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TPS65192RHDT

Texas Instruments

TPS65192RHDT by Texas Instruments

TPS65192RHDT by Texas Instruments is a 28-terminal interface IC with a supply voltage range of -7V to 30V. It operates in industrial temperatures from -40°C to 85°C, making it suitable for various applications requiring a compact chip carrier package with surface mount capabilities. With a max seated height of 1mm and terminal pitch of 0.5mm, this IC is ideal for space-constrained designs in industries like telecommunications and consumer electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,212 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,212

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Digiode

USA . 1,590 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,590

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 233 parts In-Stock

1+ parts

$6.091

100+ parts

-

1k+ parts

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233

$6.091

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Parana Technologies

USA . 2,219 parts In-Stock

1+ parts

$10.977

100+ parts

-

1k+ parts

$11.439

10k+ parts

-

2,219

$10.977

-

$11.439

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ChromeModa Solutions

Germany . 1,681 parts In-Stock

1+ parts

$12.334

100+ parts

$10.114

1k+ parts

-

10k+ parts

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1,681

$12.334

$10.114

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IDEA Electronic Components Group

UK . 351 parts In-Stock

1+ parts

$12.334

100+ parts

$11.717

1k+ parts

$11.101

10k+ parts

-

351

$12.334

$11.717

$11.101

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One Stop Electronics

USA . 1,044 parts In-Stock

1+ parts

$14.500

100+ parts

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10k+ parts

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1,044

$14.500

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DigiPath Technology Company

USA . 1,899 parts In-Stock

1+ parts

-

100+ parts

$11.120

1k+ parts

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10k+ parts

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1,899

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$11.120

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Corphita

USA . 243 parts In-Stock

1+ parts

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243

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Overview

Discover the power of innovation with the TPS65192RHDT from Texas Instruments. This cutting-edge interface IC offers unparalleled quality and reliability, making it the top choice for a wide range of applications. With a maximum supply voltage of 38V and a nominal supply voltage of 30V, this versatile chip carrier delivers exceptional performance in industrial settings. Say goodbye to compatibility issues and hello to seamless integration with the TPS65192RHDT. Upgrade your technology today and experience the value and benefits that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers good durability and thermal properties, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 38 V

Higher maximum supply voltage provides flexibility and compatibility with various systems and components.

Package Shape: SQUARE

Square package shape can simplify PCB layout and increase efficiency in space utilization.

Power Supplies (V): -7,30

Support for both positive and negative power supplies enables versatile use in different circuit configurations.

No. of Terminals: 28

Having a higher number of terminals allows for more connectivity options and functionality in the circuit design.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This diverse package style offers enhanced thermal management, compact design, and reliability in various applications.

Minimum Supply Voltage: 12 V

Having a lower minimum supply voltage ensures compatibility with a wide range of power sources and systems.

Terminal Position: QUAD

Quad terminal position facilitates easier soldering and assembly onto the PCB, improving overall reliability.

Maximum Seated Height: 1 mm

Low maximum seated height allows for a slim and compact design, suitable for space-constrained applications.

Width: 5 mm

Narrow width enhances versatility in PCB layout and integration, enabling efficient use of space.

Length: 5 mm

Compact length contributes to the overall small footprint of the device, ideal for miniaturized electronics.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh environments and extended operating conditions.

Terminal Form: NO LEAD

No lead terminal form offers better solder joint reliability and improved electrical performance compared to leaded alternatives.

Nominal Supply Voltage: 30 V

Consistent nominal supply voltage ensures stable operation and compatibility with standard power sources.

Nominal Negative Supply Voltage: -7 V

Nominal negative supply voltage support enables efficient integration into dual-power-supply systems and applications.

Terminal Pitch: 0.5 mm

Close terminal pitch allows for high density integration on the PCB, saving valuable board space.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed interface circuit IC type ensures optimal signal processing and communication within the circuit.

Technical Specifications

Other Function Interface ICs TPS65192RHDT attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-PQCC-N28

Length:

5 mm

Nominal Negative Supply Voltage:

-7 V

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

-7,30

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

38 V

Minimum Supply Voltage:

12 V

Nominal Supply Voltage:

30 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

TPS65192RHDT Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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