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TPS2010AD

Texas Instruments

TPS2010AD by Texas Instruments

TPS2010AD by Texas Instruments is a Power Management IC with 8 terminals, operating voltage range of 2.7V to 5.5V, and temperature grade of Industrial. It is a surface-mount IC in small outline package suitable for power supply support circuits in applications requiring -40 to 85°C operation.

Median Price

$1.917

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 14,817 parts In-Stock

1+ parts

$1.917

100+ parts

$1.680

1k+ parts

$0.949

10k+ parts

-

14,817

$1.917

$1.680

$0.949

-

Mouser Electronics

USA . 221 parts In-Stock

1+ parts

$3.100

100+ parts

$1.790

1k+ parts

$1.660

10k+ parts

$1.610

221

$3.100

$1.790

$1.660

$1.610

DigiKey

USA . 162 parts In-Stock

1+ parts

$3.100

100+ parts

$1.950

1k+ parts

$1.864

10k+ parts

-

162

$3.100

$1.950

$1.864

-

Chip1Stop

Japan . 825 parts In-Stock

1+ parts

-

100+ parts

$1.251

1k+ parts

$1.180

10k+ parts

-

825

-

$1.251

$1.180

-

Rochester

USA . 31 parts In-Stock

1+ parts

-

100+ parts

$1.500

1k+ parts

$1.340

10k+ parts

$1.260

31

-

$1.500

$1.340

$1.260

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,838 parts In-Stock

1+ parts

$1.264

100+ parts

-

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-

10k+ parts

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1,838

$1.264

-

-

-

Nova Conductors

Japan . 74 parts In-Stock

1+ parts

$1.417

100+ parts

-

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-

10k+ parts

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74

$1.417

-

-

-

Component Electronics Inc.

Canada . 1 parts In-Stock

1+ parts

$3.850

100+ parts

$2.880

1k+ parts

$2.500

10k+ parts

-

1

$3.850

$2.880

$2.500

-

Chip Stock

USA . 11,145 parts In-Stock

1+ parts

-

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11,145

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-

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Vyrian

USA . 8,842 parts In-Stock

1+ parts

-

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8,842

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-

-

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Mil-Aero Solutions, Inc.

USA . 938 parts In-Stock

1+ parts

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938

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-

-

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Elcom Components

USA . 495 parts In-Stock

1+ parts

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495

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-

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Holdelec - ElecDif-Pro

France . 50 parts In-Stock

1+ parts

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50

-

-

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Prism Electronics

USA . 11 parts In-Stock

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11

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Semi Source

USA . 7 parts In-Stock

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7

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Sensible Micro Corp

USA . 4 parts In-Stock

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4

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EMSNET

USA . 4 parts In-Stock

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,270 parts In-Stock

1+ parts

$0.961

100+ parts

-

1k+ parts

$1.861

10k+ parts

-

1,270

$0.961

-

$1.861

-

Ampacity Inc.

Singapore . 3,217 parts In-Stock

1+ parts

$1.060

100+ parts

-

1k+ parts

-

10k+ parts

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3,217

$1.060

-

-

-

ChromeModa Solutions

Germany . 1,697 parts In-Stock

1+ parts

$1.080

100+ parts

$0.886

1k+ parts

-

10k+ parts

-

1,697

$1.080

$0.886

-

-

IDEA Electronic Components Group

UK . 709 parts In-Stock

1+ parts

$1.080

100+ parts

-

1k+ parts

$0.972

10k+ parts

-

709

$1.080

-

$0.972

-

Corphita

USA . 197 parts In-Stock

1+ parts

$1.197

100+ parts

-

1k+ parts

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197

$1.197

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-

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$1.417

100+ parts

-

1k+ parts

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10k+ parts

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2,000

$1.417

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-

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Perfect Parts

USA . 4,836 parts In-Stock

1+ parts

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100+ parts

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4,836

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-

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DigiPath Technology Company

USA . 2,152 parts In-Stock

1+ parts

-

100+ parts

$0.974

1k+ parts

-

10k+ parts

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2,152

-

$0.974

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-

Overview

Discover the cutting-edge power management capabilities of the TPS2010AD by Texas Instruments. This high-quality Power Management IC offers unmatched reliability and efficiency, making it perfect for a wide range of applications. From industrial automation to consumer electronics, this compact and versatile IC provides a nominal supply voltage of 3.3V and a maximum supply voltage of 5.5V. With its advanced features and durable construction, the TPS2010AD ensures optimal performance and longevity, delivering exceptional value to customers seeking top-notch power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, which is ideal for portable devices.

Surface Mount: YES

The surface mount capability allows for easy integration into circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3V supply voltage is a common standard in many electronic devices, making this power management IC compatible with a wide range of applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this power management IC can withstand high temperatures without sacrificing performance.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C ensures this power management IC can function reliably in a variety of environments.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage of 2.7V allows for efficient power management in applications where power consumption is a concern.

Technical Specifications

Power Management ICs TPS2010AD attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Current (Isup):

.1 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

TPS2010AD Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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