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TMS32C6416EZLZA6E3

Texas Instruments

TMS32C6416EZLZA6E3 by Texas Instruments

TMS32C6416EZLZA6E3 by Texas Instruments is a 32-bit DSP with integrated cache, operating at 75.18 MHz clock frequency. Widely used in industrial applications for signal processing tasks due to its 64 external data bus width and low power mode feature. It has a max supply voltage of 1.44 V and operates within the temperature range of -40 to 105 °C.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 1,998 parts In-Stock

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Digiode

USA . 1,281 parts In-Stock

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AZTECH Wire

Italy . 749 parts In-Stock

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$16.995

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One Stop Electronics

USA . 1,302 parts In-Stock

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$43.618

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$39.304

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Parana Technologies

USA . 2,050 parts In-Stock

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Corohmni

South Africa . 61 parts In-Stock

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DigiPath Technology Company

USA . 1,913 parts In-Stock

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$67.170

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ChromeModa Solutions

Germany . 1,584 parts In-Stock

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IDEA Electronic Components Group

UK . 93 parts In-Stock

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Microchip USA

USA . 1,721 parts In-Stock

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$177.650

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Corphita

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Overview

Experience cutting-edge technology with the TMS32C6416EZLZA6E3 by Texas Instruments. As a leading manufacturer in the industry of Digital Signal Processors (DSPs), Texas Instruments delivers superior quality and reliability. This powerful processor, with integrated cache and advanced features, is designed to meet the demands of various applications. Unlock limitless possibilities and enhance your projects with this high-performance DSP. Choose Texas Instruments for unparalleled value and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, ideal for portable and long-lasting applications.

Integrated Cache: YES

Having an integrated cache enhances the speed and efficiency of the product by providing quick access to frequently used data and instructions.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 1.44 V

The high maximum supply voltage ensures reliable and stable operation of the product under varying input voltage conditions.

Address Bus Width: 32

A wide address bus width of 32 allows for efficient memory addressing and data transfer, improving overall performance.

Package Shape: SQUARE

The square package shape is compact and space-efficient, making it suitable for applications where size constraints are a concern.

Bit Size: 32

With a bit size of 32, the product can process data in chunks of 32 bits, enabling high-speed computation and data manipulation.

Power Supplies (V): 1.4,3.3

Support for multiple power supply voltages (1.4V and 3.3V) allows for flexibility in powering the product according to different application requirements.

No. of Terminals: 532

Having a high number of terminals (532) provides ample connectivity options for interfacing with external components and peripherals.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

The package style options of grid array, heat sink/slug, and fine pitch offer versatility in mounting and cooling solutions, catering to diverse application needs.

Minimum Supply Voltage: 1.36 V

The low minimum supply voltage ensures that the product can operate efficiently even with low input voltage levels, enhancing its versatility.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C allows the product to withstand elevated temperatures, making it suitable for industrial environments.

No. of External Interrupts: 4

Having 4 external interrupts enables the product to efficiently handle external events and prioritize tasks, enhancing system responsiveness.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance even in cold environments, increasing the product's robustness.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish of tin/silver/copper provides excellent corrosion resistance and conductivity, ensuring reliable electrical connections over time.

Terminal Position: BOTTOM

Bottom terminal position simplifies the PCB layout and facilitates easier soldering and connection of the product in the application circuit.

Maximum Seated Height: 3.3 mm

The relatively low maximum seated height of 3.3mm allows for a compact overall system design, especially in space-constrained applications.

RAM Words: 16384

The ample RAM capacity of 16384 words enables efficient data storage and access, supporting complex algorithms and multitasking operations.

Width: 23 mm

The moderate width of 23mm makes the product suitable for various board sizes and layouts, offering flexibility in integration.

Boundary Scan: YES

Boundary scan capability simplifies testing, debugging, and troubleshooting of the product during development and production stages.

External Data Bus Width: 64

A wide external data bus width of 64 facilitates fast data transfer between the product and external devices, enhancing overall system performance.

Maximum Clock Frequency: 75.18 MHz

The high maximum clock frequency of 75.18 MHz allows for rapid data processing and execution of instructions, improving overall system speed.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures reliable solder joints and thermal stability during the manufacturing process.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data throughput and communication efficiency within the product, optimizing performance and response times.

Length: 23 mm

The compact length of 23mm contributes to a space-saving design, making the product suitable for compact and portable applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation over a wide temperature range, making the product suitable for industrial applications with demanding thermal conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The product's designation as a digital signal processor (DSP) and other peripheral IC type highlights its versatility and capability in handling digital signal processing tasks efficiently.

No. of Timers: 3

Having 3 timers allows for efficient time management and synchronization of tasks within the product, enhancing functionality and control capabilities.

Technology: CMOS

The use of CMOS technology provides low power consumption, high speed, and compatibility with a wide range of applications, making the product energy-efficient and versatile.

Terminal Form: BALL

The terminal form of balls enables easy and reliable connections with the PCB, ensuring good electrical contact and mechanical stability in the application.

Maximum Supply Current: 125 mA

The moderate maximum supply current requirement of 125mA ensures efficient power usage and minimal heat dissipation, contributing to energy efficiency.

Nominal Supply Voltage: 1.4 V

The nominal supply voltage of 1.4V provides optimal operating conditions for the product, balancing performance and power consumption effectively.

No. of DMA Channels: 64

The high number of DMA channels (64) enables efficient data transfer and communication with external devices, enhancing overall system performance and throughput.

Terminal Pitch: 0.8 mm

The fine terminal pitch of 0.8mm allows for high-density mounting and space-efficient PCB layout, enabling compact system designs and reducing overall footprint.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations, reduces computational complexity, and enhances processing speed, making the product suitable for real-time signal processing applications.

Moisture Sensitivity Level (MSL): 4

The moisture sensitivity level of 4 indicates the product's robustness against moisture damage during handling, storage, and assembly processes, ensuring long-term reliability.

Low Power Mode: YES

The low power mode feature allows the product to conserve power during idle or low-load periods, extending battery life and reducing overall energy consumption.

Technical Specifications

Digital Signal Processors (DSPs) TMS32C6416EZLZA6E3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3VI/O SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.18 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

532

No. of Timers:

3

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

125 mA

Maximum Supply Voltage:

1.44 V

Minimum Supply Voltage:

1.36 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS32C6416EZLZA6E3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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