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TPS65982ABZBHR

Texas Instruments

TPS65982ABZBHR by Texas Instruments

TPS65982ABZBHR by Texas Instruments is a 96-terminal interface IC with supply voltage range of 2.85V to 3.45V, operating temperature from -10°C to 85°C. It features a grid array package style with very thin profile and fine pitch, suitable for applications requiring precise power management in compact electronic devices.

Median Price

$10.480

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 31,866 parts In-Stock

1+ parts

$8.547

100+ parts

$6.968

1k+ parts

$4.645

10k+ parts

-

31,866

$8.547

$6.968

$4.645

-

Mouser Electronics

USA . 6,655 parts In-Stock

1+ parts

$10.480

100+ parts

$7.620

1k+ parts

-

10k+ parts

$7.440

6,655

$10.480

$7.620

-

$7.440

DigiKey

USA . 94 parts In-Stock

1+ parts

$10.480

100+ parts

$7.618

1k+ parts

-

10k+ parts

$6.201

94

$10.480

$7.618

-

$6.201

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,352 parts In-Stock

1+ parts

$8.120

100+ parts

-

1k+ parts

-

10k+ parts

-

1,352

$8.120

-

-

-

Vyrian

USA . 2,539 parts In-Stock

1+ parts

$8.547

100+ parts

-

1k+ parts

-

10k+ parts

-

2,539

$8.547

-

-

-

Cyclops Electronics Ltd

UK . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Inventory MP

USA . 15 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15

-

-

-

-

Bristol Electronics

USA . 15 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,166 parts In-Stock

1+ parts

$6.872

100+ parts

-

1k+ parts

$7.491

10k+ parts

-

2,166

$6.872

-

$7.491

-

Component Stockers USA

USA . 43,999 parts In-Stock

1+ parts

$7.540

100+ parts

$7.160

1k+ parts

$4.960

10k+ parts

$4.960

43,999

$7.540

$7.160

$4.960

$4.960

Corphita

USA . 1,649 parts In-Stock

1+ parts

$7.692

100+ parts

-

1k+ parts

-

10k+ parts

-

1,649

$7.692

-

-

-

ChromeModa Solutions

Germany . 4,196 parts In-Stock

1+ parts

$7.721

100+ parts

$6.331

1k+ parts

-

10k+ parts

-

4,196

$7.721

$6.331

-

-

IDEA Electronic Components Group

UK . 1,813 parts In-Stock

1+ parts

$7.721

100+ parts

-

1k+ parts

$6.949

10k+ parts

-

1,813

$7.721

-

$6.949

-

Microchip USA

USA . 15 parts In-Stock

1+ parts

$17.080

100+ parts

$16.830

1k+ parts

$16.710

10k+ parts

$16.590

15

$17.080

$16.830

$16.710

$16.590

Lixinc

USA . 19,540 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19,540

-

-

-

-

GreenTree Electronics

Israel . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 4,043 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,043

-

-

-

-

DigiPath Technology Company

USA . 899 parts In-Stock

1+ parts

-

100+ parts

$6.961

1k+ parts

-

10k+ parts

-

899

-

$6.961

-

-

Overview

Unlock the potential of your electronic devices with the TPS65982ABZBHR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that exceed expectations. This innovative interface IC offers seamless connectivity and enhanced functionality, making it the perfect solution for a wide range of applications. Experience the reliability, flexibility, and performance that Texas Instruments is known for, and take your projects to the next level with the TPS65982ABZBHR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and reliable for ensuring the longevity and performance of the product.

Surface Mount: YES

Allows for easy and efficient installation onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.45 V

Suitable for a wide range of applications without risk of damage from excessive voltage.

Package Shape: SQUARE

Optimal shape for efficient use of space on the circuit board and for compact devices.

No. of Terminals: 96

Provides ample connectivity options for various functions and interfaces.

Minimum Operating Temperature: -10 °C

Ensures functionality even in low temperature environments, increasing versatility of the product.

Terminal Finish: TIN SILVER COPPER

Provides good conductivity and corrosion resistance for reliable connections.

Width: 6 mm

Compact size for efficient use of space on the circuit board.

Nominal Supply Voltage: 3.3 V

Standard voltage level compatible with many electronic devices for easy integration.

Terminal Pitch: 0.5 mm

Fine pitch for high density mounting, suitable for advanced electronics.

Technical Specifications

Other Function Interface ICs TPS65982ABZBHR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-PBGA-B96

JESD-609 Code:

e1

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

96

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.45 V

Minimum Supply Voltage:

2.85 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

TPS65982ABZBHR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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