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TPS80032A2D7YFFR

Texas Instruments

TPS80032A2D7YFFR by Texas Instruments

TPS80032A2D7YFFR by Texas Instruments is a Power Management IC with 155 terminals, operating at -40 to 85°C. It offers an output voltage range of 0.6V to 3.3V and supports a max current of 5A. Ideal for industrial applications requiring precise power supply management in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 15,000 parts In-Stock

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Digiode

USA . 3,114 parts In-Stock

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3,114

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Vyrian

USA . 2,177 parts In-Stock

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2,177

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Distributors (Availability)

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One Stop Electronics

USA . 1,115 parts In-Stock

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$2.500

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$2.500

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Parana Technologies

USA . 2,199 parts In-Stock

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$4.914

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$5.446

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2,199

$4.914

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$5.446

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DigiPath Technology Company

USA . 1,417 parts In-Stock

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$5.411

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1,417

$5.411

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Ampacity Inc.

Singapore . 664 parts In-Stock

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$5.500

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664

$5.500

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ChromeModa Solutions

Germany . 5,071 parts In-Stock

1+ parts

$5.521

100+ parts

$4.527

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5,071

$5.521

$4.527

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IDEA Electronic Components Group

UK . 1,211 parts In-Stock

1+ parts

$5.521

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$4.969

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$5.521

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$4.969

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Semicontronic

India . 1,192 parts In-Stock

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$7.500

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$7.312

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$7.275

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1,192

$7.500

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$7.275

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AZTECH Wire

Italy . 736 parts In-Stock

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$8.555

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736

$8.555

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Kepictronics

USA . 6,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,800 parts In-Stock

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Corphita

USA . 1,416 parts In-Stock

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Corohmni

South Africa . 282 parts In-Stock

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Overview

Elevate your power management game with the TPS80032A2D7YFFR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-tier quality and reliability in their Power Management ICs category. This product offers a wide range of applications with its versatile features, providing customers with exceptional value and benefits. Experience seamless power supply management with the TPS80032A2D7YFFR, designed to meet your industrial needs while ensuring optimal performance and efficiency. Choose Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resilience, making this product suitable for various applications and environments.

Nominal Supply Voltage (Vsup): 3.8 V

The nominal supply voltage of 3.8 V provides a stable power source for the device, ensuring consistent performance.

No. of Terminals: 155

With a high number of terminals, this product offers versatility in connecting to different systems and components.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C allows the product to withstand heat and perform reliably in demanding conditions.

Maximum Output Current: 5 A

The high maximum output current of 5 A enables the product to power multiple devices simultaneously without compromising performance.

Technical Specifications

Power Management ICs TPS80032A2D7YFFR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PBGA-B155

JESD-609 Code:

e1

Length:

5.364 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

16

No. of Functions:

1

No. of Outputs:

15

No. of Terminals:

155

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

5 A

Maximum Output Voltage:

3.3 V

Minimum Output Voltage:

.6 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3.8 V

Surface Mount:

YES

Maximum Switching Frequency:

6600 kHz

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5.214 mm

Trade Compliance

TPS80032A2D7YFFR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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