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TPIC84134TPWPRQ1

Texas Instruments

TPIC84134TPWPRQ1 by Texas Instruments

TPIC84134TPWPRQ1 by Texas Instruments is a MOSFET gate driver with a max supply voltage of 38V and high side driver capability. It operates in industrial temperatures from -40 to 105°C, making it suitable for automotive applications. With a compact rectangular package style and dual terminal position, it offers reliable performance in space-constrained environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,190 parts In-Stock

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5,190

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Digiode

USA . 1,913 parts In-Stock

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1,913

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 502 parts In-Stock

1+ parts

$5.569

100+ parts

-

1k+ parts

$6.354

10k+ parts

-

502

$5.569

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$6.354

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ChromeModa Solutions

Germany . 1,947 parts In-Stock

1+ parts

$6.257

100+ parts

$5.131

1k+ parts

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1,947

$6.257

$5.131

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IDEA Electronic Components Group

UK . 1,444 parts In-Stock

1+ parts

$6.257

100+ parts

-

1k+ parts

$5.631

10k+ parts

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1,444

$6.257

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$5.631

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AZTECH Wire

Italy . 617 parts In-Stock

1+ parts

$14.208

100+ parts

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617

$14.208

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Ampacity Inc.

Singapore . 353 parts In-Stock

1+ parts

$35.500

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353

$35.500

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One Stop Electronics

USA . 774 parts In-Stock

1+ parts

$47.500

100+ parts

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774

$47.500

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Corphita

USA . 3,985 parts In-Stock

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3,985

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DigiPath Technology Company

USA . 698 parts In-Stock

1+ parts

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$5.641

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698

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$5.641

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Overview

Experience the power of Texas Instruments with the TPIC84134TPWPRQ1 MOSFET Gate Driver. Crafted with precision and quality, this driver ensures optimal performance in a variety of industrial applications. With a wide supply voltage range and high-side driver capability, this product offers unmatched versatility and reliability. Say goodbye to overheating and compatibility issues, as the TPIC84134TPWPRQ1 is designed to exceed your expectations. Trust in Texas Instruments for cutting-edge technology that delivers results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the gate driver easy to handle and resistant to wear and tear.

Surface Mount: YES

The surface-mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 38 V

The high maximum supply voltage allows for use in a wide range of applications, providing flexibility and compatibility.

Screening Level: AEC-Q100

This screening level ensures high quality and reliability, making the gate driver suitable for automotive applications where rigorous standards are required.

Package Shape: RECTANGULAR

The rectangular package shape is space-efficient and allows for easy placement on PCBs, optimizing layout and design.

No. of Terminals: 28

The large number of terminals allows for versatile connections and configurations, enabling compatibility with various systems and setups.

Minimum Supply Voltage: 7 V

The low minimum supply voltage ensures compatibility with a wide range of power sources, offering flexibility in application.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliable performance in demanding environments and applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity and corrosion resistance, ensuring long-lasting performance and stability.

Terminal Position: DUAL

The dual terminal position allows for efficient power handling and distribution, enhancing the overall performance and reliability of the gate driver.

Maximum Seated Height: 1.2 mm

The low seated height allows for compact and slim designs, making the gate driver suitable for space-constrained applications.

Width: 4.4 mm

The narrow width enables the gate driver to be easily integrated into tight spaces and crowded PCB layouts, maximizing flexibility in installation.

High Side Driver: YES

The presence of a high-side driver simplifies the design and implementation of power management circuits, enhancing efficiency and performance.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time ensures quick and efficient soldering processes, saving time and resources during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable and secure solder joints, ensuring durability and longevity in operation.

Length: 9.7 mm

The compact length of the gate driver facilitates efficient placement on PCBs and helps optimize overall circuit layout and design.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable performance in harsh operating conditions, making the gate driver suitable for a wide range of applications.

Terminal Form: GULL WING

The gull-wing terminal form allows for secure and reliable connections, ensuring consistent performance and stability in operation.

Maximum Supply Current: 1300 mA

The high maximum supply current capability supports efficient power delivery and management, enhancing the overall performance of the gate driver.

Input Characteristics: STANDARD

The standard input characteristics ensure compatibility with a wide range of control signals and systems, offering versatility and ease of integration.

Nominal Supply Voltage: 16 V

The nominal supply voltage provides a stable power source for consistent and reliable operation, ensuring smooth performance in various applications.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for compact and dense layouts on PCBs, optimizing space utilization and enabling efficient circuit design.

Moisture Sensitivity Level (MSL): 3

The moderate moisture sensitivity level ensures resistance to environmental factors, making the gate driver suitable for a variety of operating conditions.

Nominal Output Peak Current Limit: 0.8 A

The nominal output peak current limit provides protection against overcurrent conditions, ensuring safe and reliable operation of the gate driver.

Interface IC Type: HALF BRIDGE BASED MOSFET DRIVER

The half-bridge based MOSFET driver interface offers efficient power delivery and control, enabling high-performance operation in a wide range of applications.

Technical Specifications

MOSFET Gate Drivers TPIC84134TPWPRQ1 attributes and parameters. Explore more MOSFET Gate Drivers devices from Texas Instruments

Specs

Additional Features:

CAN ALSO OPERATES WITH 4.75 V TO 5.25 V DIGITAL SUPPLY

High Side Driver:

YES

Input Characteristics:

STANDARD

Interface IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Peak Current Limit:

.8 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

1300 mA

Maximum Supply Voltage:

38 V

Minimum Supply Voltage:

7 V

Nominal Supply Voltage:

16 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

TPIC84134TPWPRQ1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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