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TPS2211IDBG4

Texas Instruments

TPS2211IDBG4 by Texas Instruments

TPS2211IDBG4 by Texas Instruments is a Power Management IC with 16 terminals, operating at -40 to 85°C. It supports supply voltages of 3.3/5,12V and has a max voltage of 13.5V. Ideal for industrial applications requiring power supply support circuits in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,946 parts In-Stock

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4,946

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Vyrian

USA . 2,741 parts In-Stock

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2,741

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 298 parts In-Stock

1+ parts

$2.500

100+ parts

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298

$2.500

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Semicontronic

India . 1,428 parts In-Stock

1+ parts

$5.500

100+ parts

$5.362

1k+ parts

$5.335

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1,428

$5.500

$5.362

$5.335

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One Stop Electronics

USA . 777 parts In-Stock

1+ parts

$6.500

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777

$6.500

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AZTECH Wire

Italy . 768 parts In-Stock

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$14.272

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768

$14.272

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Parana Technologies

USA . 1,685 parts In-Stock

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$20.401

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$20.438

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1,685

$20.401

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$20.438

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DigiPath Technology Company

USA . 276 parts In-Stock

1+ parts

$22.465

100+ parts

$20.667

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276

$22.465

$20.667

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ChromeModa Solutions

Germany . 5,598 parts In-Stock

1+ parts

$22.923

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$18.797

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5,598

$22.923

$18.797

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IDEA Electronic Components Group

UK . 1,029 parts In-Stock

1+ parts

$22.923

100+ parts

$21.777

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$20.631

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1,029

$22.923

$21.777

$20.631

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Microchip USA

USA . 2,414 parts In-Stock

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2,414

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Corphita

USA . 1,142 parts In-Stock

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1,142

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Corohmni

South Africa . 117 parts In-Stock

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117

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Overview

Enhance your power management solutions with the TPS2211IDBG4 by Texas Instruments. Known for their top-quality products, Texas Instruments delivers reliable and efficient Power Management ICs like this one. Perfect for a wide range of applications, this product offers exceptional value with its small outline, shrink pitch package style, dual terminal position, and industrial temperature grade. Say goodbye to power supply issues and hello to seamless performance with the TPS2211IDBG4 by Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures a durable and lightweight package, making this product easy to handle and transport.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3 V supply voltage is a commonly used standard in many applications, ensuring compatibility with various systems.

No. of Terminals: 16

Having 16 terminals provides flexibility in connecting various components, enhancing functionality and versatility.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in demanding environmental conditions.

Technology: BICMOS

The use of BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high speed and low power consumption.

Technical Specifications

Power Management ICs TPS2211IDBG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 5V AND 12V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

6.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5,12

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

13.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5.3 mm

Trade Compliance

TPS2211IDBG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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