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TPS65132BYFFR

Texas Instruments

TPS65132BYFFR by Texas Instruments

TPS65132BYFFR by Texas Instruments is a consumer IC with 15 terminals in a rectangular package. It operates b/w -40 to 85°C, with Vsup ranging from 2.5V to 5.5V. This IC is ideal for industrial applications requiring a very thin profile and fine pitch grid array package style.

Median Price

$0.719

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 38,725 parts In-Stock

1+ parts

$0.719

100+ parts

$0.630

1k+ parts

$0.356

10k+ parts

-

38,725

$0.719

$0.630

$0.356

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.356

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$0.356

-

-

-

Digiode

USA . 2,918 parts In-Stock

1+ parts

$0.683

100+ parts

-

1k+ parts

-

10k+ parts

-

2,918

$0.683

-

-

-

Vyrian

USA . 2,934 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,934

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bastille Electronics

Australia . 1,000 parts In-Stock

1+ parts

$0.356

100+ parts

$0.338

1k+ parts

$0.321

10k+ parts

$0.317

1,000

$0.356

$0.338

$0.321

$0.317

Ampacity Inc.

Singapore . 38,302 parts In-Stock

1+ parts

$0.610

100+ parts

-

1k+ parts

-

10k+ parts

-

38,302

$0.610

-

-

-

Corphita

USA . 4,395 parts In-Stock

1+ parts

$0.647

100+ parts

-

1k+ parts

-

10k+ parts

-

4,395

$0.647

-

-

-

Parana Technologies

USA . 1,155 parts In-Stock

1+ parts

$2.745

100+ parts

-

1k+ parts

$3.229

10k+ parts

-

1,155

$2.745

-

$3.229

-

DigiPath Technology Company

USA . 1,443 parts In-Stock

1+ parts

$3.022

100+ parts

$2.781

1k+ parts

-

10k+ parts

-

1,443

$3.022

$2.781

-

-

IDEA Electronic Components Group

UK . 1,455 parts In-Stock

1+ parts

$3.084

100+ parts

-

1k+ parts

$2.776

10k+ parts

-

1,455

$3.084

-

$2.776

-

ChromeModa Solutions

Germany . 282 parts In-Stock

1+ parts

$3.084

100+ parts

$2.529

1k+ parts

-

10k+ parts

-

282

$3.084

$2.529

-

-

AZTECH Wire

Italy . 849 parts In-Stock

1+ parts

$17.510

100+ parts

-

1k+ parts

-

10k+ parts

-

849

$17.510

-

-

-

Assy Fe

Spain . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

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Kepictronics

USA . 874 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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874

-

-

-

-

Overview

Enhance your electronic devices with the TPS65132BYFFR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-quality products that deliver exceptional performance. This versatile consumer IC is ideal for a wide range of applications, offering reliability and efficiency. With its compact design and advanced features, the TPS65132BYFFR provides customers with value, convenience, and peace of mind. Upgrade your electronics with this innovative solution today!

Feature Benefit Bullets

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving design.

Package Shape: RECTANGULAR

The rectangular shape of the package provides stability and compactness.

General IC Type: CONSUMER CIRCUIT

Specifically designed for consumer electronics applications, ensuring compatibility and efficiency.

No. of Terminals: 15

Sufficient number of terminals for connecting various components, enhancing functionality.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array style offers high density and efficient signal routing capabilities.

Maximum Operating Temperature: 85 °C

Operates reliably at high temperatures, suitable for industrial use.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, making it versatile for various environments.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Provides excellent corrosion resistance and electrical conductivity.

Terminal Position: BOTTOM

Bottom terminal positioning allows for easy PCB layout and assembly.

Maximum Seated Height: 0.625 mm

Low profile design saves space and allows for compact device assembly.

Technical Specifications

Other Function Consumer ICs TPS65132BYFFR attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-XBGA-B15

JESD-609 Code:

e1

Length:

2.108 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

15

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.514 mm

Trade Compliance

TPS65132BYFFR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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