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TPS70758PWPR

Texas Instruments

TPS70758PWPR by Texas Instruments

TPS70758PWPR by Texas Instruments is a Power Management IC with 20 terminals, suitable for automotive applications. It operates b/w -40 to 125°C and supports dual channels with a supply voltage range of 2.7V to 6V. The package style is small outline, heat sink/slug, thin profile, shrink pitch, making it ideal for compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,102 parts In-Stock

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Digiode

USA . 4,026 parts In-Stock

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4,026

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Bristol Electronics

USA . 2,000 parts In-Stock

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2,000

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Atlantic Semiconductor

USA . 2,000 parts In-Stock

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2,000

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Distributors (Availability)

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One Stop Electronics

USA . 1,644 parts In-Stock

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$3.500

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1,644

$3.500

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AZTECH Wire

Italy . 674 parts In-Stock

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$11.859

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674

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Parana Technologies

USA . 1,787 parts In-Stock

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$19.364

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$19.380

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1,787

$19.364

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$19.380

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DigiPath Technology Company

USA . 1,604 parts In-Stock

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$21.322

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1,604

$21.322

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ChromeModa Solutions

Germany . 5,419 parts In-Stock

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$21.757

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$17.841

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$21.757

$17.841

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IDEA Electronic Components Group

UK . 1,966 parts In-Stock

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$21.757

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$20.669

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$19.581

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1,966

$21.757

$20.669

$19.581

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Component Stockers USA

USA . 337 parts In-Stock

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$99.990

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337

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 22,290 parts In-Stock

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Corphita

USA . 3,529 parts In-Stock

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Microchip USA

USA . 346 parts In-Stock

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Overview

Upgrade your power management capabilities with the TPS70758PWPR by Texas Instruments. Manufactured with top-quality materials and cutting-edge technology, this Power Management IC offers unmatched performance and reliability. Ideal for a wide range of applications, this product provides customers with exceptional value and benefits. Whether you're looking to improve efficiency in automotive systems or enhance power supply support circuits, the TPS70758PWPR is the perfect choice for your needs. Trust Texas Instruments to deliver superior products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight, cost-effective, and durable, making it ideal for Power Management ICs.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and space in the manufacturing process.

Package Shape: RECTANGULAR

Rectangular shape provides a standardized form factor that is easy to work with and compatible with a wide range of devices and applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this Power Management IC can withstand demanding thermal conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this Power Management IC suitable for a variety of environments and applications, including automotive and industrial settings.

No. of Channels: 2

Having multiple channels allows for greater flexibility and efficiency in power management, enabling the IC to handle multiple power sources or loads simultaneously.

Minimum Supply Voltage (Vsup): 2.7 V

A low minimum supply voltage ensures compatibility with a wide range of power sources, making this Power Management IC versatile and adaptable to different systems.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this Power Management IC meets stringent performance and reliability standards required in automotive environments.

Technical Specifications

Power Management ICs TPS70758PWPR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

MANUAL RESET INPUT; POWER ON RESET GENERATOR

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4.4 mm

Trade Compliance

TPS70758PWPR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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