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TPS80032A2ABYFFR

Texas Instruments

TPS80032A2ABYFFR by Texas Instruments

TPS80032A2ABYFFR by Texas Instruments is a Power Management IC with 155 terminals, operating at -40 to 85°C. It offers a max output voltage of 3.3V and a max output current of 5A. Ideal for industrial applications requiring precise power supply management in compact spaces.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 6,434 parts In-Stock

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Digiode

USA . 2,173 parts In-Stock

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One Stop Electronics

USA . 1,438 parts In-Stock

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$0.500

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Semicontronic

India . 247 parts In-Stock

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$1.500

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$1.462

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$1.455

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247

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$1.455

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AZTECH Wire

Italy . 604 parts In-Stock

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$7.210

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Parana Technologies

USA . 1,203 parts In-Stock

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$13.059

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ChromeModa Solutions

Germany . 5,682 parts In-Stock

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$14.161

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$11.612

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IDEA Electronic Components Group

UK . 746 parts In-Stock

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$14.161

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$13.453

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$12.745

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Corphita

USA . 3,491 parts In-Stock

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DigiPath Technology Company

USA . 1,684 parts In-Stock

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$12.768

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Corohmni

South Africa . 84 parts In-Stock

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Overview

Elevate your power management capabilities with the TPS80032A2ABYFFR by Texas Instruments. Designed with precision and reliability in mind, this Power Management IC offers unparalleled performance for a wide range of applications. Texas Instruments, known for its exceptional quality and cutting-edge technology, ensures that each product meets the highest standards. With 15 outputs, adjustable threshold, and a maximum output current of 5A, this IC provides efficient power solutions for industrial-grade environments. Experience the value and benefits of Texas Instruments' expertise in power management with the TPS80032A2ABYFFR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good insulation properties and is commonly used in electronic components for durability and protection.

Surface Mount: YES

Surface mount technology allows for easy and convenient installation on circuit boards, saving space and improving overall design flexibility.

Nominal Supply Voltage (Vsup): 3.8 V

The specified supply voltage ensures stable and efficient operation of the power management IC within its optimal range.

No. of Terminals: 155

Having a higher number of terminals allows for more connectivity options and flexibility in designing complex power supply circuits.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions or under heavy load.

Minimum Output Voltage: 0.6 V

The low minimum output voltage makes this power management IC suitable for powering a wide range of electronic devices, including low-power applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the IC to function effectively in cold environments without compromising performance.

Terminal Finish: TIN SILVER COPPER

The terminal finish of Tin, Silver, and Copper provides good conductivity, corrosion resistance, and solderability for reliable connections.

Maximum Output Voltage: 3.3 V

The maximum output voltage ensures compatibility with a wide range of electronic devices and applications requiring higher voltage levels.

Width (mm): 5.214 mm

The compact width of the IC allows for space-efficient integration into circuit designs, especially in tight layouts or small devices.

Minimum Supply Voltage (Vsup): 2.5 V

The specified minimum supply voltage ensures proper functionality and protection against undervoltage conditions in the power supply.

Maximum Seated Height: 0.625 mm

The low maximum seated height allows for a slim profile and compact design, ideal for applications where space is limited.

Maximum Switching Frequency: 6600 kHz

The high switching frequency enables efficient power conversion and regulation, reducing ripple and improving overall performance.

Maximum Output Current: 5 A

The high maximum output current capability makes this IC suitable for driving power-hungry components or multiple devices simultaneously.

No. of Channels: 16

Having multiple channels allows for independent control and monitoring of different power outputs, enhancing system versatility and efficiency.

Terminal Pitch: 0.4 mm

The small terminal pitch enables high-density mounting on PCBs, offering greater connectivity options and saving space in compact electronic devices.

Technical Specifications

Power Management ICs TPS80032A2ABYFFR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PBGA-B155

JESD-609 Code:

e1

Length:

5.364 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

16

No. of Functions:

1

No. of Outputs:

15

No. of Terminals:

155

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

5 A

Maximum Output Voltage:

3.3 V

Minimum Output Voltage:

.6 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3.8 V

Surface Mount:

YES

Maximum Switching Frequency:

6600 kHz

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5.214 mm

Trade Compliance

TPS80032A2ABYFFR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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