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TSC2302IRGZG4

Texas Instruments

TSC2302IRGZG4 by Texas Instruments

TSC2302IRGZG4 by Texas Instruments is a 48-terminal consumer IC with 3.3V power supply, operating b/w -40 to 85°C. It features CMOS technology, NO LEAD terminals, and is suitable for industrial applications requiring a compact square package with very thin profile and surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,614 parts In-Stock

1+ parts

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5,614

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Digiode

USA . 1,035 parts In-Stock

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1,035

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,022 parts In-Stock

1+ parts

$2.321

100+ parts

-

1k+ parts

$2.818

10k+ parts

-

2,022

$2.321

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$2.818

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ChromeModa Solutions

Germany . 623 parts In-Stock

1+ parts

$2.608

100+ parts

$2.139

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623

$2.608

$2.139

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IDEA Electronic Components Group

UK . 182 parts In-Stock

1+ parts

$2.608

100+ parts

-

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$2.347

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182

$2.608

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$2.347

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AZTECH Wire

Italy . 569 parts In-Stock

1+ parts

$11.276

100+ parts

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569

$11.276

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One Stop Electronics

USA . 1,217 parts In-Stock

1+ parts

$16.800

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1,217

$16.800

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Component Stockers USA

USA . 226 parts In-Stock

1+ parts

$99.990

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226

$99.990

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Corphita

USA . 2,648 parts In-Stock

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2,648

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DigiPath Technology Company

USA . 862 parts In-Stock

1+ parts

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$2.351

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862

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$2.351

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Microchip USA

USA . 200 parts In-Stock

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200

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Overview

Unleash the power of cutting-edge technology with the TSC2302IRGZG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality consumer ICs that redefine innovation. This versatile chip carrier with a very thin profile offers a wide range of applications, from industrial settings to everyday consumer devices. With a minimum supply voltage of 2.7V and a maximum operating temperature of 85°C, the TSC2302IRGZG4 provides unmatched reliability and performance. Elevate your projects with Texas Instruments and experience the difference in quality and efficiency today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and thermal insulation, making this product suitable for a wide range of applications.

Surface Mount: YES

The ability to surface mount this IC allows for easy and efficient assembly onto circuit boards, saving time and reducing manufacturing costs.

Power Supplies (V): 3.3

Operating at a power supply of 3.3V allows for compatibility with many existing systems and devices, providing a versatile solution.

No. of Terminals: 48

Having 48 terminals offers flexibility in connecting to various components and peripherals, enabling complex circuit designs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this IC can withstand harsh environments and extended use without overheating.

Technology: CMOS

Utilizing CMOS technology results in low power consumption and noise immunity, enhancing the efficiency and reliability of this product.

Technical Specifications

Other Function Consumer ICs TSC2302IRGZG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQCC-N48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

TSC2302IRGZG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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