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TPIC44L02DBRG4

Texas Instruments

TPIC44L02DBRG4 by Texas Instruments

TPIC44L02DBRG4 by Texas Instruments is a MOSFET Gate Driver with 4 channels, operating at -40 to 125 °C. It has a supply voltage range of 4.5-24 V and max output current of 0.0012 A. Ideal for automotive applications due to its small outline package and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,991 parts In-Stock

1+ parts

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5,991

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Digiode

USA . 3,177 parts In-Stock

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3,177

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 294 parts In-Stock

1+ parts

$7.961

100+ parts

-

1k+ parts

$8.534

10k+ parts

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294

$7.961

-

$8.534

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DigiPath Technology Company

USA . 1,481 parts In-Stock

1+ parts

$8.766

100+ parts

$8.065

1k+ parts

-

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1,481

$8.766

$8.065

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ChromeModa Solutions

Germany . 5,111 parts In-Stock

1+ parts

$8.945

100+ parts

$7.335

1k+ parts

-

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5,111

$8.945

$7.335

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IDEA Electronic Components Group

UK . 1,970 parts In-Stock

1+ parts

$8.945

100+ parts

$8.498

1k+ parts

$8.050

10k+ parts

-

1,970

$8.945

$8.498

$8.050

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AZTECH Wire

Italy . 885 parts In-Stock

1+ parts

$13.121

100+ parts

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885

$13.121

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One Stop Electronics

USA . 1,013 parts In-Stock

1+ parts

$42.500

100+ parts

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1,013

$42.500

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Corphita

USA . 4,510 parts In-Stock

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4,510

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Microchip USA

USA . 2,614 parts In-Stock

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2,614

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Overview

Discover the TPIC44L02DBRG4 by Texas Instruments, a top-of-the-line MOSFET Gate Drivers designed to deliver unparalleled performance and reliability. With Texas Instruments' reputation for excellence in semiconductor manufacturing, this product guarantees superior quality and cutting-edge technology. Ideal for a wide range of applications, this compact and efficient device ensures optimal functionality and precision in every use. Elevate your projects with the TPIC44L02DBRG4 and experience the unmatched value, benefits, and advantages it brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount packaging allows for easy and secure installation on circuit boards, saving space and improving reliability.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in voltage requirements and compatibility with various systems.

Package Shape: RECTANGULAR

The rectangular shape makes the product easy to handle and install in standard configurations.

Maximum Supply Voltage-1: 24 V

The secondary maximum supply voltage provides additional compatibility and options for power supply requirements.

Power Supplies (V): 5

The availability of multiple power supplies allows for flexible configuration and improved reliability.

No. of Terminals: 24

The high number of terminals allows for versatile connectivity and integration with various systems.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

This package style is compact and efficient, saving space on circuit boards and reducing overall system size.

Minimum Supply Voltage-1: 8 V

The minimum supply voltage ensures reliable operation even under low voltage conditions.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage allows for operation in a wide range of voltage conditions.

Maximum Operating Temperature: 125 °C

The high operating temperature range ensures reliable performance in hot environments.

Minimum Operating Temperature: -40 °C

The low operating temperature range allows for operation in cold environments without compromising performance.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish provides excellent conductivity and corrosion resistance for long-lasting performance.

Terminal Position: DUAL

The dual terminal position allows for easy installation and compatibility with various circuit configurations.

Maximum Seated Height: 2 mm

The low seated height saves space and allows for compact installation in tight spaces.

Width: 5.3 mm

The narrow width makes the product suitable for compact designs and space-constrained applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable soldering and secure connection during manufacturing.

Length: 8.2 mm

The standard length makes the product easy to handle and install in common configurations.

Temperature Grade: AUTOMOTIVE

The automotive-grade temperature rating ensures reliable performance in harsh automotive environments.

Maximum Output Current: 0.0012 A

The high maximum output current allows for driving power-hungry MOSFETs and other components.

No. of Channels: 4

The multiple channels provide flexibility and control for driving multiple MOSFETs or other components simultaneously.

Terminal Form: GULL WING

The gull wing terminal form allows for easy installation and secure connection on circuit boards.

Maximum Supply Current: 4.2 mA

The low maximum supply current ensures energy efficiency and minimal power consumption during operation.

Nominal Supply Voltage: 5 V

The stable nominal supply voltage ensures consistent performance and compatibility with standard power supplies.

Turn-on Time: 4 us

The fast turn-on time allows for quick response and precise control during operation.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for compact installation and close connections on circuit boards.

Nominal Supply Voltage-1: 12 V

The secondary nominal supply voltage provides additional compatibility and options for power supply requirements.

Nominal Output Peak Current Limit: 0.0012 A

The stable current limit ensures safe operation and protects the driver and MOSFETs from overloading.

Interface IC Type: BUFFER OR INVERTER BASED MOSFET DRIVER

The interface IC type provides flexibility and compatibility with various control circuits and systems.

Turn-off Time: 3.5 us

The fast turn-off time ensures quick response and precise control during operation, improving overall performance.

Technical Specifications

MOSFET Gate Drivers TPIC44L02DBRG4 attributes and parameters. Explore more MOSFET Gate Drivers devices from Texas Instruments

Specs

High Side Driver:

NO

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.0012 A

Nominal Output Peak Current Limit:

.0012 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Current:

4.2 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

24 V

Minimum Supply Voltage-1:

8 V

Nominal Supply Voltage-1:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Turn-off Time:

3.5 us

Turn-on Time:

4 us

Width:

5.3 mm

Trade Compliance

TPIC44L02DBRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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