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TPS2047DR

Texas Instruments

TPS2047DR by Texas Instruments

TPS2047DR by Texas Instruments is a Power Management IC with 3 functions, in a small outline package measuring 9.9mm x 3.9mm x 1.75mm. It has 16 terminals with gull wing form and is suitable for industrial temperature grade applications requiring power supply support circuits.

Median Price

$2.800

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 300 parts In-Stock

1+ parts

-

100+ parts

$2.500

1k+ parts

$2.240

10k+ parts

$2.100

300

-

$2.500

$2.240

$2.100

DigiKey

USA . 300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.880

10k+ parts

-

300

-

-

$2.880

-

Verical

USA . 300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.800

10k+ parts

$2.625

300

-

-

$2.800

$2.625

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,326 parts In-Stock

1+ parts

$2.632

100+ parts

-

1k+ parts

-

10k+ parts

-

4,326

$2.632

-

-

-

Vyrian

USA . 7,892 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,892

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 43 parts In-Stock

1+ parts

$2.350

100+ parts

$2.291

1k+ parts

$2.280

10k+ parts

-

43

$2.350

$2.291

$2.280

-

Ampacity Inc.

Singapore . 16 parts In-Stock

1+ parts

$2.350

100+ parts

-

1k+ parts

-

10k+ parts

-

16

$2.350

-

-

-

Corphita

USA . 1,255 parts In-Stock

1+ parts

$2.493

100+ parts

-

1k+ parts

-

10k+ parts

-

1,255

$2.493

-

-

-

Corohmni

South Africa . 171 parts In-Stock

1+ parts

$2.770

100+ parts

-

1k+ parts

-

10k+ parts

-

171

$2.770

-

-

-

Component Stockers USA

USA . 632 parts In-Stock

1+ parts

$2.790

100+ parts

$2.630

1k+ parts

-

10k+ parts

-

632

$2.790

$2.630

-

-

Parana Technologies

USA . 1,741 parts In-Stock

1+ parts

$9.557

100+ parts

-

1k+ parts

$10.155

10k+ parts

-

1,741

$9.557

-

$10.155

-

DigiPath Technology Company

USA . 1,240 parts In-Stock

1+ parts

$10.523

100+ parts

$9.681

1k+ parts

-

10k+ parts

-

1,240

$10.523

$9.681

-

-

ChromeModa Solutions

Germany . 1,207 parts In-Stock

1+ parts

$10.738

100+ parts

$8.805

1k+ parts

-

10k+ parts

-

1,207

$10.738

$8.805

-

-

IDEA Electronic Components Group

UK . 640 parts In-Stock

1+ parts

$10.738

100+ parts

$10.201

1k+ parts

$9.664

10k+ parts

-

640

$10.738

$10.201

$9.664

-

Microchip USA

USA . 439 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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439

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-

-

Overview

Upgrade your power management system with the TPS2047DR by Texas Instruments. Known for their high-quality products, Texas Instruments brings you a power management IC that offers three functions in one compact package. Ideal for industrial applications, this small outline chip provides reliable power supply support while maximizing efficiency. With a gull wing terminal form and dual terminal position, the TPS2047DR is designed for easy installation and seamless integration. Trust Texas Instruments to deliver superior performance and innovation in power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy materials are known for their durability and reliability, making this product a good choice for long-term use.

Surface Mount: YES

Being surface mountable makes this product easy to install and allows for efficient use of PCB space.

No. of Functions: 3

Having multiple functions in a single package increases the efficiency and versatility of the product.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into various circuit designs and layouts.

No. of Terminals: 16

Having a higher number of terminals provides more connectivity options and flexibility in usage.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and allows for compact device designs.

Terminal Position: DUAL

Dual terminal position provides redundancy and ensures stable connectivity.

Maximum Seated Height: 1.75 mm

Low seated height allows for slim and compact device designs.

Width (mm): 3.9 mm

Narrow width enables easy fitting in tight spaces or densely populated PCBs.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit IC adds value by enhancing the overall functionality and performance of the product.

Length: 9.9 mm

Moderate length provides a good balance between compactness and functionality.

Temperature Grade: INDUSTRIAL

With industrial-grade temperature tolerance, this product is suitable for a wide range of operating environments.

Terminal Form: GULL WING

Gull wing terminal form offers strong mechanical connections and easy soldering.

Terminal Pitch: 1.27 mm

With a standard terminal pitch, this product is compatible with a wide range of PCB designs and manufacturing processes.

Technical Specifications

Power Management ICs TPS2047DR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

3

No. of Terminals:

16

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

TPS2047DR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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