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TPS2320IDRG4

Texas Instruments

TPS2320IDRG4 by Texas Instruments

TPS2320IDRG4 by Texas Instruments is a Power Management IC with 16 terminals, operating at -40 to 85°C. It supports supply voltages of 3-13V and has dual terminal position. Ideal for industrial applications requiring power supply support circuits in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,408 parts In-Stock

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3,408

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Vyrian

USA . 1,913 parts In-Stock

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1,913

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,558 parts In-Stock

1+ parts

$2.500

100+ parts

$2.438

1k+ parts

$2.425

10k+ parts

-

1,558

$2.500

$2.438

$2.425

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One Stop Electronics

USA . 526 parts In-Stock

1+ parts

$2.500

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526

$2.500

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Ampacity Inc.

Singapore . 1,211 parts In-Stock

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$3.500

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1,211

$3.500

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AZTECH Wire

Italy . 539 parts In-Stock

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$9.110

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539

$9.110

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Parana Technologies

USA . 800 parts In-Stock

1+ parts

$18.535

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$18.647

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800

$18.535

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$18.647

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DigiPath Technology Company

USA . 2,304 parts In-Stock

1+ parts

$20.409

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2,304

$20.409

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ChromeModa Solutions

Germany . 1,349 parts In-Stock

1+ parts

$20.826

100+ parts

$17.077

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1,349

$20.826

$17.077

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IDEA Electronic Components Group

UK . 1,216 parts In-Stock

1+ parts

$20.826

100+ parts

$19.785

1k+ parts

$18.743

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1,216

$20.826

$19.785

$18.743

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Component Stockers USA

USA . 467 parts In-Stock

1+ parts

$99.990

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467

$99.990

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Corphita

USA . 1,711 parts In-Stock

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1,711

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Microchip USA

USA . 235 parts In-Stock

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Corohmni

South Africa . 97 parts In-Stock

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Overview

Unleash the power of innovation with the TPS2320IDRG4 by Texas Instruments, a cutting-edge Power Management IC that stands out for its superior quality and reliability. Designed to meet the highest industry standards, this product offers unparalleled performance in a wide range of applications. With Texas Instruments' reputation for excellence in manufacturing, you can trust that you are getting a top-of-the-line product that delivers value, benefits, and advantages to customers. Upgrade your power supply systems with the TPS2320IDRG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is cost-effective and durable, making this product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving time and space.

Nominal Supply Voltage (Vsup): 4.5 V

4.5V supply voltage ensures compatibility with a wide range of systems and devices.

Power Supplies (V): 3.3/5,3/13

Multiple power supply options cater to different voltage requirements, increasing flexibility in design.

No. of Terminals: 16

16 terminals provide ample connectivity options for interfacing with other components.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in harsh cold conditions without performance degradation.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Width (mm): 3.9 mm

Compact width of 3.9mm saves space on the PCB, ideal for compact device designs.

Minimum Supply Voltage (Vsup): 3 V

Minimum supply voltage of 3V ensures compatibility with low-power systems and devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures stable performance in rugged operating conditions.

No. of Channels: 2

Dual channels allow for independent control or monitoring of two separate power pathways, enhancing system versatility.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable soldering connections for stable signal transmission.

Maximum Supply Voltage (Vsup): 13 V

With a maximum supply voltage of 13V, this product can handle higher voltage applications effectively.

Adjustable Threshold: YES

Adjustable threshold feature allows for customization of trigger levels, adapting to different system requirements.

Technical Specifications

Power Management ICs TPS2320IDRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

REQUIRES 3V TO 5.5V SUPPLY FOR CHANNEL 2

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5,3/13

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

13 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

TPS2320IDRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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