to integrate into circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes it compatible with a wide range of systems and power sources.

Load Capacitance (CL): 600 pF

The high load capacitance allows for efficient driving and receiving of signals over longer distances.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options for various input and output configurations.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The thin profile chip carrier package style saves space and allows for dense packaging of components.

Maximum I (ol): 2 Amp

The high output current capability of 2A enables driving of heavy loads without the need for external amplification.

Output Characteristics: 3-STATE

The 3-state output allows for tri-state logic control, enabling multiple driver/receiver configurations in a bus system.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, the device can withstand harsh environmental conditions typical in industrial applications.

Technical Specifications

Bus Driver & Transceivers TUSB1106RSVR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

IT REQUIRES 3.3V SUPPLY

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

USB

JESD-30 Code:

R-PQCC-N16

JESD-609 Code:

e4

Length:

2.6 mm

Load Capacitance (CL):

600 pF

Logic IC Type:

Maximum I (ol):

2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

8 mA

Propagation Delay At Nominal Supply:

18 ns

Propagation Delay (tpd):

18 ns

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Sub-Category:

Bus Driver/Transceiver

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

1.8 mm

Trade Compliance

TUSB1106RSVR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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