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TPS75003RHLTG4

Texas Instruments

TPS75003RHLTG4 by Texas Instruments

TPS75003RHLTG4 by Texas Instruments is a Power Management IC with 3 outputs, offering a max output current of 3A and a wide input voltage range from 2.2V to 6.5V. This chip carrier package supports an adjustable threshold and operates in industrial temperature grades, making it suitable for various power supply support circuit applications.

Median Price

$3.230

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 39 parts In-Stock

1+ parts

$3.230

100+ parts

$3.040

1k+ parts

$2.750

10k+ parts

-

39

$3.230

$3.040

$2.750

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,920 parts In-Stock

1+ parts

$3.068

100+ parts

-

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10k+ parts

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2,920

$3.068

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-

-

Nova Conductors

Japan . 83 parts In-Stock

1+ parts

$3.580

100+ parts

-

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83

$3.580

-

-

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Vyrian

USA . 2,908 parts In-Stock

1+ parts

-

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2,908

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-

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NPI Materials, Inc.

USA . 524 parts In-Stock

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524

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Bristol Electronics

USA . 214 parts In-Stock

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214

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 113 parts In-Stock

1+ parts

$2.750

100+ parts

-

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113

$2.750

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Semicontronic

India . 113 parts In-Stock

1+ parts

$2.750

100+ parts

$2.681

1k+ parts

$2.668

10k+ parts

-

113

$2.750

$2.681

$2.668

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Corphita

USA . 2,012 parts In-Stock

1+ parts

$2.907

100+ parts

-

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2,012

$2.907

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Argo Parts USA

USA . 3,220 parts In-Stock

1+ parts

$3.580

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-

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3,220

$3.580

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Continental Prestige Electronics

USA . 873 parts In-Stock

1+ parts

$3.580

100+ parts

-

1k+ parts

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10k+ parts

$3.508

873

$3.580

-

-

$3.508

Parana Technologies

USA . 2,103 parts In-Stock

1+ parts

$8.950

100+ parts

-

1k+ parts

$9.619

10k+ parts

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2,103

$8.950

-

$9.619

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DigiPath Technology Company

USA . 1,535 parts In-Stock

1+ parts

$9.855

100+ parts

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1,535

$9.855

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IDEA Electronic Components Group

UK . 1,758 parts In-Stock

1+ parts

$10.056

100+ parts

$9.553

1k+ parts

$9.050

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-

1,758

$10.056

$9.553

$9.050

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ChromeModa Solutions

Germany . 849 parts In-Stock

1+ parts

$10.056

100+ parts

$8.246

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849

$10.056

$8.246

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AZTECH Wire

Italy . 415 parts In-Stock

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$10.088

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415

$10.088

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$15.222

100+ parts

$14.461

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$14.461

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1,000

$15.222

$14.461

$14.461

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Corohmni

South Africa . 646 parts In-Stock

1+ parts

$18.671

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646

$18.671

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Microchip USA

USA . 1,522 parts In-Stock

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1,522

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$3.508

1k+ parts

$3.401

10k+ parts

$3.329

100

-

$3.508

$3.401

$3.329

Computer Components Inc. - USA

USA . 78 parts In-Stock

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78

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Overview

Elevate your power management solutions with the TPS75003RHLTG4 by Texas Instruments. Crafted with precision and expertise, this Power Management IC delivers unparalleled performance and reliability. Ideal for a wide range of applications, this product offers exceptional value and benefits to customers seeking efficient and effective power solutions. Trust Texas Instruments to provide you with top-of-the-line technology that exceeds expectations. Choose the TPS75003RHLTG4 for unmatched quality and superior performance in power management.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and allows for a compact design, making this product suitable for various applications.

Nominal Supply Voltage (Vsup): 3 V

A stable 3V supply voltage ensures consistent performance and power efficiency.

No. of Terminals: 20

With 20 terminals, this power management IC offers flexibility and versatility in connecting to external components.

Maximum Output Voltage: 6.25 V

The high maximum output voltage of 6.25V enables power delivery to a wide range of devices and circuits.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environments and industrial applications.

Maximum Output Current: 3 A

A high maximum output current of 3A allows for powering multiple devices simultaneously without overheating.

No. of Channels: 3

Three channels provide flexibility in managing power distribution to different components or subsystems in a system.

Technical Specifications

Power Management ICs TPS75003RHLTG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PQCC-N20

JESD-609 Code:

e4

Length:

4.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

3

No. of Functions:

1

No. of Outputs:

3

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

3 A

Maximum Output Voltage:

6.25 V

Minimum Output Voltage:

1 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20/24,.14X.18,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/6

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.15 mA

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Maximum Switching Frequency:

300 kHz

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.5 mm

Trade Compliance

TPS75003RHLTG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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