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TPS2041ADG4

Texas Instruments

TPS2041ADG4 by Texas Instruments

TPS2041ADG4 by Texas Instruments is a Power Management IC with 8 terminals, operating voltage range of 2.7V to 5.5V, and peak reflow temperature of 260°C. It is used in power supply support circuits for applications requiring a small outline package with dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,930 parts In-Stock

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4,930

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Vyrian

USA . 3,794 parts In-Stock

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3,794

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Bristol Electronics

USA . 2,453 parts In-Stock

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2,453

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,304 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

1k+ parts

$3.395

10k+ parts

-

1,304

$3.500

$3.412

$3.395

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One Stop Electronics

USA . 522 parts In-Stock

1+ parts

$4.500

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-

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522

$4.500

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Ampacity Inc.

Singapore . 836 parts In-Stock

1+ parts

$6.500

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836

$6.500

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AZTECH Wire

Italy . 436 parts In-Stock

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$18.375

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436

$18.375

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Parana Technologies

USA . 1,437 parts In-Stock

1+ parts

$21.081

100+ parts

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$21.332

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1,437

$21.081

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$21.332

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DigiPath Technology Company

USA . 1,920 parts In-Stock

1+ parts

$23.212

100+ parts

$21.355

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1,920

$23.212

$21.355

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ChromeModa Solutions

Germany . 6,481 parts In-Stock

1+ parts

$23.686

100+ parts

$19.423

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6,481

$23.686

$19.423

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IDEA Electronic Components Group

UK . 577 parts In-Stock

1+ parts

$23.686

100+ parts

$22.502

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$21.317

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577

$23.686

$22.502

$21.317

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QUARKTWIN TECHNOLOGY LTD

USA . 26,579 parts In-Stock

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26,579

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Microchip USA

USA . 2,368 parts In-Stock

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2,368

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Corphita

USA . 2,019 parts In-Stock

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2,019

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Corohmni

South Africa . 127 parts In-Stock

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127

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Overview

Experience the power of innovation with the TPS2041ADG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Power Management ICs that are designed to optimize performance and efficiency. With applications ranging from power supply support circuits to voltage regulation, this product offers customers unparalleled value, benefits, and advantages. Trust Texas Instruments to provide reliable solutions for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection to the internal components of the Power Management IC.

Surface Mount: YES

Being surface mountable, this Power Management IC is easy to incorporate into PCB designs, saving space and making assembly more efficient.

Nominal Supply Voltage (Vsup): 3.3 V

3.3V nominal supply voltage makes it compatible with a wide range of electronic devices and systems, providing stable power management.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this Power Management IC can function reliably in various environmental conditions.

Terminal Position: DUAL

The dual terminal position ensures secure connections and increased stability, contributing to the overall reliability of the Power Management IC.

Technical Specifications

Power Management ICs TPS2041ADG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

TPS2041ADG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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