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TPS2111APWG4

Texas Instruments

TPS2111APWG4 by Texas Instruments

TPS2111APWG4 by Texas Instruments is a Power Management IC with 2.8V Nominal Voltage, suitable for industrial applications. It features 8 terminals, dual terminal position, and supports power supplies of 1.8/5V. The IC has a small outline package style with thin profile and shrink pitch, making it ideal for surface mount applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,862 parts In-Stock

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5,862

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Digiode

USA . 1,401 parts In-Stock

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1,401

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Distributors (Availability)

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AZTECH Wire

Italy . 499 parts In-Stock

1+ parts

$5.141

100+ parts

-

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499

$5.141

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Ampacity Inc.

Singapore . 1,114 parts In-Stock

1+ parts

$6.500

100+ parts

-

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1,114

$6.500

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One Stop Electronics

USA . 1,013 parts In-Stock

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$6.500

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1,013

$6.500

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Semicontronic

India . 669 parts In-Stock

1+ parts

$7.500

100+ parts

$7.312

1k+ parts

$7.275

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669

$7.500

$7.312

$7.275

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Parana Technologies

USA . 2,196 parts In-Stock

1+ parts

$18.428

100+ parts

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$18.550

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2,196

$18.428

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$18.550

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ChromeModa Solutions

Germany . 3,538 parts In-Stock

1+ parts

$20.706

100+ parts

$16.979

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3,538

$20.706

$16.979

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IDEA Electronic Components Group

UK . 1,755 parts In-Stock

1+ parts

$20.706

100+ parts

$19.671

1k+ parts

$18.635

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1,755

$20.706

$19.671

$18.635

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QUARKTWIN TECHNOLOGY LTD

USA . 6,924 parts In-Stock

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Corphita

USA . 3,321 parts In-Stock

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3,321

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Microchip USA

USA . 1,950 parts In-Stock

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Perfect Parts

USA . 534 parts In-Stock

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534

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Corohmni

South Africa . 469 parts In-Stock

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469

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DigiPath Technology Company

USA . 425 parts In-Stock

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$18.669

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425

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$18.669

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Overview

Enhance your power management capabilities with the TPS2111APWG4 by Texas Instruments. Crafted with precision and expertise, this Power Management IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this product provides seamless power supply support, ensuring optimal performance. With its compact package style and dual terminal position, the TPS2111APWG4 is designed for efficiency. Experience the value and benefits of this innovative solution, delivering superior power management in a variety of industrial settings. Choose Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are commonly used in power management ICs due to their durability and reliability.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on circuit boards.

Nominal Supply Voltage (Vsup): 2.8 V

Operates at a standard voltage level ensuring compatibility with a wide range of applications.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, making it suitable for industrial environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides excellent conductivity and corrosion resistance for reliable performance.

Width (mm): 3 mm

Compact size allows for space-saving integration in electronic devices.

Minimum Supply Voltage (Vsup): 1.5 V

Can operate at low supply voltages, improving energy efficiency.

Terminal Form: GULL WING

Gull wing terminals provide secure connections and ease of soldering during assembly.

Technical Specifications

Power Management ICs TPS2111APWG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

CAN SWITCH A VOLTAGE AS LOW AS 1.5V AS LONG AS THERE IS A MIN OF 2.8V AT ONE OF THE I/P POWER PINS

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.09 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage (Vsup):

2.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

TPS2111APWG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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