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TPS65132B0YFFR

Texas Instruments

TPS65132B0YFFR by Texas Instruments

TPS65132B0YFFR by Texas Instruments is a consumer IC with 15 terminals in a grid array package. It operates b/w -40°C to 85°C, with Vsup ranging from 2.5V to 5.5V. This IC is ideal for industrial applications requiring a very thin profile and fine pitch design.

Median Price

$0.719

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,600 parts In-Stock

1+ parts

$0.719

100+ parts

$0.630

1k+ parts

$0.356

10k+ parts

-

8,600

$0.719

$0.630

$0.356

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 92 parts In-Stock

1+ parts

$0.482

100+ parts

-

1k+ parts

-

10k+ parts

-

92

$0.482

-

-

-

Digiode

USA . 4,784 parts In-Stock

1+ parts

$0.683

100+ parts

-

1k+ parts

-

10k+ parts

-

4,784

$0.683

-

-

-

Vyrian

USA . 8,799 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,799

-

-

-

-

Bristol Electronics

USA . 8,636 parts In-Stock

1+ parts

-

100+ parts

$0.467

1k+ parts

$0.349

10k+ parts

$0.324

8,636

-

$0.467

$0.349

$0.324

Dan-Mar Components

USA . 8,636 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,636

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 4,275 parts In-Stock

1+ parts

$0.482

100+ parts

-

1k+ parts

-

10k+ parts

$0.467

4,275

$0.482

-

-

$0.467

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.482

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

$0.482

-

-

-

Continental Prestige Electronics

USA . 29 parts In-Stock

1+ parts

$0.482

100+ parts

-

1k+ parts

-

10k+ parts

$0.472

29

$0.482

-

-

$0.472

Ampacity Inc.

Singapore . 8,185 parts In-Stock

1+ parts

$0.610

100+ parts

-

1k+ parts

-

10k+ parts

-

8,185

$0.610

-

-

-

Corphita

USA . 833 parts In-Stock

1+ parts

$0.647

100+ parts

-

1k+ parts

-

10k+ parts

-

833

$0.647

-

-

-

Parana Technologies

USA . 1,349 parts In-Stock

1+ parts

$2.584

100+ parts

-

1k+ parts

$3.076

10k+ parts

-

1,349

$2.584

-

$3.076

-

ChromeModa Solutions

Germany . 3,168 parts In-Stock

1+ parts

$2.903

100+ parts

$2.380

1k+ parts

-

10k+ parts

-

3,168

$2.903

$2.380

-

-

IDEA Electronic Components Group

UK . 625 parts In-Stock

1+ parts

$2.903

100+ parts

-

1k+ parts

$2.613

10k+ parts

-

625

$2.903

-

$2.613

-

Microchip USA

USA . 1,471 parts In-Stock

1+ parts

$3.272

100+ parts

-

1k+ parts

-

10k+ parts

-

1,471

$3.272

-

-

-

AZTECH Wire

Italy . 535 parts In-Stock

1+ parts

$21.090

100+ parts

-

1k+ parts

-

10k+ parts

-

535

$21.090

-

-

-

Kepictronics

USA . 24,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

24,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 9,182 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,182

-

-

-

-

Infinite Electronics LLP (Excess)

. 1,004 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,004

-

-

-

-

DigiPath Technology Company

USA . 801 parts In-Stock

1+ parts

-

100+ parts

$2.617

1k+ parts

-

10k+ parts

-

801

-

$2.617

-

-

Overview

Upgrade your consumer electronics with the TPS65132B0YFFR by Texas Instruments. With a reputation for high-quality manufacturing, Texas Instruments delivers top-of-the-line products like this one to ensure superior performance and reliability. This versatile IC is ideal for a variety of applications in the consumer electronics industry. Experience the value and benefits of this product, from its compact size and wide temperature range to its efficient power management capabilities. Trust Texas Instruments to provide the innovative solutions you need for your next project.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Package Shape: RECTANGULAR

Fits well in compact electronic devices, saving space.

General IC Type: CONSUMER CIRCUIT

Designed for use in consumer electronic products, ensuring compatibility.

No. of Terminals: 15

Provides multiple connections for various functions within the circuit.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Offers a sleek design that is ideal for modern electronics.

Maximum Operating Temperature: 85 °C

Ensures stable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Can withstand extreme temperature fluctuations without malfunctioning.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Provides a reliable and durable connection between components.

Terminal Position: BOTTOM

Facilitates easy and tidy soldering of the IC onto the circuit board.

Maximum Seated Height: 0.625 mm

Low profile design is suitable for thin electronic devices.

Width: 1.514 mm

Compact size allows for integration into small electronic products.

Minimum Supply Voltage (Vsup): 2.5 V

Can operate efficiently with low power input, saving energy.

Length: 2.108 mm

Offers a balanced form factor for various electronic applications.

Temperature Grade: INDUSTRIAL

Meets industrial standards for high-performance and durability.

Terminal Form: BALL

Helps to ensure secure connections and prevent disconnection issues.

Terminal Pitch: 0.4 mm

Provides precise spacing for accurate connections on the circuit board.

Maximum Supply Voltage (Vsup): 5.5 V

Can handle higher voltage inputs without damage, increasing versatility.

Technical Specifications

Other Function Consumer ICs TPS65132B0YFFR attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-XBGA-B15

JESD-609 Code:

e1

Length:

2.108 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

15

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.514 mm

Trade Compliance

TPS65132B0YFFR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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