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ISO7742FDWR

Texas Instruments

ISO7742FDWR by Texas Instruments

ISO7742FDWR by Texas Instruments is a 16-terminal IC with 4 functions, operating b/w -55 to 125 °C. It features a supply voltage range of 2.25-5.5 V and uses CMOS technology. Ideal for military-grade applications requiring interface circuitry in compact spaces.

Median Price

$2.736

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,748 parts In-Stock

1+ parts

$1.911

100+ parts

$1.578

1k+ parts

$0.853

10k+ parts

-

7,748

$1.911

$1.578

$0.853

-

Mouser Electronics

USA . 37 parts In-Stock

1+ parts

$3.560

100+ parts

$2.220

1k+ parts

$2.030

10k+ parts

$1.880

37

$3.560

$2.220

$2.030

$1.880

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,137 parts In-Stock

1+ parts

$1.815

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3,137

$1.815

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Nova Conductors

Japan . 29 parts In-Stock

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$1.983

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29

$1.983

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Maritex

Poland . 1 parts In-Stock

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$2.811

100+ parts

$1.754

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$1.426

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1

$2.811

$1.754

$1.426

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Chip Stock

USA . 90,940 parts In-Stock

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Component Sense

UK . 15,288 parts In-Stock

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Vyrian

USA . 5,962 parts In-Stock

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Cyclops Electronics Ltd

UK . 2,750 parts In-Stock

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2,750

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Prism Electronics

USA . 6 parts In-Stock

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6

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Distributors (Availability)

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Semicontronic

India . 5,972 parts In-Stock

1+ parts

$1.620

100+ parts

$1.580

1k+ parts

$1.571

10k+ parts

-

5,972

$1.620

$1.580

$1.571

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Ampacity Inc.

Singapore . 5,819 parts In-Stock

1+ parts

$1.620

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5,819

$1.620

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Corphita

USA . 1,829 parts In-Stock

1+ parts

$1.720

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1,829

$1.720

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Argo Parts USA

USA . 4,059 parts In-Stock

1+ parts

$1.983

100+ parts

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4,059

$1.983

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Continental Prestige Electronics

USA . 59 parts In-Stock

1+ parts

$1.983

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$1.943

59

$1.983

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$1.943

Corohmni

South Africa . 533 parts In-Stock

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$2.115

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533

$2.115

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$2.178

100+ parts

$2.070

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$2.070

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1,000

$2.178

$2.070

$2.070

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Parana Technologies

USA . 3 parts In-Stock

1+ parts

$7.946

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$8.511

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3

$7.946

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$8.511

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ChromeModa Solutions

Germany . 3,085 parts In-Stock

1+ parts

$8.928

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$7.321

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3,085

$8.928

$7.321

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IDEA Electronic Components Group

UK . 1,733 parts In-Stock

1+ parts

$8.928

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$8.482

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$8.035

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1,733

$8.928

$8.482

$8.035

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Lixinc

USA . 8,999 parts In-Stock

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Perfect Parts

USA . 6,720 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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GreenTree Electronics

Israel . 2,000 parts In-Stock

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DigiPath Technology Company

USA . 1,880 parts In-Stock

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$8.049

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A-Z Elektronik GmbH

Germany . 1,548 parts In-Stock

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Robosynatics

Brazil . 250 parts In-Stock

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Lucentia Tech

USA . 250 parts In-Stock

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$19.363

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$19.363

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$19.363

250

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$19.363

$19.363

$19.363

Overview

Experience unmatched quality and reliability with the Texas Instruments ISO7742FDWR, a cutting-edge product in the category of Other Function Interface ICs. This innovative solution offers customers a wide array of applications with its 4 functions and military-grade temperature grade. With a small outline package style and dual terminal position, this product provides maximum value and benefits to users seeking top-notch performance and seamless integration. Trust in Texas Instruments for superior technology and choose the ISO7742FDWR for all your interface circuit needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, ensuring reliability in various environments.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and costs in production.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltage requirements, making it versatile for different applications.

No. of Functions: 4

Offers multiple functions in a single IC, reducing the need for additional components and simplifying the circuit design.

Package Shape: RECTANGULAR

Facilitates easy placement and orientation during assembly, improving the efficiency of the manufacturing process.

No. of Terminals: 16

Provides ample connection points for interfacing with other components or peripherals, enhancing the versatility of the IC.

Package Style (Meter): SMALL OUTLINE

Compact size saves space on the circuit board and allows for high-density layouts in electronic devices.

Minimum Supply Voltage: 2.25 V

Supports lower voltage operation, making the IC suitable for power-sensitive applications.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, ensuring stable performance in demanding conditions.

Minimum Operating Temperature: -55 °C

Capable of operating in extreme cold environments, making it suitable for a wide range of applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides excellent conductivity and corrosion resistance for reliable connections over time.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit board layout and enhances signal integrity.

Maximum Seated Height: 2.65 mm

Low profile design saves space and allows for compact integration into electronic devices.

Width: 7.5 mm

Compact width facilitates efficient placement on the circuit board and enables high-density layouts.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during assembly, ensuring proper soldering and connection reliability.

Length: 10.3 mm

Standard length allows for easy integration into different electronic systems.

Temperature Grade: MILITARY

Meets rigorous military standards for operation in harsh environments, making it suitable for defense and aerospace applications.

No. of Channels: 4

Multiple channels allow for simultaneous data or signal processing, increasing efficiency in communication or control applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-powered devices and noise-sensitive applications.

Terminal Form: GULL WING

Gull wing terminals provide a secure and reliable connection to the circuit board during assembly and operation.

Nominal Supply Voltage: 2.5 V

Optimal voltage level for stable and efficient operation of the IC in various applications.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy connection and compatibility with common circuit board layouts.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates that the IC can withstand moderate moisture exposure during storage and assembly processes.

Interface IC Type: INTERFACE CIRCUIT

Designed specifically for interfacing and communication tasks, making it a reliable choice for various interface applications.

Technical Specifications

Other Function Interface ICs ISO7742FDWR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRED VCC2 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

ISO7742FDWR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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