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TUSB1105RTZR

Texas Instruments

TUSB1105RTZR by Texas Instruments

TUSB1105RTZR by Texas Instruments is a bus driver & transceiver with a propagation delay of 18 ns and a load capacitance of 600 pF. It is commonly used in industrial applications due to its temperature grade and CMOS technology.

Median Price

$1.998

Lifecycle Status

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9

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1k+

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Texas Instruments

USA . 39,269 parts In-Stock

1+ parts

$1.687

100+ parts

$1.393

1k+ parts

$0.753

10k+ parts

-

39,269

$1.687

$1.393

$0.753

-

Mouser Electronics

USA . 3,755 parts In-Stock

1+ parts

$2.310

100+ parts

$1.410

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$1.240

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$1.160

3,755

$2.310

$1.410

$1.240

$1.160

DigiKey

USA . 3,745 parts In-Stock

1+ parts

$2.380

100+ parts

$1.444

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$1.325

10k+ parts

$1.201

3,745

$2.380

$1.444

$1.325

$1.201

Rochester

USA . 16 parts In-Stock

1+ parts

-

100+ parts

$1.470

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$1.220

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$1.090

16

-

$1.470

$1.220

$1.090

Distributors (In-Stock)

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Digiode

USA . 486 parts In-Stock

1+ parts

$0.998

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486

$0.998

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Nova Conductors

Japan . 10 parts In-Stock

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$1.157

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10

$1.157

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Vyrian

USA . 10,384 parts In-Stock

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Cyclops Electronics Ltd

UK . 3,500 parts In-Stock

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Pegasus Components GmbH

Germany . 2,688 parts In-Stock

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2,688

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Ampacity Inc.

Singapore . 10,406 parts In-Stock

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$0.890

100+ parts

-

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$0.890

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Corphita

USA . 4,013 parts In-Stock

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$0.945

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$0.945

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Continental Prestige Electronics

USA . 3,948 parts In-Stock

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$1.157

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$1.134

3,948

$1.157

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$1.134

Argo Parts USA

USA . 1,792 parts In-Stock

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$1.157

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$1.157

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Parana Technologies

USA . 1,816 parts In-Stock

1+ parts

$8.198

100+ parts

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$8.808

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1,816

$8.198

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DigiPath Technology Company

USA . 1,384 parts In-Stock

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$9.027

100+ parts

$8.305

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$9.027

$8.305

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ChromeModa Solutions

Germany . 6,063 parts In-Stock

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$9.211

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$7.553

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$9.211

$7.553

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IDEA Electronic Components Group

UK . 1,604 parts In-Stock

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$9.211

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$8.750

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$8.290

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1,604

$9.211

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$8.290

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Andel Nordic

Denmark . 3,119 parts In-Stock

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$10.918

100+ parts

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$10.481

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$10.481

3,119

$10.918

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$10.481

Perfect Parts

USA . 14,883 parts In-Stock

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Futuretech Components

Singapore . 6,000 parts In-Stock

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Kepictronics

USA . 6,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,121 parts In-Stock

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Lixinc

USA . 3,068 parts In-Stock

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Authorized Procurement Solutions

USA . 95 parts In-Stock

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GreenTree Electronics

Israel . 95 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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$1.134

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$1.099

10k+ parts

$1.076

50

-

$1.134

$1.099

$1.076

Overview

Experience seamless data transfer with the TUSB1105RTZR Bus Driver & Transceiver by Texas Instruments. Known for their high-quality products, Texas Instruments delivers yet another exceptional solution for your connectivity needs. The TUSB1105RTZR offers reliable performance, with a low propagation delay and true output polarity. Its compact design, surface mount capability, and wide operating temperature range make it ideal for various applications. Say goodbye to slow data transfer and welcome efficient communication with the TUSB1105RTZR. Trust Texas Instruments to provide you with the best in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's plastic/epoxy package body material ensures durability and reliability, making it an excellent choice.

Propagation Delay At Nominal Supply: 18 ns

With a low propagation delay of 18 ns, this product guarantees fast and efficient signal transmission, making it ideal for bus driver and transceiver applications.

Surface Mount: YES

The surface mount feature simplifies the installation process and allows for compact design, making this product an ideal choice for space-constrained environments.

No. of Functions: 1

With a single function, this product offers simplicity and focused functionality, making it a reliable and straightforward option.

Package Shape: SQUARE

The square package shape not only promotes ease of integration but also facilitates efficient heat dissipation, making this product a practical choice for bus driver and transceiver applications.

No. of Bits: 1

With a single bit, this product is suitable for low-density data transmission, making it a cost-effective choice for specific applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V, this product provides compatibility with standard power supplies, making it a convenient choice for various systems.

