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TPS80032A2F7YFFR

Texas Instruments

TPS80032A2F7YFFR by Texas Instruments

TPS80032A2F7YFFR by Texas Instruments is a Power Management IC with 155 terminals, 15 outputs, and max output current of 5A. It operates in industrial temperatures, has a switching frequency of 6600 kHz, and is suitable for power supply management circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,807 parts In-Stock

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Digiode

USA . 2,191 parts In-Stock

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Semicontronic

India . 1,143 parts In-Stock

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$2.500

100+ parts

$2.438

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$2.425

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$2.500

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One Stop Electronics

USA . 717 parts In-Stock

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$2.500

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717

$2.500

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Parana Technologies

USA . 2,022 parts In-Stock

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$2.577

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$3.069

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$2.577

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ChromeModa Solutions

Germany . 1,034 parts In-Stock

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$2.896

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$2.375

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IDEA Electronic Components Group

UK . 390 parts In-Stock

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$2.896

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$2.606

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Ampacity Inc.

Singapore . 163 parts In-Stock

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$7.500

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AZTECH Wire

Italy . 255 parts In-Stock

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$11.214

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Lixinc

USA . 7,481 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,813 parts In-Stock

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DigiPath Technology Company

USA . 1,938 parts In-Stock

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$2.611

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Corphita

USA . 1,472 parts In-Stock

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Corohmni

South Africa . 345 parts In-Stock

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Overview

Discover the power of the TPS80032A2F7YFFR by Texas Instruments, a top-tier manufacturer of Power Management ICs. This innovative product offers unparalleled reliability and efficiency for various applications. With 15 outputs and a maximum output current of 5A, this IC is perfect for industrial-grade projects requiring precise power supply management. The compact design and fine pitch package make installation a breeze. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations. Upgrade your power management system today with the TPS80032A2F7YFFR and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material provides durability and protection for the Power Management IC, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability makes installation easier and more efficient, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 3.8 V

The nominal supply voltage of 3.8 V is a commonly used voltage level, making this Power Management IC compatible with a wide range of applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this Power Management IC can withstand high temperature environments, enhancing its reliability and performance.

Maximum Output Voltage: 3.3 V

The maximum output voltage of 3.3 V is ideal for powering various electronic devices and components within a safe voltage range.

Width (mm): 5.214 mm

The compact width of 5.214 mm allows for space-saving installation, making this Power Management IC suitable for compact electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that this Power Management IC can operate reliably in harsh industrial environments with varying temperature conditions.

Maximum Output Current: 5 A

With a maximum output current of 5 A, this Power Management IC is capable of delivering sufficient power to multiple outputs or high-power components.

Technical Specifications

Power Management ICs TPS80032A2F7YFFR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PBGA-B155

JESD-609 Code:

e1

Length:

5.364 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

16

No. of Functions:

1

No. of Outputs:

15

No. of Terminals:

155

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

5 A

Maximum Output Voltage:

3.3 V

Minimum Output Voltage:

.6 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3.8 V

Surface Mount:

YES

Maximum Switching Frequency:

6600 kHz

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5.214 mm

Trade Compliance

TPS80032A2F7YFFR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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