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TPS2320IPWRG4

Texas Instruments

TPS2320IPWRG4 by Texas Instruments

TPS2320IPWRG4 by Texas Instruments is a Power Management IC with 16 terminals, supporting supply voltages of 3.3/5,3/13V. It has a max output current of 500A and operates in temperatures ranging from -40 to 85°C. Ideal for industrial applications requiring power supply support circuits in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,082 parts In-Stock

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6,082

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Chip Stock

USA . 3,700 parts In-Stock

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3,700

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Digiode

USA . 2,716 parts In-Stock

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2,716

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Distributors (Availability)

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Semicontronic

India . 1,440 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

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-

1,440

$0.500

$0.488

$0.485

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Ampacity Inc.

Singapore . 625 parts In-Stock

1+ parts

$3.500

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-

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625

$3.500

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One Stop Electronics

USA . 1,634 parts In-Stock

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$6.500

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1,634

$6.500

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AZTECH Wire

Italy . 640 parts In-Stock

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$17.609

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640

$17.609

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Parana Technologies

USA . 1,476 parts In-Stock

1+ parts

$22.218

100+ parts

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$22.873

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1,476

$22.218

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$22.873

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ChromeModa Solutions

Germany . 6,085 parts In-Stock

1+ parts

$24.964

100+ parts

$20.470

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6,085

$24.964

$20.470

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IDEA Electronic Components Group

UK . 652 parts In-Stock

1+ parts

$24.964

100+ parts

$23.716

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$22.468

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652

$24.964

$23.716

$22.468

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QUARKTWIN TECHNOLOGY LTD

USA . 5,673 parts In-Stock

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5,673

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Corphita

USA . 2,149 parts In-Stock

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2,149

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Kepictronics

USA . 2,100 parts In-Stock

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Microchip USA

USA . 1,193 parts In-Stock

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1,193

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DigiPath Technology Company

USA . 340 parts In-Stock

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$22.508

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340

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$22.508

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Corohmni

South Africa . 249 parts In-Stock

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249

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A-Z Elektronik GmbH

Germany . 225 parts In-Stock

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225

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Overview

Elevate your power management with the TPS2320IPWRG4 by Texas Instruments. Known for their industry-leading quality and reliability, Texas Instruments delivers top-notch Power Management ICs like no other. This product offers customers unmatched value with its versatile applications across various industries. With a compact package body material, surface mount capabilities, and adjustable threshold, the TPS2320IPWRG4 provides superior performance and efficiency. Experience the benefits of this innovative technology and elevate your power management solutions today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability of the package, making it suitable for rugged industrial environments.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and reducing assembly time.

Nominal Supply Voltage (Vsup): 4.5 V

Optimal 4.5V supply voltage ensures stable and efficient operation of the device.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style with thin profile and shrink pitch saves board space, making it ideal for compact electronic devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C allows the device to function reliably in harsh industrial environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/Palladium/Gold terminal finish ensures high conductivity and corrosion resistance for reliable connections.

Width (mm): 4.4 mm

Narrow width of 4.4mm facilitates easy placement on PCBs, especially in space-constrained applications.

Maximum Supply Current (Isup): 1 mA

Low maximum supply current of 1mA ensures energy efficiency and minimal power consumption.

Maximum Output Current: 500 A

High maximum output current of 500A allows the device to power multiple channels or components simultaneously.

Technical Specifications

Power Management ICs TPS2320IPWRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

REQUIRES 3V TO 5.5V SUPPLY FOR CHANNEL 2

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

500 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5,3/13

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

1 mA

Maximum Supply Voltage (Vsup):

13 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4.4 mm

Trade Compliance

TPS2320IPWRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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