Load Capacitance (CL): 600 pF

The 600 pF load capacitance enables the product to drive capacitive loads efficiently, enhancing overall performance and ensuring reliable signal transmission.

No. of Terminals: 16

With 16 terminals, this product allows for versatile connectivity options, making it a flexible and adaptable choice for bus driver and transceiver applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier package style, combined with a heat sink/slug and very thin profile, enhances thermal management and facilitates space-saving design, making this product an excellent choice for compact applications.

Maximum I (ol): 2 Amp

With a maximum output current of 2 Amps, this product offers high power handling capabilities, making it ideal for driving demanding loads.

Propagation Delay (tpd): 18 ns

The propagation delay of 18 ns ensures minimal delays in signal transmission, leading to improved efficiency and responsiveness, making this product a reliable choice.

Maximum Operating Temperature: 85 °C

Operating comfortably at a maximum temperature of 85°C, this product provides reliability even in challenging environmental conditions, making it suitable for industrial applications.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow for high impedance state when not actively driving, minimizing interference and improving signal integrity, making this product an excellent choice for bus driver and transceiver applications.

Minimum Operating Temperature: -40 °C

Operating reliably at a minimum temperature of -40°C, this product ensures performance even in extreme cold conditions, making it suitable for various industrial and outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The nickel palladium gold silver terminal finish ensures corrosion resistance and reliable electrical connections, making this product a durable and long-lasting choice.

Terminal Position: QUAD

The quad terminal position allows for easy and secure soldering and connections, ensuring reliable electrical performance, making this product an ideal choice for hassle-free installations.

No. of Ports: 2

With two ports, this product provides flexibility in connectivity options and allows for versatile system integration, making it suitable for a wide range of bus driver and transceiver applications.

Maximum Seated Height: 0.8 mm

With a maximum seated height of 0.8mm, this product offers a low-profile design, enabling it to fit in compact spaces and making it suitable for miniaturized applications.

Width: 3 mm

With a width of 3mm, this product allows for efficient layout designs and space optimization, making it an ideal choice for applications with space constraints.

Output Polarity: TRUE

The true output polarity ensures accurate and reliable signal transmission, making this product a dependable choice for bus driver and transceiver applications.

Minimum Supply Voltage (Vsup): 4 V

With a minimum supply voltage of 4V, this product offers flexibility in power supply options while maintaining proper functionality, making it compatible with a wide range of systems.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time allowed at peak reflow temperature of 30 seconds ensures safe and efficient soldering during assembly, making this product suitable for hassle-free manufacturing processes.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product allows for reliable soldering connections and withstands high-temperature conditions, ensuring long-term performance and reliability.

Length: 3 mm

The compact length of 3mm enables space-saving designs and integration into small form factor systems, making this product an excellent choice for miniaturized applications.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial environments, this product offers high reliability and stability across varying temperatures, making it suitable for demanding industrial applications.

Technology: CMOS

Utilizing CMOS technology, this product offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making it an efficient and versatile choice.

Terminal Form: NO LEAD

With a no-lead terminal form (lead-free), this product meets environmental regulations and enables environment-friendly systems, making it an eco-conscious choice.

Packing Method: TR

The tray (TR) packing method ensures secure and protected delivery, reducing the risk of damage during transportation and making this product a reliable choice.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, this product allows for high-density PCB designs and precise connections, making it suitable for applications with limited PCB space.

Count Direction: UNIDIRECTIONAL

Operating in a unidirectional count direction, this product provides efficient timing and synchronization capabilities, making it an optimal choice for specific applications.

Control Type: ENABLE LOW

With an enable low control type, this product offers easy and intuitive control, allowing smooth operation and effortless interfacing in various systems.

Moisture Sensitivity Level (MSL): 1

With a moisture sensitivity level of 1, this product can withstand standard moisture exposure, ensuring reliable performance and longevity.

Maximum Supply Voltage (Vsup): 5.5 V

Operating safely at a maximum supply voltage of 5.5V, this product provides flexibility in power supply options, making it compatible with various systems and power sources.

Maximum Power Supply Current (ICC): 8 mA

With a maximum power supply current of 8 mA, this product offers efficient power consumption, minimizing energy usage and prolonging battery life in portable applications.

Technical Specifications

Bus Driver & Transceivers TUSB1105RTZR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

IT REQUIRES 3.3V SUPPLY

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

USB

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

3 mm

Load Capacitance (CL):

600 pF

Logic IC Type:

Maximum I (ol):

2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

8 mA

Propagation Delay At Nominal Supply:

18 ns

Propagation Delay (tpd):

18 ns

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

3 mm

Trade Compliance

TUSB1105RTZR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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