Loading...

TMX27C512-20JL

Texas Instruments

TMX27C512-20JL by Texas Instruments

TMX27C512-20JL EPROM by Texas Instruments features 64KX8 organization, 5V supply voltage, and 200 ns access time. It is used for storing data in applications requiring fast read/write operations and offers a memory density of 524288 bits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,513 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,513

-

-

-

-

Digiode

USA . 4,645 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,645

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,484 parts In-Stock

1+ parts

$1.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,484

$1.000

-

-

-

Parana Technologies

USA . 1,046 parts In-Stock

1+ parts

$2.961

100+ parts

-

1k+ parts

$3.461

10k+ parts

-

1,046

$2.961

-

$3.461

-

DigiPath Technology Company

USA . 1,878 parts In-Stock

1+ parts

$3.260

100+ parts

$3.000

1k+ parts

-

10k+ parts

-

1,878

$3.260

$3.000

-

-

IDEA Electronic Components Group

UK . 2,099 parts In-Stock

1+ parts

$3.327

100+ parts

-

1k+ parts

$2.994

10k+ parts

-

2,099

$3.327

-

$2.994

-

ChromeModa Solutions

Germany . 1,488 parts In-Stock

1+ parts

$3.327

100+ parts

$2.728

1k+ parts

-

10k+ parts

-

1,488

$3.327

$2.728

-

-

AZTECH Wire

Italy . 791 parts In-Stock

1+ parts

$11.760

100+ parts

-

1k+ parts

-

10k+ parts

-

791

$11.760

-

-

-

One Stop Electronics

USA . 292 parts In-Stock

1+ parts

$22.000

100+ parts

-

1k+ parts

-

10k+ parts

-

292

$22.000

-

-

-

Semicontronic

India . 146 parts In-Stock

1+ parts

$29.000

100+ parts

$28.275

1k+ parts

$28.130

10k+ parts

-

146

$29.000

$28.275

$28.130

-

Corphita

USA . 1,721 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,721

-

-

-

-

Corohmni

South Africa . 302 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

302

-

-

-

-

Overview

Upgrade your electronic devices with the TMX27C512-20JL EPROM by Texas Instruments, known for its superior quality and reliability. This innovative memory solution offers fast access times and high memory density, making it ideal for a wide range of applications in the commercial sector. With its advanced technology and 3-state output characteristics, this EPROM provides exceptional value and performance for all your memory needs. Trust Texas Instruments to deliver cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed material provides durability and protection for the EPROM, ensuring reliability in various operating conditions.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage level of 5V makes it compatible with many systems and easy to integrate.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for flexible timing and communication within the system, enhancing overall performance.

Organization: 64KX8

Organized as 64Kx8 helps in efficient data storage and retrieval, making it suitable for various applications requiring such memory layout.

Memory Density: 524288 bit

High memory density allows for storing a large amount of data in a compact space, making it a cost-effective solution.

Technical Specifications

EPROM TMX27C512-20JL attributes and parameters. Explore more EPROM devices from Texas Instruments

Specs

Maximum Access Time:

200 ns

JESD-30 Code:

R-GDIP-T28

Memory Density:

524288 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

64KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

5.84 mm

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

TMX27C512-20JL Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 7