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TPS65132T6YFFT

Texas Instruments

TPS65132T6YFFT by Texas Instruments

TPS65132T6YFFT by Texas Instruments is a consumer IC with 15 terminals in a grid array package. It operates b/w -40°C to 85°C, with Vsup ranging from 2.5V to 5.5V. This IC is ideal for industrial applications requiring a very thin profile and fine pitch design.

Median Price

$0.834

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 20,050 parts In-Stock

1+ parts

$1.188

100+ parts

$0.914

1k+ parts

$0.481

10k+ parts

-

20,050

$1.188

$0.914

$0.481

-

DigiKey

USA . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.724

10k+ parts

-

750

-

-

$0.724

-

Rochester

USA . 170 parts In-Stock

1+ parts

-

100+ parts

$0.834

1k+ parts

$0.692

10k+ parts

$0.617

170

-

$0.834

$0.692

$0.617

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,854 parts In-Stock

1+ parts

$0.635

100+ parts

-

1k+ parts

-

10k+ parts

-

2,854

$0.635

-

-

-

Vyrian

USA . 6,139 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,139

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,523 parts In-Stock

1+ parts

$0.601

100+ parts

-

1k+ parts

-

10k+ parts

-

2,523

$0.601

-

-

-

Parana Technologies

USA . 1,700 parts In-Stock

1+ parts

$3.538

100+ parts

-

1k+ parts

$4.061

10k+ parts

-

1,700

$3.538

-

$4.061

-

ChromeModa Solutions

Germany . 3,462 parts In-Stock

1+ parts

$3.975

100+ parts

$3.260

1k+ parts

-

10k+ parts

-

3,462

$3.975

$3.260

-

-

IDEA Electronic Components Group

UK . 1,715 parts In-Stock

1+ parts

$3.975

100+ parts

-

1k+ parts

$3.578

10k+ parts

-

1,715

$3.975

-

$3.578

-

Microchip USA

USA . 2,293 parts In-Stock

1+ parts

$6.789

100+ parts

-

1k+ parts

-

10k+ parts

-

2,293

$6.789

-

-

-

DigiPath Technology Company

USA . 1,992 parts In-Stock

1+ parts

-

100+ parts

$3.584

1k+ parts

-

10k+ parts

-

1,992

-

$3.584

-

-

Overview

Experience cutting-edge technology with the TPS65132T6YFFT by Texas Instruments. Crafted with precision and expertise, this consumer circuit offers unparalleled performance in a variety of applications. From grid arrays to thin profile designs, this IC is built for efficiency and reliability. With a wide operating temperature range and industrial-grade quality, customers can trust in the durability and longevity of this product. Elevate your projects with the value and benefits that only Texas Instruments can provide.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for smaller and more compact designs, making the product suitable for space-constrained applications.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and easily mountable, providing ease of integration into various electronic systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and maintain stable performance.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature ensures the product can operate in both extreme cold and hot conditions.

Minimum Supply Voltage (Vsup): 2.5 V

Low minimum supply voltage requirement makes the product energy-efficient and suitable for battery-operated devices.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage allows for flexibility in power input options and compatibility with a wide range of systems.

Technical Specifications

Other Function Consumer ICs TPS65132T6YFFT attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-XBGA-B15

JESD-609 Code:

e1

Length:

2.108 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

15

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.514 mm

Trade Compliance

TPS65132T6YFFT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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