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NCD5703BDR2G

Onsemi

NCD5703BDR2G by Onsemi

NCD5703BDR2G by Onsemi is a MOSFET gate driver with 8 terminals, suitable for automotive applications. It operates b/w -40 to 125°C and has a turn-on/off time of 0.075 us. With a supply voltage range of 13.2V to 30V, it features an interface IC type of BUFFER OR INVERTER BASED IGBT DRIVER.

Median Price

$1.925

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,177 parts In-Stock

1+ parts

$2.370

100+ parts

$1.440

1k+ parts

$1.210

10k+ parts

$1.130

2,177

$2.370

$1.440

$1.210

$1.130

DigiKey

USA . 1,995 parts In-Stock

1+ parts

$2.370

100+ parts

$1.432

1k+ parts

$1.313

10k+ parts

-

1,995

$2.370

$1.432

$1.313

-

Chip1Stop

Japan . 1,347 parts In-Stock

1+ parts

-

100+ parts

$1.480

1k+ parts

$1.420

10k+ parts

$1.270

1,347

-

$1.480

$1.420

$1.270

Rochester

USA . 155 parts In-Stock

1+ parts

-

100+ parts

$1.460

1k+ parts

$1.210

10k+ parts

$1.080

155

-

$1.460

$1.210

$1.080

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,274 parts In-Stock

1+ parts

$1.130

100+ parts

-

1k+ parts

-

10k+ parts

-

1,274

$1.130

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$1.320

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$1.320

-

-

-

Chip Stock

USA . 62,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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62,000

-

-

-

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Vyrian

USA . 3,163 parts In-Stock

1+ parts

-

100+ parts

-

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3,163

-

-

-

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Flip Electronics

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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2,500

-

-

-

-

Rapid Electronics

USA . 1,347 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,347

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,063 parts In-Stock

1+ parts

$1.010

100+ parts

-

1k+ parts

-

10k+ parts

-

3,063

$1.010

-

-

-

Semicontronic

India . 2,978 parts In-Stock

1+ parts

$1.010

100+ parts

$0.985

1k+ parts

$0.980

10k+ parts

-

2,978

$1.010

$0.985

$0.980

-

Corphita

USA . 1,950 parts In-Stock

1+ parts

$1.071

100+ parts

-

1k+ parts

-

10k+ parts

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1,950

$1.071

-

-

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Corohmni

South Africa . 280 parts In-Stock

1+ parts

$1.190

100+ parts

-

1k+ parts

-

10k+ parts

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280

$1.190

-

-

-

Continental Prestige Electronics

USA . 6,360 parts In-Stock

1+ parts

$1.320

100+ parts

-

1k+ parts

-

10k+ parts

$1.294

6,360

$1.320

-

-

$1.294

Argo Parts USA

USA . 4,808 parts In-Stock

1+ parts

$1.320

100+ parts

-

1k+ parts

-

10k+ parts

-

4,808

$1.320

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$1.320

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$1.320

-

-

-

Modulus Dynamics

Lithuania . 3,629 parts In-Stock

1+ parts

$3.275

100+ parts

$3.275

1k+ parts

$3.275

10k+ parts

-

3,629

$3.275

$3.275

$3.275

-

Aztec Data Supply Inc.

USA . 2,746 parts In-Stock

1+ parts

$8.760

100+ parts

-

1k+ parts

-

10k+ parts

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2,746

$8.760

-

-

-

TANS Electronics

Latvia . 5,974 parts In-Stock

1+ parts

-

100+ parts

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5,974

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-

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Problanco Electronics

Mexico . 3,603 parts In-Stock

1+ parts

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3,603

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-

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Microchip USA

USA . 3,385 parts In-Stock

1+ parts

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100+ parts

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3,385

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-

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SupplyDigital Components

Austria . 2,968 parts In-Stock

1+ parts

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2,968

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iodParts Technologies Inc.

India . 2,063 parts In-Stock

1+ parts

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2,063

-

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Kulean Microsystems

USA . 941 parts In-Stock

1+ parts

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941

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UHIMA Technologies

Türkiye . 374 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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374

-

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-

Overview

Enhance the performance of your electronic systems with the NCD5703BDR2G MOSFET Gate Driver from Onsemi. With a focus on quality and reliability, Onsemi is a trusted manufacturer known for delivering cutting-edge solutions. This compact and versatile device is designed for automotive applications, offering a wide range of benefits such as efficient power management and precise control. Elevate your projects with the value and advantages that the NCD5703BDR2G brings to the table, providing you with the competitive edge you need in today's fast-paced market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of sturdy plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation without the need for through-hole soldering.

Maximum Supply Voltage: 30 V

High maximum supply voltage capability enables this gate driver to work with a wide range of applications.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration and compact design in electronic circuits.

No. of Terminals: 8

With 8 terminals, this gate driver can accommodate a variety of connections for versatile use.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for efficient PCB layout.

Minimum Supply Voltage: 13.2 V

Low minimum supply voltage requirement ensures compatibility with various power sources.

Maximum Operating Temperature: 125 °C

High maximum operating temperature tolerance ensures reliability even in harsh environments.

Minimum Operating Temperature: -40 °C

Wide temperature range makes this gate driver suitable for use in extreme cold conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good conductivity and corrosion resistance for long-lasting performance.

Terminal Position: DUAL

Dual terminal position design allows for flexibility in connection options for different circuits.

Maximum Seated Height: 1.75 mm

Low seated height contributes to a slim profile and space-saving design.

Width: 4 mm

Compact width makes this gate driver ideal for applications with limited space availability.

Maximum Time At Peak Reflow Temperature (s): 30

Short peak reflow time ensures proper soldering and component integrity during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance meets industry standards for reflow soldering processes.

Length: 5 mm

The small length of the gate driver allows for easy integration and space-efficient circuit design.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures reliability and performance in automotive applications.

Terminal Form: GULL WING

Gull wing terminal form offers secure and reliable solder connections for stable operation.

Nominal Supply Voltage: 15 V

The nominal supply voltage requirement is common and widely available for easy integration.

Turn-on Time: 0.075 us

Fast turn-on time ensures quick response and efficiency in driving MOSFETs.

Nominal Negative Supply Voltage: -8 V

Negative supply voltage capability allows for bi-directional power management in circuits.

Terminal Pitch: 1.27 mm

Terminal pitch spacing promotes easy soldering and PCB layout for seamless integration.

Interface IC Type: BUFFER OR INVERTER BASED IGBT DRIVER

Versatile interface IC type supports various driving configurations for different applications.

Turn-off Time: 0.075 us

Quick turn-off time contributes to efficient switching and control of MOSFETs in circuits.

Technical Specifications

MOSFET Gate Drivers NCD5703BDR2G attributes and parameters. Explore more MOSFET Gate Drivers devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-8 V

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.24

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

30 V

Minimum Supply Voltage:

13.2 V

Nominal Supply Voltage:

15 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

.075 us

Turn-on Time:

.075 us

Width:

4 mm

Trade Compliance

NCD5703BDR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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