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TPS80032A2F8YFFR

Texas Instruments

TPS80032A2F8YFFR by Texas Instruments

TPS80032A2F8YFFR by Texas Instruments is a Power Management IC with 155 terminals, supporting a supply voltage range of 2.5V to 5.5V and output current up to 5A. It features a max switching frequency of 6600 kHz, making it ideal for industrial applications requiring precise power supply management in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,693 parts In-Stock

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Vyrian

USA . 3,067 parts In-Stock

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3,067

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Distributors (Availability)

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One Stop Electronics

USA . 418 parts In-Stock

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$3.500

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418

$3.500

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Semicontronic

India . 663 parts In-Stock

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$4.500

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$4.388

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$4.365

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663

$4.500

$4.388

$4.365

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Ampacity Inc.

Singapore . 1,583 parts In-Stock

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$7.500

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$7.500

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AZTECH Wire

Italy . 827 parts In-Stock

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$8.510

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827

$8.510

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Parana Technologies

USA . 818 parts In-Stock

1+ parts

$17.207

100+ parts

$1,597.955

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$15.487

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818

$17.207

$1,597.955

$15.487

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DigiPath Technology Company

USA . 1,315 parts In-Stock

1+ parts

$18.947

100+ parts

$17.432

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1,315

$18.947

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ChromeModa Solutions

Germany . 4,542 parts In-Stock

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$19.334

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$15.854

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$19.334

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IDEA Electronic Components Group

UK . 1,192 parts In-Stock

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$19.334

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$18.367

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$17.401

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1,192

$19.334

$18.367

$17.401

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Corphita

USA . 1,901 parts In-Stock

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Corohmni

South Africa . 90 parts In-Stock

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Overview

Unlock the power of efficient and reliable power management with the TPS80032A2F8YFFR by Texas Instruments. Designed to meet industrial-grade standards, this Power Management IC offers 15 outputs and a maximum output current of 5A, providing unparalleled performance for a wide range of applications. With Texas Instruments' reputation for quality and innovation backing it up, this IC delivers exceptional value and benefits to customers looking for optimal power supply management solutions. Experience the advantage of cutting-edge technology in a compact, easy-to-use package that will elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides a good level of protection for the components inside.

Surface Mount: YES

Allows for easy and efficient soldering onto circuit boards.

Nominal Supply Voltage (Vsup): 3.8 V

Optimal operating voltage for the power management IC.

No. of Terminals: 155

Provides a high level of connectivity for various power management functions.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Compact design allows for efficient use of space on circuit boards.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications.

Minimum Output Voltage: 0.6 V

Provides flexibility in output voltage options for different devices.

Minimum Operating Temperature: -40 °C

Can operate in cold environments without any issues.

Terminal Finish: TIN SILVER COPPER

Provides good conductivity and protects against corrosion.

Maximum Output Voltage: 3.3 V

Suitable for a wide range of devices that require different output voltages.

Terminal Position: BOTTOM

Facilitates easy connection to the circuit board.

Maximum Seated Height: 0.625 mm

Low profile design saves space and allows for compact device designs.

Width (mm): 5.214 mm

Compact size allows for efficient use of space on circuit boards.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Specifically designed for power supply management functions, ensuring optimal performance.

Minimum Supply Voltage (Vsup): 2.5 V

Provides flexibility in input voltage options for different devices.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand high temperatures for a short duration during soldering process.

Peak Reflow Temperature °C: 260

Can withstand high soldering temperatures without any damage.

Length: 5.364 mm

Compact size allows for efficient use of space on circuit boards.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with varying temperature conditions.

Maximum Switching Frequency: 6600 kHz

High switching frequency allows for efficient power management.

Maximum Output Current: 5 A

Can handle high output currents for powering various devices.

No. of Channels: 16

Provides multiple channels for managing power distribution efficiently.

Terminal Form: BALL

Provides a reliable connection to the circuit board.

Terminal Pitch: 0.4 mm

Fine pitch allows for high density mounting on circuit boards.

Maximum Supply Voltage (Vsup): 5.5 V

Can handle higher input voltages for powering various devices.

No. of Outputs: 15

Provides multiple output options for powering different components.

Adjustable Threshold: YES

Allows for customization of voltage thresholds to suit specific requirements.

Technical Specifications

Power Management ICs TPS80032A2F8YFFR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PBGA-B155

JESD-609 Code:

e1

Length:

5.364 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

16

No. of Functions:

1

No. of Outputs:

15

No. of Terminals:

155

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

5 A

Maximum Output Voltage:

3.3 V

Minimum Output Voltage:

.6 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3.8 V

Surface Mount:

YES

Maximum Switching Frequency:

6600 kHz

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5.214 mm

Trade Compliance

TPS80032A2F8YFFR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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