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TP3465V

Texas Instruments

TP3465V by Texas Instruments

TP3465V by Texas Instruments is a CMOS microprocessor circuit with 28 terminals in a square chip carrier package. It operates b/w 0-70°C, with supply voltage ranging from 4.75-5.25 V. Ideal for various applications requiring a commercial-grade peripheral IC with J bend terminal form and surface mount capability.

Median Price

$7.237

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,426 parts In-Stock

1+ parts

-

100+ parts

$5.790

1k+ parts

$5.180

10k+ parts

$4.870

1,426

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$5.790

$5.180

$4.870

DigiKey

USA . 711 parts In-Stock

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$7.610

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$7.610

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Verical

USA . 701 parts In-Stock

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$7.237

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$6.475

10k+ parts

$6.088

701

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$7.237

$6.475

$6.088

Distributors (In-Stock)

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DF Sales Co.

USA . 45 parts In-Stock

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$5.600

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45

$5.600

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DF Sales Co.

USA . 45 parts In-Stock

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$5.600

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Digiode

USA . 5,215 parts In-Stock

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$6.099

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$6.099

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Vyrian

USA . 1,921 parts In-Stock

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$6.420

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Anansix

USA . 1,684 parts In-Stock

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LWI Electronics Inc

India . 832 parts In-Stock

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Bristol Electronics

USA . 450 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 29 parts In-Stock

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PC Components Company LLC

USA . 6 parts In-Stock

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Standard Data Resources

USA . 2 parts In-Stock

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Distributors (Availability)

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Component Stockers USA

USA . 4,741 parts In-Stock

1+ parts

$2.880

100+ parts

$2.740

1k+ parts

$2.650

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4,741

$2.880

$2.740

$2.650

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Corphita

USA . 3,415 parts In-Stock

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$5.778

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$5.778

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Corohmni

South Africa . 2,142 parts In-Stock

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$18.088

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$18.088

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Parana Technologies

USA . 805 parts In-Stock

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$55.457

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$55.457

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DigiPath Technology Company

USA . 1,971 parts In-Stock

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$61.065

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$61.065

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ChromeModa Solutions

Germany . 6,505 parts In-Stock

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$62.311

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$51.095

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6,505

$62.311

$51.095

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IDEA Electronic Components Group

UK . 611 parts In-Stock

1+ parts

$62.311

100+ parts

$59.195

1k+ parts

$56.080

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611

$62.311

$59.195

$56.080

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Perfect Parts

USA . 4,833 parts In-Stock

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Assy Fe

Spain . 2,627 parts In-Stock

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Kepictronics

USA . 2,440 parts In-Stock

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Microchip USA

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Overview

Upgrade your electronic devices with the TP3465V from Texas Instruments, a high-quality microprocessor circuit that offers unmatched performance and reliability. Manufactured by industry leader Texas Instruments, this chip carrier package features a square shape and is designed for easy surface mounting. With a supply voltage range of 4.75V to 5.25V, this versatile IC is perfect for a wide range of applications in various industries. Experience the benefits of Texas Instruments technology with the TP3465V, providing value and efficiency for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides good durability and protection for the internal components of the product.

Surface Mount: YES

Surface mount capability makes it easier and more convenient to mount the product onto PCBs, saving time and effort during installation.

Maximum Supply Voltage: 5.25 V

High maximum supply voltage allows for flexibility in power input options, making the product suitable for a variety of applications.

Package Shape: SQUARE

Square package shape is often more space-efficient and easier to integrate into designs compared to other shapes.

Power Supplies (V): 5

5V power supplies are commonly available and widely used, ensuring compatibility with many existing systems and components.

No. of Terminals: 28

Having 28 terminals provides ample connectivity options for interfacing with other devices and peripherals.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers good heat dissipation and protection, making it suitable for handling high-performance applications.

Minimum Supply Voltage: 4.75 V

Low minimum supply voltage requirement allows for operation in systems with varying power sources, enhancing versatility.

Maximum Operating Temperature: 70 °C

High maximum operating temperature rating ensures reliable performance even in demanding environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature indicates the product can function in a wide range of temperature conditions, enhancing its usability.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and reliability in electronic connections.

Terminal Position: QUAD

Quad terminal position facilitates secure and stable mounting onto PCBs, reducing the risk of connectivity issues.

Maximum Seated Height: 4.57 mm

Low maximum seated height helps in compact designs and reduces the overall profile of the product.

Width: 11.43 mm

11.43 mm width ensures compatibility with standard spacing requirements in PCB layouts.

Peak Reflow Temperature °C: 245

High peak reflow temperature tolerance indicates good soldering and assembly capabilities for manufacturing processes.

Length: 11.43 mm

11.43 mm length provides a balanced form factor for integration into electronic devices.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates suitability for typical commercial applications with moderate temperature ranges.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit peripheral IC type offers advanced processing capabilities, making the product suitable for sophisticated functions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Terminal Form: J BEND

J bend terminal form ensures secure electrical connections and ease of soldering during assembly.

Nominal Supply Voltage: 5 V

5V nominal supply voltage is a standard and widely supported voltage level in electronics, ensuring compatibility with various systems.

Terminal Pitch: 1.27 mm

1.27 mm terminal pitch allows for fine spacing and close integration on PCBs, optimizing the layout and design of the product.

Moisture Sensitivity Level (MSL): 2A

MSL 2A indicates moderate moisture sensitivity, making the product suitable for manufacturing and storage in typical atmospheric conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TP3465V attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.43 mm

Moisture Sensitivity Level (MSL):

2A

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

245

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Parallel IO Port

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.43 mm

Peripheral IC Type:

Trade Compliance

TP3465V Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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