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LMG1205YFXR

Texas Instruments

LMG1205YFXR by Texas Instruments

LMG1205YFXR by Texas Instruments is a MOSFET gate driver with a max supply voltage of 5.5V and a max output current of 5A. It is commonly used in automotive applications due to its high side driver capability and temperature grade.

Median Price

$1.840

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Texas Instruments

USA . 651,442 parts In-Stock

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Arrow

USA . 6,000 parts In-Stock

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Chip1Stop

Japan . 6,000 parts In-Stock

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Verical

USA . 902 parts In-Stock

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Nova Conductors

Japan . 63 parts In-Stock

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Digiode

USA . 1,072 parts In-Stock

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Vyrian

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Bristol Electronics

USA . 10,548 parts In-Stock

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Chip Stock

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Cyclops Electronics Ltd

UK . 6,004 parts In-Stock

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Sunrise Surplus Inc.

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Sensible Micro Corp

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Prism Electronics

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Semicontronic

India . 112,057 parts In-Stock

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$1.190

100+ parts

$1.160

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$1.154

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Argo Parts USA

USA . 3,037 parts In-Stock

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$1.967

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Continental Prestige Electronics

USA . 926 parts In-Stock

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$1.927

926

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Corphita

USA . 1,379 parts In-Stock

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Ampacity Inc.

Singapore . 112,062 parts In-Stock

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$2.580

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Advanced Electronics

New Zealand . 350 parts In-Stock

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$4.975

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$4.726

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Parana Technologies

USA . 1,869 parts In-Stock

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$8.428

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$9.067

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DigiPath Technology Company

USA . 444 parts In-Stock

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$9.281

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IDEA Electronic Components Group

UK . 2,165 parts In-Stock

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$9.470

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$8.996

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$8.523

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ChromeModa Solutions

Germany . 1,201 parts In-Stock

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$7.765

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Corohmni

South Africa . 1,142 parts In-Stock

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iodParts Technologies Inc.

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QUARKTWIN TECHNOLOGY LTD

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Lixinc

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Kepictronics

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Futuretech Components

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Netroflash

USA . 1,000 parts In-Stock

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Component Stockers USA

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Robosynatics

Brazil . 20 parts In-Stock

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Lucentia Tech

USA . 20 parts In-Stock

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$4.829

Overview

Experience superior quality and performance with the LMG1205YFXR by Texas Instruments. As a trusted manufacturer, Texas Instruments is renowned for its cutting-edge technology and innovative solutions. The LMG1205YFXR belongs to the category of MOSFET Gate Drivers, offering a wide range of applications. This product stands out among competitors with its value, benefits, and advantages it brings to customers. With its compact design and high reliability, it provides seamless integration into various systems. Trust in Texas Instruments to deliver exceptional quality and unlock endless possibilities for your projects. Discover the power of the LMG1205YFXR and take your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability to the product, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation of the product on circuit boards, saving time and effort.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage range allows for flexibility in different voltage applications, ensuring compatibility with various systems.

Package Shape: RECTANGULAR

Rectangular shape enables compact and efficient component placement on PCBs, optimizing space utilization.

Output Characteristics: OPEN-DRAIN

Open-drain output allows for easy interfacing with other components and provides flexibility in system design.

Maximum Operating Temperature: 125 °C

High operating temperature tolerance ensures stable performance in demanding environments, such as automotive applications.

Width: 1.7255 mm

Narrow width enables dense packing of components on PCBs, saving space and facilitating compact design solutions.

Maximum Output Current: 5 A

High maximum output current capability allows for driving power MOSFETs with ease, making it suitable for high-power applications.

No. of Channels: 2

Dual-channel design provides versatility in managing multiple MOSFETs simultaneously, enhancing system performance and control.

Technical Specifications

MOSFET Gate Drivers LMG1205YFXR attributes and parameters. Explore more MOSFET Gate Drivers devices from Texas Instruments

Specs

High Side Driver:

YES

Interface IC Type:

JESD-30 Code:

R-PBGA-B12

JESD-609 Code:

e1

Length:

1.875 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Maximum Output Current:

5 A

Nominal Output Peak Current Limit:

5 A

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.675 mm

Maximum Supply Current:

3 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

.05 us

Turn-on Time:

.05 us

Width:

1.7255 mm

Trade Compliance

LMG1205YFXR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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