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TPS65950A2ZXN

Texas Instruments

TPS65950A2ZXN by Texas Instruments

TPS65950A2ZXN by Texas Instruments is a consumer IC with 209 terminals in a square package. It operates b/w -40 to 85°C, with supply voltage ranging from 2.7V to 4.5V. Ideal for industrial applications requiring a very thin profile and fine pitch grid array design.

Median Price

$8.405

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,799 parts In-Stock

1+ parts

$6.400

100+ parts

$6.270

1k+ parts

$6.140

10k+ parts

-

3,799

$6.400

$6.270

$6.140

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Arrow

USA . 435 parts In-Stock

1+ parts

$8.347

100+ parts

-

1k+ parts

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435

$8.347

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Verical

USA . 435 parts In-Stock

1+ parts

$8.347

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435

$8.347

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Texas Instruments

USA . 40,056 parts In-Stock

1+ parts

$10.020

100+ parts

$8.752

1k+ parts

$6.036

10k+ parts

-

40,056

$10.020

$8.752

$6.036

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DigiKey

USA . 362 parts In-Stock

1+ parts

$15.110

100+ parts

$10.290

1k+ parts

$9.615

10k+ parts

$9.412

362

$15.110

$10.290

$9.615

$9.412

Chip1Stop

Japan . 780 parts In-Stock

1+ parts

-

100+ parts

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$8.405

10k+ parts

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780

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-

$8.405

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Avnet

USA . 520 parts In-Stock

1+ parts

-

100+ parts

-

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$8.924

10k+ parts

$8.215

520

-

-

$8.924

$8.215

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,223 parts In-Stock

1+ parts

$6.080

100+ parts

-

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3,223

$6.080

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Vyrian

USA . 6,516 parts In-Stock

1+ parts

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6,516

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Chip Stock

USA . 3,500 parts In-Stock

1+ parts

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3,500

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HZD GmbH

Germany . 1,000 parts In-Stock

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1,000

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Resion

USA . 20 parts In-Stock

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20

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Semi Source

USA . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 349 parts In-Stock

1+ parts

$1.356

100+ parts

$125.959

1k+ parts

$1.221

10k+ parts

-

349

$1.356

$125.959

$1.221

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DigiPath Technology Company

USA . 242 parts In-Stock

1+ parts

$1.494

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242

$1.494

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ChromeModa Solutions

Germany . 2,004 parts In-Stock

1+ parts

$1.524

100+ parts

$1.250

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2,004

$1.524

$1.250

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IDEA Electronic Components Group

UK . 934 parts In-Stock

1+ parts

$1.524

100+ parts

-

1k+ parts

$1.372

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934

$1.524

-

$1.372

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Corphita

USA . 344 parts In-Stock

1+ parts

$5.760

100+ parts

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344

$5.760

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S.R.D Solutions

India . 33,000 parts In-Stock

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33,000

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Lixinc

USA . 8,763 parts In-Stock

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8,763

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Perfect Parts

USA . 7,924 parts In-Stock

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7,924

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A-Z Elektronik GmbH

Germany . 5,924 parts In-Stock

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5,924

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Speed Components Ltd (Excess)

Israel . 273 parts In-Stock

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273

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Kepictronics

USA . 179 parts In-Stock

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179

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Overview

Enhance your electronic devices with the TPS65950A2ZXN from Texas Instruments, a leading manufacturer known for high-quality products. This versatile consumer IC offers a wide range of applications and benefits, providing customers with increased efficiency and performance. With a durable plastic/epoxy body and advanced technology, this product ensures reliability and longevity. Upgrade your devices today with the TPS65950A2ZXN and experience the difference in quality and innovation that Texas Instruments delivers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection to the IC, making it reliable for long-term use.

Surface Mount: YES

Being surface mountable allows for easy installation on PCBs, saving space and simplifying assembly processes.

Package Shape: SQUARE

The square package shape is efficient for compact placement on the circuit board, optimizing space utilization.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring compatibility and performance in various consumer electronic devices.

No. of Terminals: 209

The high number of terminals allows for complex connectivity and functionality, suitable for advanced electronic designs.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array style with a thin profile and fine pitch enhances signal integrity and thermal performance, crucial for high-speed applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the IC can withstand elevated environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures functionality in extreme cold environments, expanding the range of applications for the IC.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper offers excellent conductivity and resistance to corrosion, ensuring stable electrical connections.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates easier soldering and ensures a secure connection to the PCB, improving overall reliability.

Maximum Seated Height: 1 mm

The low seated height enables a slim profile for the IC, beneficial for space-constrained applications and compact electronic devices.

Width: 7 mm

The compact width allows for efficient placement on the PCB, optimizing board real estate and supporting high-density circuit designs.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage requirement ensures compatibility with a wide range of power sources, enhancing versatility in design.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering during assembly, preventing overheating or damage to the IC.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance of 260°C guarantees reliable solder joints and robustness during the manufacturing process.

Length: 7 mm

The short length of the IC allows for space-saving installation on the PCB, ideal for compact electronic devices and tight layouts.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, ensuring ruggedness, reliability, and performance in harsh operating environments.

Terminal Form: BALL

The ball terminal form provides a secure and reliable connection to the PCB, minimizing the risk of solder joints breaking or disconnecting.

Terminal Pitch: 0.4 mm

The fine terminal pitch of 0.4mm allows for high-density interconnection, enabling advanced circuit designs and functionality.

Moisture Sensitivity Level (MSL): 3

With a moderate moisture sensitivity level of 3, the IC can withstand standard PCB storage and assembly conditions without the risk of moisture damage.

Maximum Supply Voltage (Vsup): 4.5 V

The high maximum supply voltage capability of 4.5V ensures compatibility with various power sources and operating conditions, enhancing flexibility in application design.

Technical Specifications

Other Function Consumer ICs TPS65950A2ZXN attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B209

JESD-609 Code:

e1

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

209

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TPS65950A2ZXN General Purpose ICs trade compliance attributes, and parameters.

ECCN

5A991.G

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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