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TPS70745PWPG4

Texas Instruments

TPS70745PWPG4 by Texas Instruments

TPS70745PWPG4 by Texas Instruments is a Power Management IC with 20 terminals, operating temperature range of -40 to 125°C, and supply voltage from 2.7V to 6V. It is designed for automotive applications requiring power supply support circuits in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,505 parts In-Stock

1+ parts

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4,505

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Digiode

USA . 1,131 parts In-Stock

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1,131

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Euro-Tech

UK . 140 parts In-Stock

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140

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 515 parts In-Stock

1+ parts

$6.662

100+ parts

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515

$6.662

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One Stop Electronics

USA . 1,024 parts In-Stock

1+ parts

$7.500

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1,024

$7.500

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Parana Technologies

USA . 2,047 parts In-Stock

1+ parts

$10.252

100+ parts

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$10.789

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2,047

$10.252

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$10.789

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DigiPath Technology Company

USA . 871 parts In-Stock

1+ parts

$11.289

100+ parts

$10.386

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871

$11.289

$10.386

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ChromeModa Solutions

Germany . 4,190 parts In-Stock

1+ parts

$11.519

100+ parts

$9.446

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4,190

$11.519

$9.446

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IDEA Electronic Components Group

UK . 1,061 parts In-Stock

1+ parts

$11.519

100+ parts

$10.943

1k+ parts

$10.367

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1,061

$11.519

$10.943

$10.367

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Corphita

USA . 2,395 parts In-Stock

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2,395

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Overview

Experience power management like never before with the TPS70745PWPG4 by Texas Instruments. Crafted with precision and innovation, this Power Management IC is designed to cater to a wide range of applications in various industries. From its high-quality construction to its advanced features, this product offers unparalleled value and benefits to customers. Make the smart choice and elevate your power management solutions with the TPS70745PWPG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly onto circuit boards, saving time and effort during the manufacturing process.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a standard form factor, making it compatible with a wide range of electronic devices and circuit board designs.

No. of Terminals: 20

Having 20 terminals allows for a higher level of connectivity and versatility in designing power management circuits.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this power management IC can withstand demanding operating conditions without overheating or degradation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extreme cold environments, making it suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable signal transmission and longevity of the product.

Width (mm): 4.4 mm

The compact width of 4.4mm makes this power management IC suitable for space-constrained applications where size is a critical factor.

Minimum Supply Voltage (Vsup): 2.7 V

With a low minimum supply voltage requirement of 2.7V, this power management IC is efficient and can operate in low-power scenarios, increasing energy efficiency.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this power management IC meets the stringent requirements for reliability and performance in automotive systems, ensuring safe operation in vehicles.

Technical Specifications

Power Management ICs TPS70745PWPG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

MANUAL RESET INPUT; POWER ON RESET GENERATOR

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

TPS70745PWPG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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