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TPS65193RGE

Texas Instruments

TPS65193RGE by Texas Instruments

TPS65193RGE by Texas Instruments is a 24-terminal interface IC with a supply voltage range of 15-35V. It operates in industrial temperatures (-40 to 85°C) and has two functions, suitable for various applications requiring a compact chip carrier package with surface mount capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,437 parts In-Stock

1+ parts

-

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1k+ parts

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7,437

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Digiode

USA . 3,660 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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3,660

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,364 parts In-Stock

1+ parts

$4.500

100+ parts

-

1k+ parts

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10k+ parts

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1,364

$4.500

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Parana Technologies

USA . 581 parts In-Stock

1+ parts

$8.534

100+ parts

-

1k+ parts

$9.192

10k+ parts

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581

$8.534

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$9.192

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ChromeModa Solutions

Germany . 5,208 parts In-Stock

1+ parts

$9.589

100+ parts

$7.863

1k+ parts

-

10k+ parts

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5,208

$9.589

$7.863

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IDEA Electronic Components Group

UK . 1,276 parts In-Stock

1+ parts

$9.589

100+ parts

$9.110

1k+ parts

$8.630

10k+ parts

-

1,276

$9.589

$9.110

$8.630

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AZTECH Wire

Italy . 601 parts In-Stock

1+ parts

$16.743

100+ parts

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601

$16.743

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Corphita

USA . 3,568 parts In-Stock

1+ parts

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3,568

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DigiPath Technology Company

USA . 32 parts In-Stock

1+ parts

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100+ parts

$8.645

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32

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$8.645

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Overview

Unlock the potential of your electronic devices with the TPS65193RGE by Texas Instruments. Crafted with precision and expertise, this product offers unparalleled quality and reliability. Ideal for a wide range of applications in the category of Other Function Interface ICs, this innovative solution provides customers with unmatched value and benefits. Experience seamless operation, enhanced performance, and increased efficiency with the TPS65193RGE. Elevate your projects to new heights with Texas Instruments, a trusted name in the industry known for delivering cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides good insulation and protection for the components inside, ensuring durability and reliability.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on circuit boards, saving space and making it ideal for compact electronic devices.

Maximum Supply Voltage: 35 V

Higher maximum supply voltage allows for flexibility in power input, making it suitable for a wide range of applications.

No. of Functions: 2

Having multiple functions in one IC reduces the need for additional components, simplifying circuit design and potentially reducing cost.

Package Shape: SQUARE

Square package shape is space-efficient and facilitates easier placement on circuit boards, enhancing overall design flexibility.

No. of Terminals: 24

Having a higher number of terminals allows for more connections and functionality, making this IC versatile and suitable for complex systems.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design ensures efficient heat dissipation and compact integration, making it well-suited for devices with thermal constraints.

Minimum Supply Voltage: 15 V

Lower minimum supply voltage enables operation in systems with varying power requirements, offering more flexibility in application.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in harsh conditions or environments where elevated temperatures are a concern.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in cold environments without compromising performance, making it suitable for a wide range of applications.

Terminal Position: QUAD

Quad terminal position enhances connectivity and ease of integration, allowing for efficient signal routing and optimal circuit layout.

Maximum Seated Height: 1 mm

Low seated height enables a slim profile and compact design, making it suitable for space-constrained applications where size matters.

Width: 4 mm

Narrow width offers space-saving benefits and allows for compact placement on circuit boards, optimizing board layout and design.

Length: 4 mm

Short length contributes to a compact form factor and efficient use of space, making it ideal for applications with size restrictions.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in demanding industrial environments where temperature fluctuations are common, making it a robust choice for industrial applications.

Terminal Form: NO LEAD

No-lead terminal form simplifies assembly and reduces the risk of solder joint failures, enhancing reliability and ease of manufacturing.

Nominal Supply Voltage: 30 V

Stable nominal supply voltage ensures consistent operation within specified limits, offering reliability and performance predictability in various applications.

Nominal Negative Supply Voltage: -10 V

Having a negative supply voltage option expands the potential applications of this IC, providing flexibility in system design and operation.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density interconnections, enabling complex circuit designs and maximizing functionality in limited space.

Interface IC Type: INTERFACE CIRCUIT

Being an interface circuit IC, this product facilitates communication between different components or systems, enabling seamless integration and enhanced functionality in a variety of applications.

Technical Specifications

Other Function Interface ICs TPS65193RGE attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-PQCC-N24

Length:

4 mm

Nominal Negative Supply Voltage:

-10 V

No. of Functions:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

35 V

Minimum Supply Voltage:

15 V

Nominal Supply Voltage:

30 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

TPS65193RGE Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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