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TPA701DGNG4

Texas Instruments

TPA701DGNG4 by Texas Instruments

TPA701DGNG4 by Texas Instruments is an audio amplifier IC with 0.7W output power, 0.5% harmonic distortion, and 2.5-5.5V supply voltage range. Ideal for industrial applications requiring small outline, heat sink package with thin profile and dual terminal position.

Median Price

$3.100

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 559 parts In-Stock

1+ parts

$3.100

100+ parts

$1.580

1k+ parts

$1.040

10k+ parts

$0.946

559

$3.100

$1.580

$1.040

$0.946

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,864 parts In-Stock

1+ parts

$2.764

100+ parts

-

1k+ parts

-

10k+ parts

-

3,864

$2.764

-

-

-

Vyrian

USA . 8,322 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,322

-

-

-

-

Component Sense

UK . 188 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

188

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 736 parts In-Stock

1+ parts

$2.619

100+ parts

-

1k+ parts

-

10k+ parts

-

736

$2.619

-

-

-

Parana Technologies

USA . 1,182 parts In-Stock

1+ parts

$2.845

100+ parts

-

1k+ parts

$3.335

10k+ parts

-

1,182

$2.845

-

$3.335

-

ChromeModa Solutions

Germany . 6,026 parts In-Stock

1+ parts

$3.197

100+ parts

$2.622

1k+ parts

-

10k+ parts

-

6,026

$3.197

$2.622

-

-

IDEA Electronic Components Group

UK . 184 parts In-Stock

1+ parts

$3.197

100+ parts

-

1k+ parts

$2.877

10k+ parts

-

184

$3.197

-

$2.877

-

Microchip USA

USA . 1,253 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,253

-

-

-

-

DigiPath Technology Company

USA . 648 parts In-Stock

1+ parts

-

100+ parts

$2.882

1k+ parts

-

10k+ parts

-

648

-

$2.882

-

-

Overview

Elevate your audio experience with the TPA701DGNG4 by Texas Instruments, a high-quality audio amplifier designed for superior sound performance. As a trusted manufacturer in the industry, Texas Instruments delivers reliable and innovative solutions that cater to various applications in the audio and video amplification category. With its compact design and advanced technology, this amplifier offers customers unparalleled value, benefits, and advantages. Upgrade your audio systems today with the TPA701DGNG4 and immerse yourself in crystal-clear sound like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the amplifier lightweight and durable, ensuring longevity and easy handling.

Surface Mount: YES

Being able to be surface mounted allows for easy installation and integration into electronic circuits, making the amplifier versatile for various applications.

General IC Type: AUDIO AMPLIFIER

Being specifically designed as an audio amplifier ensures high-quality audio output, making it ideal for audio applications such as speakers or headphones.

Nominal Output Power: 0.7 W

With a nominal output power of 0.7W, this amplifier is capable of delivering sufficient power to drive audio devices effectively without compromising on sound quality.

Technology: CMOS

Utilizing CMOS technology allows for efficient power consumption and low heat generation, making the amplifier energy-efficient and suitable for prolonged use.

Technical Specifications

Audio & Video Amplifiers TPA701DGNG4 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Nominal Bandwidth:

.004 kHz

General IC Type:

Harmonic Distortion:

.5 %

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.7 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

.25 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

TPA701DGNG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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