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TPIC46L02DB

Texas Instruments

TPIC46L02DB by Texas Instruments

TPIC46L02DB by Texas Instruments is a MOSFET gate driver with 6 channels and a max supply voltage of 24V. It operates in automotive-grade temperatures (-40 to 125°C) and has a small outline package style for space-constrained applications. With a nominal output peak current limit of 0.0012A, it is ideal for driving MOSFETs in automotive electronics.

Median Price

$2.538

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 779 parts In-Stock

1+ parts

$3.650

100+ parts

$2.690

1k+ parts

$2.120

10k+ parts

$1.960

779

$3.650

$2.690

$2.120

$1.960

Rochester

USA . 24,254 parts In-Stock

1+ parts

-

100+ parts

$2.270

1k+ parts

$2.030

10k+ parts

$1.910

24,254

-

$2.270

$2.030

$1.910

DigiKey

USA . 24,254 parts In-Stock

1+ parts

-

100+ parts

$2.990

1k+ parts

-

10k+ parts

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24,254

-

$2.990

-

-

Verical

USA . 22,610 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.538

10k+ parts

$2.388

22,610

-

-

$2.538

$2.388

Avnet

USA . 41 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.255

10k+ parts

$1.179

41

-

-

$1.255

$1.179

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,964 parts In-Stock

1+ parts

$0.906

100+ parts

-

1k+ parts

-

10k+ parts

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3,964

$0.906

-

-

-

Digiode

USA . 772 parts In-Stock

1+ parts

$1.805

100+ parts

-

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-

10k+ parts

-

772

$1.805

-

-

-

Lantek

USA . 350 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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350

-

-

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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100

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 14,135 parts In-Stock

1+ parts

$0.770

100+ parts

-

1k+ parts

-

10k+ parts

-

14,135

$0.770

-

-

-

Corphita

USA . 4,396 parts In-Stock

1+ parts

$1.710

100+ parts

-

1k+ parts

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10k+ parts

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4,396

$1.710

-

-

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Parana Technologies

USA . 1,538 parts In-Stock

1+ parts

$7.801

100+ parts

-

1k+ parts

$8.350

10k+ parts

-

1,538

$7.801

-

$8.350

-

ChromeModa Solutions

Germany . 4,524 parts In-Stock

1+ parts

$8.765

100+ parts

$7.187

1k+ parts

-

10k+ parts

-

4,524

$8.765

$7.187

-

-

IDEA Electronic Components Group

UK . 2,008 parts In-Stock

1+ parts

$8.765

100+ parts

$8.327

1k+ parts

$7.888

10k+ parts

-

2,008

$8.765

$8.327

$7.888

-

Microchip USA

USA . 2,165 parts In-Stock

1+ parts

$30.740

100+ parts

$30.550

1k+ parts

$30.460

10k+ parts

$30.360

2,165

$30.740

$30.550

$30.460

$30.360

A-Z Elektronik GmbH

Germany . 6,951 parts In-Stock

1+ parts

-

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6,951

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-

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Authorized Procurement Solutions

USA . 6,480 parts In-Stock

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6,480

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

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2,000

-

-

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Assy Fe

Spain . 1,364 parts In-Stock

1+ parts

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1,364

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DigiPath Technology Company

USA . 794 parts In-Stock

1+ parts

-

100+ parts

$7.903

1k+ parts

-

10k+ parts

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794

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$7.903

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Kepictronics

USA . 350 parts In-Stock

1+ parts

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100+ parts

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350

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GreenTree Electronics

Israel . 350 parts In-Stock

1+ parts

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100+ parts

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350

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Overview

Get ready to take your electronic designs to the next level with the TPIC46L02DB MOSFET Gate Driver by Texas Instruments. Known for their top-quality components, Texas Instruments delivers exceptional performance and reliability in every product they create. This small outline, shrink pitch driver is perfect for automotive applications, offering a wide range of benefits including high output current, dual terminal position, and a temperature grade suitable for tough environments. Trust Texas Instruments to provide the value and advantages you need to succeed in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto electronic circuit boards.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage of 5.5V ensures compatibility with a wide range of system requirements.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on a circuit board.

Power Supplies (V): 5

A power supply of 5V provides sufficient power for the operation of the gate drivers.

No. of Terminals: 28

With 28 terminals, this product offers flexibility in connectivity options.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style makes the product suitable for compact electronic designs.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5V ensures reliable operation under low power conditions.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures stable performance in demanding environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures usability in a wide range of temperature conditions.

Terminal Position: DUAL

The dual terminal position provides redundancy and enhances connection stability.

Maximum Seated Height: 2 mm

The low maximum seated height of 2mm allows for compact mechanical designs.

Width: 5.3 mm

The narrow width of 5.3mm contributes to space-saving on a circuit board.

Peak Reflow Temperature: 260

The high peak reflow temperature of 260°C ensures reliable soldering during the manufacturing process.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade indicates the product's suitability for use in automotive applications.

No. of Channels: 6

With 6 channels, this product provides support for multiple MOSFETs in a system.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V ensures stable operation under normal operating conditions.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm allows for high-density mounting on a PCB.

Maximum Output Current: 0.0012 A

The maximum output current of 0.0012A allows for efficient driving of MOSFETs.

Interface IC Type: BUFFER OR INVERTER BASED MOSFET DRIVER

The buffer or inverter-based MOSFET driver interface IC type provides flexibility in driving different types of MOSFET circuits.

Technical Specifications

MOSFET Gate Drivers TPIC46L02DB attributes and parameters. Explore more MOSFET Gate Drivers devices from Texas Instruments

Specs

High Side Driver:

NO

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

6

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.0012 A

Nominal Output Peak Current Limit:

.0012 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Current:

4.2 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

24 V

Minimum Supply Voltage-1:

8 V

Nominal Supply Voltage-1:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

TPIC46L02DB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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